Teledyne DALSA - Genie Nano-CXP Compact CoaXPress Cameras
- Uses standard PC Ethernet port & hardware
- Supports cable lengths up to 100 m (CAT-5e or CAT-6)
- Simplified set-up with field proven Sapera LT software featuring CamExpert
- Engineered to accommodate industrial environment with a ruggedized screw mount RJ-45 connector
Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading-edge high-resolution CMOS image sensors.
In resolutions from 16 to 67 megapixels, Genie Nano-CXP ensures robust build quality, wide operating temperature, and an unmatched feature set — all at an incredible price.
Speed & Quality Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors. In resolutions from 16 to 67 megapixels, Genie Nano-CXP ensures robust build quality, wide operating temperature, and an unmatched feature set—all at an incredible price.
Typical Applications Semiconductor wafer inspection Surface and bump inspection Electronics manufacturing 3D solder paste inspection Package and bump inspection Automated Optical Inspection (AOI) Solar panel inspection General machine vision And more!
Ultimate performance with Xtium-CXP PX8 Unleash the maximum from Genie Nano-CXP cameras with our Xtium™-CXP frame grabber. Supporting four input channels of up to 6.25 Gb/s, the Xtium-CXP takes full advantage of PCIe Gen 2.0 platform to deliver host transfer bandwidth up to 3.4 GB/s using PCIe x8 slots. By enabling maximum sustained throughput and ready-to-use image data, the Xtium series minimizes CPU usage and improves processing times for the host applications.
Family Specifications
|
Camera Type |
Area Scan |
|---|---|
|
Sensor Technology |
CMOS |
|
Supported Interfaces |
CoaXPress |
|
Spectrum Capability |
Visible (400-700 nm), Near Infrared (700-1000 nm) |
|
Shutter Type |
Global Shutter |
Models
|
Model Number |
MP |
FPS |
Pixel Size (μm) |
Interface |
Spectrum |
|---|---|---|---|---|---|
|
16.7 |
120 |
4.5 |
CoaXPress |
Color |
|
|
26.2 |
80 |
4.5 |
CoaXPress |
Color |
|
|
37.7 |
43 |
2.5 |
CoaXPress |
Color |
|
|
67.1 |
30 |
2.5 |
CoaXPress |
Color |
|
|
16.7 |
120 |
4.5 |
CoaXPress |
Mono |
|
|
16.7 |
120 |
4.5 |
CoaXPress |
Mono, NIR |
|
|
26.2 |
80 |
4.5 |
CoaXPress |
Mono |
|
|
26.2 |
80 |
4.5 |
CoaXPress |
Mono, NIR |
|
|
37.7 |
43 |
2.5 |
CoaXPress |
Mono |
|
|
67.1 |
30 |
2.5 |
CoaXPress |
Mono |
More Product Information
- Industry’s latest CMOS image sensors
- Simplified set-up with field proven Sapera LT software featuring CamExpert
- Engineered to accommodate industrial environment with a ruggedized screw mount SDR connectors
- GenICan GenCP compliant
- Latest Global and Rolling Shutters sensors from Sony® - from 2 to 12 MP
- USB3 Vision interface
- Compact fully-enclosed design with features needed by modern vision systems
- Provide advanced vision performance while using less power, less space, and fitting increasingly tight industry budgets
-
Compact probe head
-
Supports fine pitch SMD probing
-
Rugged, Sharp tip
-
HF optimized connection accessories
-
Over 30 accessories
-
Low input capacitance
- Reduced dark noise levels and improved dark offset
- Improved sensitivity, including NIR response
- In-camera image pre-processing (lens shading correction, pixel correction)
- Large full well when using in-sensor binning >142Ke
- Thousands of frames per second in Partial Scan Mode (ROI)
- Multi-ROI support (up to 32 ROI) and Cycling Mode
- Advanced Sequencer functions of different features
-
Teledyne e2v Sapphire CMOS sensor
-
Switchable shutter modes
-
Power over Ethernet
-
60 fps at full resolution
-
Monochrome (G-192B) and color (G-192C) models
-
GigE Vision interface with Power over Ethernet
-
Screw mount RJ45 Ethernet connector for secure operation in industrial environments
-
Supports cable lengths up to 100 meters (CAT-6 recommended)
-
Comprehensive I/O functionality for simplified system integration
-
Popular C-Mount lens mount
-
Easy camera mounting via standard M3 threads on top and bottom of housing or optional tripod adapter
-
Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
-
Defect pixel masking feature with the Defect Mask Loader tool that allows you to manage a user defined defective pixel list to match your application and optimize the life cycle of the camera.
-
Select between B 270 ASG protection glass and filter types: Jenofilt 217 IR cut filter, Hoya C-5000 IR cut filter, RG715 IR pass filter, or RG830 IR pass filter
- Choice of 4 GHz or 6 GHz bandwidth models
- Up to 5 Vpk-pk dynamic range with low noise
- ±3 V offset range
- Low loading and high impedance for minimal signal disturbance
- Ideal for DDR2, DDR3, LPDDR2
- Deluxe soft carrying case
- Innovative QuickLink architecture
- Wide variety of tips and leads
- Solder-In Lead
- Optional Positioner (Browser) Tip
- Quick Connect Lead
- Square Pin Lead
- HiTemp Solder-In Lead
- Up to 4 GHz Bandwidth
- ±60 V Offset Capability
- ±800 mV Dynamic Range
- 50 kΩ DC Input Impedance
- 1.2x Attenuation for low additive noise
- MCX terminated cable with wide variety of connections:
- Solder-in (4 GHz)
- Coaxial Cable to U.FL receptacle (3 GHz)
- MCX PCB Mount (4 GHz)
- Browser (500 MHz)
- ProBus Interface
- Four operating modes: – CC, CV, CR, CP
- Static, Dynamic and Sequence mode support
- Built in Application Functions - Short Circuit Test, Battery Test Mode, CR-LED Mode, OCP and OPP Test
- Provides a load of up to 300 Watts
- Programmable and analog external control
- DigRF v4 Decodes
- Low-speed (26 Mb/s)
- Medium-speed (1248 Mb/s)
- High-speed (1456 Mb/s)
- DigRF v3 Decodes
- Low-speed (6.5 Mb/s)
- Medium-speed (26 Mb/s)
- High-speed (312 Mb/s)
- Convert DigRF 3G and v4 I and Q digital data to corresponding analog waveforms
- Correlate analog waveforms with protocol decode on one screen
- View decoded data in hexadecimal format
- Decode information expands as the time base is adjusted or zoomed
- Convenient table display with quick “Zoom to byte” capability
- Quick search capability for specific message packets
Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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