FormFactor - Cascade FPC Probe - Rugged, deep reach RF probing for modules and circuit boards
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DC-40 GHz bandwidth
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10 ps rise time
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Low insertion and return loss
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2 mils of tip-to-tip compliance
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High probing angle and clearance
The FPC probe is a high frequency 50 ohm coaxial probe that offers a signal line with either one or two low-inductance fixed-pitch ground contacts. The probe tip structure is lithographically defined for unsurpassed impedance control, preserving the highest integrity possible when launching and receiving signals from SMT boards, hybrids and multi-chip modules(MCM).
- Maintains 50-ohm environment which allows accurate high-frequency measurement of microelectronic modules
- Compliant tips allow probing of non-planar structures
- BeCu tips provide longer probing life and reduce probe damage
- Access contacts close to components, module walls, or other obstructions
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More Product Information
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Sample can be loaded or removed when the cryostat is cold
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High cooling power with sample in (He-3) liquid (400 mK with 400 microwatt cooling power)
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Sample probe and a load-lock with gate valve
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
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Functional temperature range of -263 to +150°C
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Stainless steel tip material for thermal decoupling
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Coaxial cable with TCE matched inner and outer conductors
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Consistent tip geometry even at cryogenic temperatures
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Multi-purpose SIGMA instrument integration kit
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Shorter cabling and universal chuck connection
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Triax probe with protected guard
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Triax design for low-leakage measurements up to 3 kV
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Special chuck surface coating
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High-isolation ready
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Arcing protection
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Shield Enclosure with interlock
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Advanced grounding concept
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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements
Ultra Low Temperature
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Pulse tube cryocooler for cryogen free 4K temperatures
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Two stage ADR provides solid state cooling down to 30mK
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Sample stage mounting at both 1K and 50mK
Configurability
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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IMX183 CMOS sensor
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ALVIUM image processing
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MIPI CSI-2 interface
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Various hardware options
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Monochrome (1800 C-2050m) and color (1800 C-2050c) models
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ALVIUM® Technology for on-board image processing
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MIPI CSI-2 interface with up to 4 lanes
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Platform concept that enables the operation of different Alvium camera models with a common software
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Hirose HR FHH55 FPC connector with minimum space requirements for a compact design
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Precise sensor-to-lens mount alignment
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Standard M3 mounting holes for top and bottom mounting, standard M2 mounting holes for front mounting
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Industrial performance for embedded vision applications
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Easy-to-install driver and code examples
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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