FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
FormFactor’s Ultra-High-Power Probe (UHP), a high-voltage parametric probe, handles both high voltage (up to 10,000 V) and high current (up to 600 A) at a wide temperature range (-60ºC to 300ºC).
The high pulse current achieves full I-V characterization with one setup and one touchdown. Together with a TESLA on-wafer power device characterization system, the UHP fully utilizes the high-voltage/current capability of Keysight B1505A and N1265A Ultra High Current Expanders.
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More Product Information
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Substrate material: High-resistivity silicon
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Substrate thickness: 275 µm
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Dielectric constant: 11.8
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Nominal Z0: 50 Ω
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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
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Superior measurement accuracy and repeatability
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Small scrub minimizes damage to aluminum pad
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Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
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Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
See more Key Features on Specifications & Details tab
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Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
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Application flexibility, ideal for use in high frequency applications
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Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
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Suitable for integration with vibration isolating tables
Connectors in the 0.9 mm SuperMini product line provide the superior performance of Southwest Microwave’s standard-size, high frequency connectors in a miniaturized footprint that is ideal for reduced-size PCB and panel applications, offering ultra-broad bandwidth and coupling nut mating. 0.9 mm SuperMini connectors are rugged and durable, featuring a 360° raised grounding ring and a temperature range of -55°C to 165°C. These connectors provide mode-free operation through 67 GHz, offering well-matched impedance, excellent repeatability, and the industry’s lowest VSWR (1.2:1), insertion loss (0.7 dB) and RF leakage (≤ -100 dB).
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Multi-purpose SIGMA instrument integration kit
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Shorter cabling and universal chuck connection
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Triax probe with protected guard
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Triax design for low-leakage measurements up to 3 kV
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Special chuck surface coating
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High-isolation ready
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Arcing protection
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Shield Enclosure with interlock
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Advanced grounding concept
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Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight Photonics Application
Rugged storage array satisfying advanced storage requirements with limitless capacity for sensitive data, rapidly accessed and protected using fast NVMe SSDs and a secure host.
- Light, Durable, Ready for Extremes - Much lighter yet more rugged than any solution on the market. SWaP optimized for field-deployment.
- Ultra-fast Read/Write Speeds - Quickly store and retrieve large amounts of critical data in seconds with 27.2 GBs read/write speeds.e
- Full Control & Configurability - Drive magazines that hold 8 drives at once or 24 individually removable drives enable quick removal and replacement.
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
See more Key Features on Specifications & Details tab
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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