FormFactor - HPD Model HE-3-SSV - Wet Helium-3 Cryostat
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Customizable sample space to fit the user’s application
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Long holding time: 100 hours for six (6) STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line; +/- 0.5 mK at base temperature
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Low noise
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
The Model HE-3-SSV insert is designed for standard sample loading with the sample in vacuum. The sample is typically attached at the bottom of the He-3 pot inside the inner vacuum chamber (IVC) for cooling. The system design minimizes the intrinsic heat leak to the He-3 pot and optimizes the performance, resulting in a cost effective He-3 cryostat that is extremely reliable and easy to operate. The Model HE-3-SSV is designed to be compatible with all kinds of superconducting magnets, such as solenoid, vector magnets, and more.
The He-3 insert can be operated with the 1 K pot pump turned off after it reaches the base temperature. In this case, the system will be extremely quiet, which is highly desirable for many applications. This unique feature also reduces the liquid helium consumption and makes the operation more cost effective.
This He-3 insert includes the following components:
- Charcoal sorption pump with heater and thermometer
- 1 K pot with thermometer
- He-3 pot with heater and thermometer
- Permanently stored He-3 gas
- IVC can
- Operation test
More Product Information
- Choice of 4 GHz or 6 GHz bandwidth models
- Up to 5 Vpk-pk dynamic range with low noise
- ±3 V offset range
- Low loading and high impedance for minimal signal disturbance
- Ideal for DDR2, DDR3, LPDDR2
- Deluxe soft carrying case
- Innovative QuickLink architecture
- Wide variety of tips and leads
- Solder-In Lead
- Optional Positioner (Browser) Tip
- Quick Connect Lead
- Square Pin Lead
- HiTemp Solder-In Lead
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
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Versatile temperature range for extreme environments
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IEEE 1588 PTP
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Power over Ethernet
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P-Iris and DC-Iris lens control
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Near-Infrared (GT2050NIR) model
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GigE Vision interface with Power over Ethernet
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Screw mount RJ45 Ethernet connector for secure operation in industrial environments
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Supports cable lengths up to 100 meters (CAT-5e or CAT-6)
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Trigger over Ethernet (ToE) Action Commands allow for a single cable solution to reduce system costs
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Comprehensive I/O functionality for simplified system integration
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Popular C-Mount lens mount
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Easy camera mounting via standard M3 threads or optional tripod adapter
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Easy software integration with Allied Vision's Vimba SDK and compatibility to the most popular third party image-processing libraries.
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Defect pixel masking feature with the Defect Mask Loader tool that allows you to manage a user defined defective pixel list to match your application and optimize the life cycle of the camera.
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Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
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Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
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LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
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Automatic load inductance compensation function ensures the most repeatable calibrations
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Easy to use Probe to ISS/CSR matching tool
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Additional remoting methods
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Interface with Velox™ over LAN
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Can help to stabilize oscillations in high-gain devices
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Impedance match to low dynamic resistance laser diodes
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Custom configured for your application
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IMX226 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-1240m) and color (1800 C-1240c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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IMX273 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-158m) and color (1800 C-158c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
See more Key Features on Specifications & Details tab
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Proven technology: designed in conjunction with several top STM groups in the world
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Quiet, low vibration operation
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Low running costs and reduced maintenance
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Easy operation and fast cool-down; load sample when the system is cold for TL models
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Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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