• Revolutionary technology advancement for wafer and die-level photonics probing
• Real-time in-situ calibrations
• Singulated die testing
• True die-level edge coupling
• In-situ power measurements
• Advanced calibration technologies
• Enables autonomous measurements

See "Specifications & Details" tab for more key features

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements

Optimized Measurement Setup

• Multi-purpose SIGMA instrument integration kit
• Shorter cabling and universal chuck connection
• Triax probe with protected guard
• Optimized signal path
• Safe probe tip exchange
• Seamless integration of various analyzers

High Power Chuck

• Triax design for low-leakage measurements up to 3 kV
• Special chuck surface coating
• High-isolation ready
• High-current measurement up to 100 A with lowest contact resistance
• Optional upgrade for 10 kV (coax) operating voltage
• Thin wafer handling capability

Safe Operation

• Arcing protection
• Shield Enclosure with interlock
• Advanced grounding concept
• Maximum protection from high-voltage shock for users and devices
• Common ground protection for all instruments
• EMI/light-tight shielded environment

• High dispersion for reflective surfaces and shorter working distances. 
• Provides a wider and more intense illumination area than the AL126. 
• IP65 compliant washdown option is available, as are a wide spectrum of wavelengths. 
• Available with polarization and diffusion light conditioning. 
• This expandable compact bar light is pre-engineered for custom lengths in 2″ increments up to 20″.

High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

The industrial manufacturing industry has been a sector of constant innovation for centuries, continuously leveraging the data from frequent iterations to achieve new solutions. This is no different today, driven by advancements in automation, the adoption of Industry 4.0 technologies, the integration of IoT, and the shift towards sustainable manufacturing practices. These trends require the development of new testing protocols, thorough safety standards, and sophisticated quality control measures to ensure the reliability and efficiency of increasingly complex systems. Manufacturers must also address interoperability and cybersecurity challenges posed by interconnected devices and digital supply chains. Add the push for eco-friendly, sustainable manufacturing practices in conjunction with rigorous testing for compliance with environmental regulations, and achieving balanced testing facility solutions is no easy task.

• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Guarantees fully-guarded measurements to fA and fF levels
• Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
• Allows probing of different pad materials and sizes
• Fast replacement of worn probes without the need for tools

• Support the most high-performance Camera Link cameras with available support for Full and 80-bit mode at up to 85 MHz 
• Perform deterministic image acquisition by way of the jitter-free Camera Link 2.1 interface 
• Offload host computer of custom image processing using a field-programmable gate array (FPGA) device 
• Eliminate missed frames through a PCIe® 2.0 x8 host interface and ample onboard buffering 
• Optimize multi-camera applications via support for up to four Base or two Full/80-bit Camera Link cameras per board 
• Minimize space requirements and maximize PC compatibility through a half-length design with mini Camera Link connectivity for true single-slot operation
• Improve and simplify system connectivity with Power-overCamera-Link (PoCL) support at extended cable lengths

The automotive industry is a sector frequently on the cusp of transformation. Fast-paced industry shifts span technology innovations, regulatory standards, green initiatives, and customer expectations, influencing manufacturers’ testing needs, growth objectives, and overall business strategies. Companies striving for a competitive edge focus on sustainable practices, regulatory compliance, and innovation in Electric Vehicles (EVs), alternative fuels, and autonomous driving systems. This positions the automotive industry in vital need of testing facilities that are future-proofed for rapid and ongoing transformation.