FormFactor - Cascade FPC Probe - Rugged, deep reach RF probing for modules and circuit boards
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
The FPC probe is a high frequency 50 ohm coaxial probe that offers a signal line with either one or two low-inductance fixed-pitch ground contacts. The probe tip structure is lithographically defined for unsurpassed impedance control, preserving the highest integrity possible when launching and receiving signals from SMT boards, hybrids and multi-chip modules(MCM).
Advantages
- Maintains 50-ohm environment which allows accurate high-frequency measurement of microelectronic modules
- Compliant tips allow probing of non-planar structures
- BeCu tips provide longer probing life and reduce probe damage
- Access contacts close to components, module walls, or other obstructions
Document
More Product Information
Floating Action Buttons
- Easy and fast setup of camera views
- Go to Light and Image Settings of the selected camera view with only one mouse click
Workflow Wizard
- Guided workflows for wafer setups, alignment tools and Autonomous Assistants
- Workflow wizard shows task-relevant settings and options only
- Wizard settings can be corrected anytime – no need to restart the wizard
- Wizard helps with intelligent solutions in case of error
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 150 mm or single dies
- Up to six positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Accessories available, such as black bodies and optical motion analysis tools
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
Optimized Measurement Setup
- Multi-purpose SIGMA instrument integration kit
- Shorter cabling and universal chuck connection
- Triax probe with protected guard
- Optimized signal path
- Safe probe tip exchange
- Seamless integration of various analyzers
High Power Chuck
- Triax design for low-leakage measurements up to 3 kV
- Special chuck surface coating
- High-isolation ready
- High-current measurement up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
Safe Operation
- Arcing protection
- Shield Enclosure with interlock
- Advanced grounding concept
- Maximum protection from high-voltage shock for users and devices
- Common ground protection for all instruments
- EMI/light-tight shielded environment
Superior Mechanics
- Highly stable granite base
- Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
- 1 µm repeatable separation stroke
- Excellent measurement accuracy and repeatability
- Fast navigation and high-precision probe positioning
See "Specifications & Details" tab for more key features
More than a calibration tool
- Calibration
- Validation
- Measurement
- Analysis
No one supports more VNA’s
- Support of more than 24 of the most common VNA’s
Tool for the novice
- Guided wizards and multimedia tutorials integrated
- Intelligence in setups
See "Specifications & Details" tab for more key features
- Coaxial and triaxial measurements up to 10,000 V
- High-quality construction with low-noise electrical performance
- Replaceable probe tips in a variety of tip sizes
- Temperature range of of -60°C to 300°C
- Triaxial measurement ensures a much better understanding of device leakage in the off state
- Highly reliable, stable and repeatable measurements
- Integrally designed as part of a complete measurement solution
-
IMX250 CMOS sensor
-
ALVIUM image processing
-
MIPI CSI-2 interface
-
Various hardware options
-
Monochrome (1800 C-508m) and color (1800 C-508c) models
-
ALVIUM® Technology for on-board image processing
-
MIPI CSI-2 interface with up to 4 lanes
-
Platform concept that enables the operation of different Alvium camera models with a common software
-
Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
-
Precise sensor-to-lens mount alignment
-
Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
-
Industrial performance for embedded vision applications
-
Easy-to-install driver and code examples
FormFactor, Inc.
Website
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
