FormFactor - Cascade |Z| Probe® PCB - Robust RF test on PCB and ceramic
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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C
Flexibility is the key for efficient PCB and ceramic testing. The |Z| Probe® PCB is simple to align and handle and can be easily positioned. It optimally replaces costly test fixtures which are often inflexible. A robust design makes the |Z| Probe PCB easy to handle and offers a long working life typically more than one million (1,000,000) contacts.
The planar tip of the |Z| Probe PCB has precisely calculated, parallel, separate contact springs which move independently of one another, allowing a precise, quick and simple contact with the DUT, even if there are significant contact height differences. This unique feature as well as the overall very robust design of the |Z| Probe PCB ensures a long life and simple handling.
Used in conjunction with a manual probe system including probe positioners and calibration substrates, the |Z| Probe PCB becomes the ultimate tool for all RF circuit probing needs.
More Product Information
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
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Cryogen-free option available
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Flexible sample space
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Low noise, low vibration
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Long holding time
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Stable He-3 pot temperature
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
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Multi-purpose SIGMA instrument integration kit
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Shorter cabling and universal chuck connection
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Triax probe with protected guard
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Triax design for low-leakage measurements up to 3 kV
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Special chuck surface coating
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High-isolation ready
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Arcing protection
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Shield Enclosure with interlock
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Advanced grounding concept
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Full-radius, nickel-plated tungsten needles
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Power bypass inductance: 16 nH
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Supports collinear and non-standard needle configurations
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Support up to a maximum of 12 ceramic blades DC needles / contacts
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
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Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
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Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
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Durable probe structure ensures more than 250,000 contacts
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Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications
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Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
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Superior measurement accuracy and repeatability
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Small scrub minimizes damage to aluminum pad
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Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
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Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000