FormFactor - Cascade DCP 100 Series Probe - Delivers superior guarding and shielding
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
The DCP100 delivers the measurement accuracy needed for advanced on-wafer process, device characterization and reliability testing. With superior guarding and shielding, these probes overcome the performance limitations of non-coaxial needle probes. They are integrally designed as part of a complete measurement solution, these probes are highly reliable, stable and repeatable.
Advantages
- Ultra-low, fA and fF measurements from -65 º C to 150 º C
- Full electrical guard to the probe tip
- Integrally designed as part of Cascade’s complete measurement solution
- Highly reliable, stable and repeatable
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More Product Information
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Intuitive, manual drives
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Front loading capability through load door
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for chuck
See more Key Options in Specifictions & Details tab
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Functional temperature range of -263 to +150°C
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Stainless steel tip material for thermal decoupling
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Coaxial cable with TCE matched inner and outer conductors
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Consistent tip geometry even at cryogenic temperatures
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
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Prevent thin wafers from curling and breaking
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Safety interlock system with clear enclosure for operator safety during device measurements
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Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
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Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
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Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
See more Key Features on Specifications & Details tab
Ultra Low Temperature
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Pulse tube cryocooler for cryogen free 4K temperatures
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Two stage ADR provides solid state cooling down to 30mK
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Sample stage mounting at both 1K and 50mK
Configurability
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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Power bypass inductance: 8 nH
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Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
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Supports collinear and non-standard needle configurations
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Up to 16 DC for standard; maximum of 24 DC for custom
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
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Continues the Infinity family’s Industry leading electrical performance
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High temperature capability (175° C +) for automotive device characterization and other applications
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Better tip visibility for enhanced placement accuracy and repeatability
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Improved tip life/durability with solid rhodium contacts
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New tip architecture enables support for narrower pitches (e.g. 25um)
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Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
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Proven technology: designed in conjunction with several top STM groups in the world
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Quiet, low vibration operation
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Low running costs and reduced maintenance
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Easy operation and fast cool-down; load sample when the system is cold for TL models
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Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate
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Designed for use with specific Probe Systems
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Tables to suit all facility requirements and applications
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Stable probing, even in submicron range
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Granite platen ensures rigidity and temperature stability
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Can be combined with the Shield Enclosures
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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