• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with TESLA 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

• High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
• RF bandwidth to 500 MHz
• Long probe life: > 250,000 contacts
• Beryllium-copper tips for gold pads or tungsten for aluminum pads
• Oscillation-free testing of wide-bandwidth analog circuits
• Use with ACP series probes to provide functional at-speed testing for known-good-die
• Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
• Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements

• Mechanical Platen Lift: Enhances safety during complex RF set-ups, increasing operator confidence and minimizing the risk of errors.
• Ease of Use and Advanced Automation: Fully compatible with FormFactor’s Autonomous RF and DC measurement assistants, as well as Velox Dash™ companion app control.
• Reconfigurable Platen Inserts: Quickly switch between TopHat, PCH, and IceShield inserts within minutes to support a wide variety of test configurations.
• Spacious Platen Design: Provides flexibility for both RF and DC setups without space limitations, ensuring easy integration of different configurations.
• Compact Design: Small footprint with field-upgradable components for smooth integration into existing test cells.
• Low-Volume MicroChamber and FemtoGuard Thermal Triaxial Chuck: Included by default

Flexibility

• Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
• Temperatures range from -60°C to +300°C
• Surfaces are nickel or gold-plated
• Hybrid chuck design – operation with and without cooling unit
• Field-upgradeable: On-site cold upgrades for all main prober platforms

Highest Efficiency for Reduced Cost of Test

• Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
• Up to 15% faster transition times than other systems on the market

Flexibility

• Different substrate carriers for wafers up to 150 mm or single dies
• Up to six positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Probing with an open chamber lid possible under atmospheric condition
• Specially designed for laboratory environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

• DC-40 GHz bandwidth
• 10 ps rise time
• Low insertion and return loss
• 2 mils of tip-to-tip compliance
• High probing angle and clearance

Customized Solutions for a Variety of Challenging Applications

We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.