FormFactor - Cascade DCP 100 Series Probe - Delivers superior guarding and shielding
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
The DCP100 delivers the measurement accuracy needed for advanced on-wafer process, device characterization and reliability testing. With superior guarding and shielding, these probes overcome the performance limitations of non-coaxial needle probes. They are integrally designed as part of a complete measurement solution, these probes are highly reliable, stable and repeatable.
Advantages
- Ultra-low, fA and fF measurements from -65 º C to 150 º C
- Full electrical guard to the probe tip
- Integrally designed as part of Cascade’s complete measurement solution
- Highly reliable, stable and repeatable
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More Product Information
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Substrate material: High-resistivity silicon
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Substrate thickness: 275 µm
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Dielectric constant: 11.8
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Nominal Z0: 50 Ω
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Sample can be loaded or removed when the cryostat is cold
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High cooling power with sample in (He-3) liquid (400 mK with 400 microwatt cooling power)
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Sample probe and a load-lock with gate valve
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Thermal range: -60˚C to 300˚C available
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Upgrade path to meet your future needs
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Stable and repeatable measurements over a wide thermal range
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Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
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Advanced EMI-shielding with PureLine with AttoGuard technologies
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Best solution for low-noise and 1/f measurements
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Minimize AC and spectral noise
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Minimizes settling times for efficient measurements, without compromising accuracy over full thermal range
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Locking roll-out stage
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Innovative microscope remote control
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Intuitive ergonomic stage controls
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Quick, safe, and comfortable wafer access
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Easy on-wafer navigation
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Fast setup and test data gathering
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Dedicated Velox version for manual probe stations
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AugmentedAlign tool with on screen markers for improved RF measurement accuracy
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
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Prevent thin wafers from curling and breaking
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Safety interlock system with clear enclosure for operator safety during device measurements
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Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
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Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
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Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
See more Key Features on Specifications & Details tab
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
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Low-profile, straightforward design
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Easy and ergonomic operation
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Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
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Front or backside probing capability
See more Key Features on Specifications & Details tab
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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