Dualos LCF Shipping Caps

Product Overview:

All caps ship with Skydrol (BMS3-11) Compatible O-ring Seal. Parts in compliance with all SMOT document requirements.

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PART NUMBER PORT SIZE THREAD END
NEO 921F-A-04
NEO 921F-A-06
NEO 921F-A-08
NEO 921F-A-10
NEO 921F-A-12
NEO 921F-A-16
NEO 921F-A-20
 
NEO 925F-A-04
NEO 925F-A-06
NEO 925F-A-08
NEO 925F-A-10
NEO 925F-A-12
NEO 925F-A-16
NEO 925F-A-20
4
6
8
10
12
16
20
 
4
6
8
10
12
16
20
0.4375-20 UNJF Class 3B
0.5625-18 UNJF Class 3B
0.7500-16 UNJF Class 3B
0.8750-14 UNJF Class 3B
1.0625-12 UNJ Class 3B
1.3125-12 UNJ Class 3B
1.6250-12 UNJ Class 3B
 
0.4375-28 UNJEF Class 3B
0.5625-24 UNJEF Class 3B
0.7500-20 UNJEF Class 3B
0.8750-20 UNJEF Class 3B
1.0625-18 UNJEF Class 3B
1.3125-16 UNJ Class 3B
1.6250-16 UNJ Class 3B

More Product Information

All caps ship with Skydrol (BMS3-11) Compatible O-ring Seal. Parts in compliance with all SMOT document requirements.

All plugs ship with Skydrol (BMS3-11) Compatible O-Rings, Viton® Cuff and Four Metal Clamps. Parts in compliance with all SMOT document requirements.

Built for extreme environments, our IP69K certified lights are specifically engineered to withstand everything from prolonged liquid immersion to high-pressure steam cleaning and corrosive washdown solutions.

  • Reconfigurable Spartan-6 FPGA with 147,433 logic cells
  • PCIe bus 4-lane Gen 1 interface
  • 256k x 64-bit dual-port SRAM provides direct link from PCIe bus and to FPGA (optional 1M x 64-bit)
  • Supports both front and rear I/O connections
  • 64 I/O or 32 LVDS lines direct to FPGA via rear (J4) connector
  • Plug-in I/O extension modules are available for front mezzanine
  • FPGA code loads from PCIe bus or from flash memory
  • Other memory options available (contact factory)
  • Supports dual DMA channel data transfer to CPU/bus
  • Support for Xilinx ChipScope™ Pro interface
  • Designed for conduction-cooled host card or -40 to 85°C operation in air-cooled systems
  • VPX versions available

  • OpenVPX™ compatible Data plane connection
  • Support for upstream/downstream PCIe links
  • Supports use of prXMC single board computers
  • Optional backplane configuration for one 16-lane port, two 8-lane ports, or four 4-lane ports
  • Supports standard VITA 42 and rugged VITA 61 XMC modules on 25W mezzanine site
  • XMC site supports PCIe x8 Gen 3 interface
  • 68 pin HD CHAMP front I/O connectors
  • Supports 78-bits (39 pairs) of XMC I/O to backplane per pattern X38s+X8d+X12d of VITA 46.9
  • Conforms to VITA 42.0, 42.3, 46.0, 46.4, 48, 65
  • Supports front or rear panel XMC I/O
  • Supports front or rear panel AcroPack I/O
  • ±12V AUX power to XMC site

  • OpenVPX™ compatible via expansion plane connection
  • Support upstream/downstream PCIe links
  • Supports use of prXMC single board computers
  • Optional backplane configuration for one 16-lane port, two 8-lane ports, or four 4-lane ports
  • Supports standard VITA 42 and rugged VITA 61 XMC modules on 25W mezzanine site
  • XMC site supports PCIe x8 Gen 3 interface
  • 68 pin HD CHAMP front I/O connectors
  • Supports 78-bits (39 pairs) of XMC I/O to backplane per pattern X38s+X8d+X12d of VITA 46.9
  • Conforms to VITA 42.0, 42.3, 46.0, 46.4, 48, 65
  • Supports front or rear panel XMC I/O
  • Supports front or rear panel AcroPack I/O
  • ±12V AUX power to XMC site

  • Intel Xeon Quad Core Xeon E3-1505M V5 (47W)
  • Intel C230 series CM236 PCH chipset
  • Up to -40 to 85°C extended operating range
  • Programmable CPU power for heat sensitive apps.
  • Up to 32GB of high-speed DDR4 memory
  • XMC module expansion site
  • AcroPack/mPCIe module expansion site
  • Two M.2 expansion slots w/ SATA III, PCIe NVMe x4
  • Front panel I/O includes (air-cooled version):
    • dual USB 3.0 ports
    • Mini-DisplayPort
    • RJ45 10/100/1000BASE-T port
  • Backplane I/O includes:
    • 1 x16, 2 x8, or 4 x4 PCIe Gen3 on
  • Expansion Plane
    • 2x 40 GBASE-KR4/10GBASE-KX4 on data plane
    • 2x 10/100/1000BASE-T on control plane
    • 2x 1000BASE-BX on control plane
    • 4x RS-232/422/485
    • 2x USB 3.0
    • 2x USB 2.0
    • 2x DisplayPort 1.2
    • 2x SATA III
    • Audio: analog stereo line in and line out
    • 8 GPIO (4 inputs, 4 outputs)
  • Battery-less operation + other options available upon request
  • Rear transition module available

  • 6th Generation Intel Xeon: - Quad Core Xeon E3-1505M V5 (47W)
  • Up to -40 to 85°C extended operating range
  • Programmable CPU power for heat sensitive applications
  • Intel C230 series CM236 PCH chipset
  • Up to 32GB of high-speed DDR4 memory with SODIMM lock-down mechanism (permits user removal or upgrades)
  • Front panel I/O includes (air-cooled version): - dual USB 3.0 ports - mini-display port
  • Backplane I/O includes:
    • PCIe x4 data plane
    • PCIe x4 expansion plane
    • PCIe x4 or x4 SATA III expansion plane
    • 1 Gb Ethernet 1000Base-T port
    • 2 Gb Ethernet 1000Base-BX ports
    • 2 RS-232/422/485 ports
    • 2 USB 3.0 ports
    • 2 USB 2.0 ports
    • 2 DIsplayPort 1.2 ports
    • 2 SATA III ports
    • Audio: analog stereo line in and line out
  • Power-on self-test (POST) code LCD display

  • One AcroPack or mini-PCIe module slot
  • PCI Express compliant
  • Plug-and-play carrier configuration and interrupt support
  • Fused +1.5V, +3.3V, +5V, +12V, and -12V DC power is provided. A fuse is present on each supply line serving each AcroPack module.
  • Front panel 68-pin CHAMP 0.8mm connectors for field I/O signals
  • Optional isolated power supplies. Support for AcroPacks requiring ±12 Volt isolated power
  • Extended temperature range
  • DIP switch card identification
  • Standard 14-pin Xilinx JTAG programming header
  • Software development tools for VxWorks®, Linux®, and Windows® environments

Dualos

Phone: 253-838-9263

Fax: 253-942-4700

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