• Small: complete, compact system with embedded closed-loop controls. Less than half the size and one-fourth the weight of comparable systems.
• NO external control board is needed.
• Precise: 0.5μm position resolution with six millimeters of travel.
• Low voltage, low power use: runs on 3.3V input, holds position with power off.
• Simple system integration: accepts high-level motion commands DIRECTLY from your system processor, over standard serial interface (I2C or SPI).
• Flexible system, fast time to market: the M3 platform is designed for rapid customization. Modules are configurable for single- or multi-axis motion and travel up to 20 mm.

Flexibility

• Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
• Re-configurable and upgradable as requirements grow
• Minimizes setup times with no loss in performance or accuracy
• Seamless integration of various measurement instruments

Stability

• Solid station frame
• Built-in vibration-isolation solution for superior vibration attenuation
• Rigid microscope bridge
• Compact and rigid mechanical design
• Highly accurate measurement results
• Incorporates best-known methods

Ease of Use

• Ergonomic and straightforward design for comfortable and easy operation
• Low-profile design
• Simple microscope operation
• Quick and ergonomic change of DUT through pull-out stage
• Minimize training efforts
• Fast time to data
• Convenient operation

• A real-time diagnostic tool supports EMC/EMI debugging. 
• Fast visualize EMC/EMI problems. 
• Enables easy comparison of countermeasures before and after. 
• Capable of measurement from entire products to single components. 
• Factor-editor function provides correction of antenna characteristics, cable loss and preamplifier. 
• User friendly compact design. 
• Customer supplied spectrum and probes acceptable (Please consult)

Next Generation Wafer Probing

• Continues the Infinity family’s Industry leading electrical performance
• High temperature capability (175° C +) for automotive device characterization and other applications
• Better tip visibility for enhanced placement accuracy and repeatability
• Improved tip life/durability with solid rhodium contacts
• New tip architecture enables support for narrower pitches (e.g. 25um)
• Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements

• Power bypass inductance: 8 nH
• Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
• Supports collinear and non-standard needle configurations
• Up to 16 DC for standard; maximum of 24 DC for custom
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

Superior Mechanics

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments
• Excellent measurement accuracy and repeatability
• Fast navigation and high-precision probe positioning

See "Specifications & Details" tab for more key features

• Coaxial and triaxial measurements up to 10,000 V
• High-quality construction with low-noise electrical performance
• Replaceable probe tips in a variety of tip sizes
• Temperature range of of -60°C to 300°C
• Triaxial measurement ensures a much better understanding of device leakage in the off state
• Highly reliable, stable and repeatable measurements
• Integrally designed as part of a complete measurement solution

• Solve machine vision applications efficiently by constructing flowcharts instead of writing program code, using field-proven tools for analyzing, classifying, locating, measuring, reading and verifying
• Use a single program for creating both application logic and operator interface
• Leverage deep learning for visual inspection through image classification and segmentation tools
• Rely on a common underlying vision library for the same results with an Iris GTX smart camera, vision systems or third-part computer
• Work with multiple cameras all within the same project or per project running concurrently and independently from one another, platform permitting
• Interface to Zebra AltiZ and third party 3D sensors to visualize, process and analyze depth maps and point clouds
• Communication options include discrete Zebra I/Os, RS-232, and Ethernet (TCP/IP, CC-Link IE Field Basic, EtherNet/IP, Modbus, OPC UA, and PROFINET, and native robot interfaces)
• Maximize productivity with instant feedback on image analysis and processing operations
• Receive immediate pertinent assistance through an integrated contextual guide
• Maintain control and independence through the ability to create custom flowchart steps
• Test communication with PLC using the built-in PLC interface emulator
• Protect against inappropriate changes with the Project Change Validator tool