The SM7000 Series microwave switching modules are members of the VXI Technology SMIPII™ family. They offer a modular design allowing custom switching configurations to be easily assembled and modified in the field. 

The SM7000 is a single-wide, C-size VXI module, which can support up to six different microwave switches including: a dual SPDT; SP3T through SP6T; transfer switches and passthrough adapters that allow the module to control up to eight externally mounted relays each.

PureLine 3 Technology

• Provides an effectively noise free environment around the device under test (DUT)
• First automated probe station to achieve -190dB spectral noise*
• Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
• Eliminates over 97% of the environmental noise experienced in previous probe systems
• Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP

Plug In and Go

• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Eliminates all ground-loop induced TestCell noise
• Low field emissions
• Provides fully managed and filtered AC power to the entire system, prober and instruments

See "Specifications & Details" tab for more key features

• DC-40 GHz bandwidth
• 10 ps rise time
• Low insertion and return loss
• 2 mils of tip-to-tip compliance
• High probing angle and clearance

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with TESLA 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

• 96 digital lines configurable as either input or output 
• Five available power supply rails for custom designs 
• Mix and match with standard SMIP switching and digital I/O modules to create high density configurations 
• VXI plug&play driver simplifies software development 
• On-board connector header for simplified migration to PCB implementation 
• Access to 16 MHz clock for use in complex designs 
• Multiple front panel connector options

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features