Date: Wed, June 13, 2018

Time: 2:00PM Eastern

Duration: 60 Minutes

Abstract:

Ground bounce is a common problem in packages, connectors and circuit boards. And it gets worse with shorter rise times. This insidious problem can cause enough cross talk to break almost any product.

In this webinar, we will look at the principles behind the root cause of ground bounce, how we can measure the ground bounce in your system, and based on the root cause, how we can design ground bounce out of your next product.

Presenter:

Dr. Eric Bogatin

Signal Integrity Evangelist Teledyne LeCroy

Can't attend the live? Register anyway and we will send you the recording and slides afterward.