FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
FormFactor’s Ultra-High-Power Probe (UHP), a high-voltage parametric probe, handles both high voltage (up to 10,000 V) and high current (up to 600 A) at a wide temperature range (-60ºC to 300ºC).
The high pulse current achieves full I-V characterization with one setup and one touchdown. Together with a TESLA on-wafer power device characterization system, the UHP fully utilizes the high-voltage/current capability of Keysight B1505A and N1265A Ultra High Current Expanders.
More Product Information

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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
-
Even distribution of high current with innovative multi-fingertip design
-
Compatible with TESLA 200/300 mm power device characterization system
-
Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
-
Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
-
Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity

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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Intuitive, manual drives
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Front loading capability through load door
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for chuck

Connectors in the 0.9 mm SuperMini product line provide the superior performance of Southwest Microwave’s standard-size, high frequency connectors in a miniaturized footprint that is ideal for reduced-size PCB and panel applications, offering ultra-broad bandwidth and coupling nut mating. 0.9 mm SuperMini connectors are rugged and durable, featuring a 360° raised grounding ring and a temperature range of -55°C to 165°C. These connectors provide mode-free operation through 67 GHz, offering well-matched impedance, excellent repeatability, and the industry’s lowest VSWR (1.2:1), insertion loss (0.7 dB) and RF leakage (≤ -100 dB).

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Cryogen-free option available
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Flexible sample space
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Low noise, low vibration
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Long holding time
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Stable He-3 pot temperature

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Wafer temp verified <4.5 K (with 44 RF probes in contact)
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Magnetic field suppression to <200 nT
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Easy exchange of customizable probe cards
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Configurable for 150 mm, 200 mm and 300 mm wafers
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Options for fully automated wafer load or manual
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Complete software suite for manual, semi-auto, or fully automated probing
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25 wafer cassette capacity for fully automated testing
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~15 minute cooldown time per wafer

- UltraSeal Bar Lights are ideal for hygienic inspection environments, aseptic manufacturing, and food and beverage applications. They are IP69K certified to withstand the harshest environments.
- These Bar Lights feature either stainless steel or nickel plated aluminum housings depending on your washdown requirements.

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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage

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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency

FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
