FormFactor - Cascade Vibration Isolation Tables - Tables from simple to highly sensitive
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Designed for use with specific Probe Systems
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Tables to suit all facility requirements and applications
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Stable probing, even in submicron range
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Granite platen ensures rigidity and temperature stability
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Can be combined with the Shield Enclosures
Full range of vibration isolation tables
Working with increasingly small scales of reference means that any vibration however minimal, even from the equipment itself, will seriously degrade a probe station’s performance. Slight vibrations will cause the probes to jump and miss their contacts and the microscope image will be blurred. Our range of vibration isolation tables includes a simple table for general working conditions as well as specifically designed tables for very sensitive measurements such as in the submicron range.
More Product Information
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
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Temperatures range from -60°C to +300°C
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Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
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Low Thermal Resistance Technology
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MultiSense with multiple temperature sensors
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Isolated from ground
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Includes a jack for grounding and biasing
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Advanced wafer vacuum system for warped/partial thin wafers
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Provides uniform vacuum across the entire wafer surface
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Advanced shielding technology
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
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Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
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DC to 110 GHz models available in single and dual line versions
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Low insertion and return loss with ultra-low-loss ( -L ) versions
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Excellent crosstalk characteristics
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Wide operating temperature -65 ° C to + 200 ° C
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Wide range of pitches available, from 50 to 1250 µm
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Individually supported contacts
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Reduced contact (RC) probe tips for small pads
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BeCu tip provides rugged, repeatable contact on gold pads
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
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Low-profile, straightforward design
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Easy and ergonomic operation
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Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
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Front or backside probing capability
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000