• Ideal for multiport RF/Microwave and high-speed digital signal testing
• Mix DC and RF/Microwave signals on one probe
• Long lifetime – typically over one million (1,000,000) touchdowns
• Excellent performance in temperatures ranging from 10 K to 200°C
• Probe on any pad material with no damage

Our 1 Series cable assembly lineup features heat-resistant types that can be used in a wide continuous operating temperature range (-65 to +125°C) in microwave measurement environments, alongside durability-focused types with a dramatically improved mechanical life based on a cabling structure cultivated through developing robot cables.

• High dispersion for reflective surfaces and shorter working distances. 
• Provides a wider and more intense illumination area than the AL126. 
• IP65 compliant washdown option is available, as are a wide spectrum of wavelengths. 
• Available with polarization and diffusion light conditioning. 
• This expandable compact bar light is pre-engineered for custom lengths in 2″ increments up to 20″.

Our reverberation chamber is particularly suited for immunity testing for EMC measurement and special applications for very high-field strength applications (200V/m - 7000V/m). The paddle system ensures that the widest range of frequencies and particularly low frequency performance is maximized. This system meets testing requirements of the IEC61000-4-21 EMC testing specification.

• 3 isolated low phase noise 10MHz outputs 
• Internal GPS Tracking Receiver 
• External 1 PPS input 
• Small footprint designed for easy integration 
• Disciplined high stability OCXO

• Modular 6.5 digit DMMs for the EX1200 mainframes 
• Tightly integrated into mainframes, allowing high-speed, synchronized scanning measurements without the need for external cabling. 
• Input can be routed directly to the DMM or through an internal analog bus on the backplane. 
• Super fast scanning with no processor intervention required 
• Scanning configuration can be saved in the DMM’s non-volatile memory allowing quick recall of saved states 
• Integrating ADC for with adjustable integration time depending on the level of accuracy required. 
• “True RMS” AC readings 
• Frequency and temperature measurements

• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

• Extremely high resolution down to 2.8 µm pixel size
• Very large image circle of 82 mm
• Optimized for 5x magnification
• Suitable for line and array sensors
• Working with SONY IMX461, IMX661, IMX811 and others
• Interchangeable steel dipping caps
• V-Mount for easy installation