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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
Superior measurement accuracy and repeatability
Small scrub minimizes damage to aluminum pad
Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
Reduced unwanted couplings and transmission modes
Able to shrink pad geometries to 25 x 35 µm (best case)
Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
Continues the Infinity family’s Industry leading electrical performance
High temperature capability (175° C +) for automotive device characterization and other applications
Better tip visibility for enhanced placement accuracy and repeatability
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
Re-configurable and upgradable as requirements grow
Minimizes setup times with no loss in performance or accuracy
Ideal for multiport RF/Microwave and high-speed digital signal testing
Mix DC and RF/Microwave signals on one probe
Long lifetime – typically over one million (1,000,000) touchdowns
Excellent performance in temperatures ranging from 10 K to 200°C
Substrate material: High-resistivity silicon
Substrate thickness: 275 µm
Dielectric constant: 11.8
Nominal Z0: 50 Ω
Die-to-die stepping time of under 100 ms
Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
Even extreme variations in height, such as the case with warped wafers, can be compensated
Different substrate carriers for wafers up to 200 mm or single dies
Probe cards and/or up to eight positioners
Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)
Different substrate carriers for wafers up to 200 mm or single dies
Probe cards and/or up to eight positioners
Probe positioners placed inside vacuum chamber
Short and stable probe arms
Different substrate carriers for wafers up to 200 mm or single dies
Probe cards and/or up to eight positioners
Probe positioners placed inside vacuum chamber
Short and stable probe arms