Ease of use –  Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system. Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.

Ease of use –  Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system. Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.

Revolutionary technology advancement for wafer and die-level photonics probing Real-time in-situ calibrations Singulated die testing True die-level edge coupling In-situ power measurements Advanced calibration technologies Enables autonomous measurements See "Specifications & Details" tab for more key features

Flexibility Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided Temperatures range from -60°C to +300°C Surfaces are nickel or gold-plated Hybrid chuck design – operation with and without cooling unit Field-upgradeable: On-site cold upgrades for all main prober platforms Highest Efficiency for Reduced Cost of Test

Flexibility DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug Full thermal range of -60°C to +300°C Compatible with TopHat or IceShield Usage of manual and motorized positioners, probe cards within EMI-shielded environment Upgrade path to meet your future needs Stable and repeatable measurements over a wide thermal range High accuracy and repeatability

OptoVue Revolutionary technology advancement for wafer and die-level photonics probing Real-time in-situ calibrations Singulated die testing True die-level edge coupling In-situ power measurements Advanced calibration technologies Enables autonomous measurements Horizontal Die-Level Edge Coupling Highest accuracy in test results Lowest coupling loss Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology Reduced risk of damaging fibers with collision avoidance technology Ease of use for less experienced users

PureLine 3 Technology Provides an effectively noise free environment around the device under test (DUT) First automated probe station to achieve -190dB spectral noise* Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications Eliminates over 97% of the environmental noise experienced in previous probe systems Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP Plug In and Go

Customized Solutions for a Variety of Challenging Applications We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.

Optimized Measurement Setup Multi-purpose SIGMA instrument integration kit Shorter cabling and universal chuck connection Triax probe with protected guard Optimized signal path Safe probe tip exchange Seamless integration of various analyzers High Power Chuck Triax design for low-leakage measurements up to 3 kV Special chuck surface coating High-isolation ready High-current measurement up to 100 A with lowest contact resistance Optional upgrade for 10 kV (coax) operating voltage Thin wafer handling capability Safe Operation

SlimVue Microscope Combined eye-pieces and CCD camera mount 3x zoom and quick lens exchange Quick lens exchange 1 um optical resolution Minimized scope footprint Fast change from navigation optics to high-resolution optics Resolving ‹ 50 μm pads Simple integration with any mmW modules Application Specific Sigma Kits

Three Probe Technologies Infinity Probe: best for Al (Si) ACP Probe: best for AU (III-Vs) |Z| Probe: robust solution (long lifetime) Precision contact on a wide variety of materials from 26 GHz to 67 GHz Accurate results with excellent crosstalk Matching cables and substrates included Precise Contact Solution RF chuck ±3 μm surface planarity Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact Precision probe alignment Consistent contact force and overtravel Stable contact performance WinCal Calibration Software

Maximized Field-of-View with Ultra-Sharp Image Quality Slim Design Patent-Pending Crash Protection Intelligent Lens Mount Application Flexibility Seamless Integration with Velox Probe Station Control Software Autonomous Measurement Assistants Remote Operation See "Specifications & Details" tab for more information