FormFactor - Cascade PMC200 - 200 mm manual cryogenic probe system
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Intuitive, manual drives
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Front loading capability through load door
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for chuck
See more Key Options in Specifictions & Details tab
Advanced manual cryogenic wafer probing < 7 K
The PMC200 is a highly-precise, advanced manual probe system for wafers and substrates up to 200 mm in a high vacuum environment, at cryogenic temperatures down to 77 K with liquid nitrogen or < 7 K with liquid helium. Designed for educational and industrial environments, it supports a wide range of applications, including DC and RF measurements of the latest silicon, compound semiconductor and superconductor devices, MEMS and optoelectronic tests.
Applications
- IV/CV
- MEMS
- Opto
- RF/mmW/THz
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Accessories available, such as black bodies and optical motion analysis tools
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
Stability
- Independently cooled cold shield
- Probe positioners placed inside vacuum chamber
- Short and stable probe arms
- Solid station frame with built-in vibration-isolation
- Optional microscope bridge
- Optional upgrade for 300 mm wafer
- Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 7 K (liquid helium)
- Precise probe positioning
- Excellent measurement accuracy and repeatability
- Superior vibration attenuation
- Stable image quality for high-resolution microscopes
Ease of Use
- Intuitive, manual drives
- Front loading capability through load door
- Comfortable and easy operation
- Quick and ergonomic change of DUT
High measurement throughput
- Independent control of linear chuck stage and positioners
- Contact/separation stroke for chuck
- Fast, manual step-and-repeat testing of the whole wafer
- Simultaneous contacting and separation of all probes
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More Product Information
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Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
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Application flexibility, ideal for use in high frequency applications
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Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
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Suitable for integration with vibration isolating tables
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Thermal range: -60˚C to 300˚C available
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Upgrade path to meet your future needs
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Stable and repeatable measurements over a wide thermal range
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Advanced EMI-shielding with PureLine with AttoGuard technologies
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Best solution for low-noise and 1/f measurements
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Minimize AC and spectral noise
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Minimizes settling times for efficient measurements, without compromising accuracy over full thermal range
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Locking roll-out stage
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Innovative microscope remote control
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Intuitive ergonomic stage controls
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Quick, safe, and comfortable wafer access
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Easy on-wafer navigation
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Fast setup and test data gathering
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Dedicated Velox version for manual probe stations
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AugmentedAlign tool with on screen markers for improved RF measurement accuracy
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Proven technology: designed in conjunction with several top STM groups in the world
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Quiet, low vibration operation
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Low running costs and reduced maintenance
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Easy operation and fast cool-down; load sample when the system is cold for TL models
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Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate
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Ideal for multiport RF/Microwave and high-speed digital signal testing
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Mix DC and RF/Microwave signals on one probe
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Long lifetime – typically over one million (1,000,000) touchdowns
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Excellent performance in temperatures ranging from 10 K to 200°C
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Probe on any pad material with no damage
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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