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Our White High Intensity Linear Backlights offer 540 kLux output, perfect for back-lit, line-scanning applications.
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Available in pre-engineered sizes from 6” (152mm) to 96” (2438mm) in 6″ increments.
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A 3″ (75mm) length option is also available. Available intensity control provides illuminance adjustability for every 6″ increment via a 0 – 10v input.
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Available in white only. For additional wavelengths please refer to our BL138 series.
Teledyne DALSA - Linea SWIR InGaAs GigE Camera
Linea SWIR features a cutting-edge InGaAs sensor in a compact package that is suitable for a wide variety of applications. With exceptional responsivity and low noise, this camera allows customers to see their products like never before. Linea SWIR is available as a 1k resolution camera with highly responsive 12.5 µm pixels, or a 512 resolution camera with larger 25 µm pixels.
Cutting-edge InGaAs Sensor
Like all Lineas, Linea SWIR shares the robust build quality and advanced functionality that is part of Teledyne DALSA’s unmatched line scan heritage. Linea SWIR is packed with features to make your machine vision job easier, including high speed, high sensitivity, cycling mode, and programmable I/Os. The versatile Linea SWIR is ideal for applications such as optical sorting, solar panel inspection, and general purpose machine vision.
Why SWIR? To see what visible can't.
Example: Linea SWIR sees right through silicon to image the target on the back of the wafer
Example: Food Sorting Application. Linea SWIR enables more efficient detection.
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Detection Capabilities: Moisture Content Bruising Foreign Objects |
Benefits: Increase Yield Reduce Waste Improve Quality |
SWIR Application Lab
Wondering if Short Wave Infrared (SWIR) inspection can work for you? Finding out is simple.
Our SWIR Application Lab is here – A dedicated lab for testing materials for inspection and learning if SWIR imaging will provide value.
- Send us your samples.
- We scan them using SWIR.
- You get the results.
We are now accepting your sample materials to run through our SWIR Lab for free testing.
Family Specifications
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Camera Type |
Line Scan |
|---|---|
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Sensor Technology |
CMOS |
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Supported Interfaces |
GigE Vision |
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Spectrum Capability |
Short-Wave Infrared (950-1700 nm) |
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Features |
Power over Ethernet (PoE) |
Models
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Model Number |
Resolution |
Spectrum |
Interface |
Pixel Size (μm) |
Max Line Rate |
|---|---|---|---|---|---|
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1024 x 1 |
NIR |
1 GigE |
12.5 |
40 kHz |
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512 x 1 |
NIR |
1 GigE |
25 |
40 kHz |
More Product Information
- Long cable lengths at maximum image acquisition rates
- Data forwarding rate for distributed image processing
- Fully supported by Sapera Vision Software SDKs
- Highest resolution – 12 bits all the time
- More channels, flexibility – 8 analog and 16 digital channels
- Longest Memory – 5 Gpt records with simple navigation – no compromise
- View 16 channels on one display with OscilloSYNC™
- Powerful, deep toolbox enables and simplifies complex analysis
- MAUI with OneTouch user interface for intuitive and efficient operation
- Zone Trigger – Simple Triggering for Complex Signals
- High Power Density: 600 watts in 1U (1.75 inches) high, half rack (8.5 inches) wide; no top or bottom clearance spacing required.
- Near Linear Ripple & Noise Ripple as low as 2.5mV rms, noise as low as 15mV p-p.
- Remote Control
- LXI Compliant Ethernet LAN / RS-232C (16 bit)
- IEEE-488.2 / RS-232C (12 bit)
- Standard analog programming 0-5V, 0-10V, or 0-5kΩ.
- Global shutter and rolling shutter CMOS sensors available
- USB3 Vision
- High sensitivity with both front and back illuminated sensors (BSI)
- Side mounted USB connectors for ease of use in OEM solutions
- High sensitivity with pixel sizes from 2 µm to 3.45 µm
- Windows operating system and Linux SDKs (for embedded vision systems)
- 3-Year Warranty
- Ideal for engineering lab use
- Digital features with analog controls
- Remote control for bench, system & ATE applications.
- "P" models have RS-232, USB & LAN (LXI compliant, class C) standards.
- S-Lock: Set and lock the voltage.
- V-Span: user-defined voltage limits
- Small benchtop footprint
- PowerFlex design provides higher currents at lower voltages enabling one model to meet many different voltage/current requirements.
- Compact design for bench use or rack mounting (1/2 or 1/4 rack width)
- True analog controls with digital settings locking (S-Lock)
- Mixed-mode regulation with linear final regulation for low noise
- Dual models have isolated voltage tracking and synchronous on/off.
- P models have RS-232, USB, and LXI-compliant LAN interfaces plus duplicate rear terminals. GPIB Optional.
- 1 - 6 GHz, 40dB Gain, 2.5dB N.F.
- Compensation long cable loss for EMI Measurement
- Improve system noise floor flatness
- High EMI performance
- High linearity LNA for EMI measurement
- High dynamic range
- Unconditionally Stable
- State-of-the-Art Technology
- Dual Voltage ranges that support over voltage testing on 480V based systems
- Instrument Setups for quickly re-establishing the known instrument state
- 500uS time resolution for Transients
- Virtual Panels control software included
- Non-Linear current waveform programming during Load mode
- Phase coordination among multiple units (LKM/LKS)
- Powerful set of analog controls for PHIL and Modulation tests
- Trigger In & Out to permit extensive coordination with external systems
- Extensive Onboard diagnostics
- Digital I/O, including RS232, USB, Ethernet (GPIB optional)
- Intuitive 5” color display for ease of navigation
- Auto-paralleling for maximum flexibility with multi-chassis configurations
- Separate terminal blocks for single-phase and three-phase AC outputs
Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
