• Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
• Reduced unwanted couplings and transmission modes
• Able to shrink pad geometries to 25 x 35 µm (best case)
• Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
• WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.

The low frequency tuners are a unique product technology using MPT algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors.

The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

• Ideal for multiport RF/Microwave and high-speed digital signal testing
• Mix DC and RF/Microwave signals on one probe
• Long lifetime – typically over one million (1,000,000) touchdowns
• Excellent performance in temperatures ranging from 10 K to 200°C
• Probe on any pad material with no damage

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
• Re-configurable for DC, RF, mmW, FA, WLR and more
• Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
• Low-profile, straightforward design
• Easy and ergonomic operation
• Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Front or backside probing capability

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Joystick controller
• Manual probe positioners with rotary feed-throughs
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer
• User-centered design minimizes training costs and enhances efficiency