-
Pre-Engineered Scalability Enables Customized Emitting Lengths in 2″ Increments to 20″
-
Intense, Diffuse Lighting with 226 kLux at Emitting Surface
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Multiple Available Wavelengths, Including Visible Monochromatics, Infrared, and White
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Available Washdown Option for Difficult Environments
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Can be Applied in Backlighting or Diffuse Front Lighting Geometries
Teledyne DALSA - LT Series Board Level USB3 Vision Board Level Cameras
- Latest Global and Rolling Shutters sensors from Sony® - from 2 to 12 MP
- USB3 Vision interface
- Compact fully-enclosed design with features needed by modern vision systems
- Provide advanced vision performance while using less power, less space, and fitting increasingly tight industry budgets
The Lt Series Board Level Cameras offer a smaller, lighter, and lower cost imaging solution. Equipped with the latest rolling shutter Starvis™ CMOS sensors and global shutter Pregius™ CMOS sensors from Sony®. They range in resolution from 1.7 – 12 megapixels providing the flexibility to meet the requirements of a wide variety of imaging systems. These Board Level Cameras are designed specifically to meet the challenges of today’s embedded systems with design considerations such as, connectors on the side of each camera so applications can take advantage of shorter cable lengths, and a flat-back design that minimizes the space required for vision systems.
Models
|
Model Number |
MP |
FPS |
Pixel Size (μm) |
Spectrum |
Sensor |
|---|---|---|---|---|---|
|
1.7 |
96 |
9 |
Color |
Sony IMX432 |
|
|
2 |
86 |
4.5 |
Color |
Sony IMX430 |
|
|
2.1 |
60 |
2.9 |
Color |
Sony IMX327 |
|
|
2.3 |
162 |
3.45 |
Color |
Sony IMX392 |
|
|
3.1 |
55 |
3.45 |
Color |
Sony IMX265 |
|
|
5.1 |
35 |
3.45 |
Color |
Sony IMX264 |
|
|
7.1 |
50 |
4.5 |
Color |
Sony IMX428 |
|
|
8.2 |
44 |
2 |
Color |
Sony IMX334 |
|
|
12.3 |
22 |
3.45 |
Color |
Sony IMX304 |
|
|
8.9 |
31 |
3.45 |
Color |
Sony IMX267 |
|
|
1.7 |
96 |
9 |
Mono |
Sony IMX432 |
|
|
2 |
86 |
4.5 |
Mono |
Sony IMX430 |
|
|
2.3 |
162 |
3.45 |
Mono |
Sony IMX392 |
|
|
3.1 |
55 |
3.45 |
Mono |
Sony IMX265 |
|
|
5 |
35 |
3.45 |
Mono |
Sony IMX264 |
|
|
7.1 |
50 |
4.5 |
Mono |
Sony IMX428 |
|
|
8.2 |
44 |
2 |
Mono |
Sony IMX334 |
|
|
12.3 |
22 |
3.45 |
Mono |
Sony IMX304 |
|
|
8.9 |
31 |
3.45 |
Mono |
Sony IMX267 |
More Product Information
- Allows TekProbe interface level II probes to work with any ProBus-equipped Teledyne LeCroy oscilloscope
- Automatic probe detection
- Provides all necessary power and offset control to the attached probe
- Supports probes up to 4 GHz
- Easy firmware updates
- Wide variety of probes supported including: Preamplifiers, Current Probes, Single-Ended Active Probes and Differential Active Probes
- Three independent, isolated 1700W DC outputs, 5100W total
- 1U rack-mount chassis
- 9 output options
- Multi-language, intuitive, color touch panel control
- Global 3-Phase AC Input options for system phase balancing
- Active power factor correction (PFC)
- Multi-channel programmable sequencing, ramps, and delays
- Full remote control via Virtual Panels™ GUI
- Standard LXI Ethernet, USB, and RS232 control interfaces
- Optional GPIB control interface or isolated analog programming
Southwest Microwave offers a broad family of SSBP multi-coax contacts and assemblies to address RF/microwave packaging miniaturization and flexibility challenges. These push-on coax contacts simplify interconnections and cabling while offering greater system reliability than the alternative of mating a large array of standard coax connectors. These SSBP coax contacts were designed to fit into standard off-the-shelf MIL-DLT-38999 and MIL-DTL-24308 D-Sub connectors and are interchangeable with standard signal contacts available in 20 HD, 20, 16, 12, 8 sizes to accommodate a variety of performance requirements.
Contact us for flexible cable assemblies and harnesses for OTS MIL-DTL-38999 series I, II, III, and IV or MIL-DTL-24308 D-sub connectors. All size 20 contacts are sold on cables.
- 100 MHz, 200 MHz, 350 MHz, 500 MHz and 1 GHz bandwidths
- Up to 4 GS/s sample rate
- Long Memory – up to 20 Mpts
- 10.1” capacitive touch screen display
- 16 Digital Channel MSO option
- MAUI - Most Advanced User Interface
- Designed for Touch
- Built for Simplicity
- Made to Solve
- Advanced Anomaly Detection
- Fast Waveform Update
- History Mode - Waveform Playback
- WaveScan - Search and Find
- Multi-Instrument Capabilities
- Protocol Analysis - Serial Trigger and Decode
- Waveform Generation - Built-in Function Generator
- Digital Voltmeter and Frequency Counter
- Future Proof
- Upgradeable Bandwidth
- Field Upgradable Software and Hardware Options
- Low noise
- Excellent line⁄load regulation
- Coarse and fine voltage controls
- Constant voltage or constant current operation with automatic crossover and mode indication
- Individual ON⁄Off switch per output (not including fixed output)
- Switchable 3.3V⁄5V output on triple output model
- Switchable remote sense (XPH 1810 and XPH 4210 models)
- Highest resolution – 12 bits all the time
- More capability – integrates multiple instruments into one
- Comprehensive probe support – supports over 30 probes in 9 categories
- MAUI with OneTouch user interface for intuitive and efficient operation
- The Linear Coaxial Light provides a type of diffuse illumination; diffuse light from an internal source is folded downwards along the camera’s imaging axis and onto the imaging plane.
- High speed machine vision line scan applications receive greater image contrast with a Linear Coaxial Light.
- The DL110 includes a high efficiency, coated, easy to clean dust cover to protect the beamsplitter.
Teledyne DALSA
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
