FormFactor - Cascade FPC Probe - Rugged, deep reach RF probing for modules and circuit boards
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DC-40 GHz bandwidth
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10 ps rise time
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Low insertion and return loss
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2 mils of tip-to-tip compliance
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High probing angle and clearance
The FPC probe is a high frequency 50 ohm coaxial probe that offers a signal line with either one or two low-inductance fixed-pitch ground contacts. The probe tip structure is lithographically defined for unsurpassed impedance control, preserving the highest integrity possible when launching and receiving signals from SMT boards, hybrids and multi-chip modules(MCM).
- Maintains 50-ohm environment which allows accurate high-frequency measurement of microelectronic modules
- Compliant tips allow probing of non-planar structures
- BeCu tips provide longer probing life and reduce probe damage
- Access contacts close to components, module walls, or other obstructions
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More Product Information
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will
continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
See more Key Features on Specifications & Details tab
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
Ultra Low Temperature
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Pulse tube cryocooler for cryogen free 4K temperatures
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Two stage ADR provides solid state cooling down to 30mK
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Sample stage mounting at both 1K and 50mK
Configurability
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Multiple stage feedthroughs for thermally intercepting the signals
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Two large electrical bread boards for more configurable space
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Rapid cool options for faster cooldowns
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High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
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RF bandwidth to 500 MHz
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Long probe life: > 250,000 contacts
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Beryllium-copper tips for gold pads or tungsten for aluminum pads
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Oscillation-free testing of wide-bandwidth analog circuits
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Use with ACP series probes to provide functional at-speed testing for known-good-die
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Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
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Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
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Accommodates a combination of up to four Cascade Microtech probes
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Configurable for mixed-signal RF/mmW testing
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Quick and easy repairs to be performed in the field, by simply replacing individual probes
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Adaptable to new device layouts by exchanging individual probes
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Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
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DC to 110 GHz models available in single and dual line versions
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Low insertion and return loss with ultra-low-loss ( -L ) versions
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Excellent crosstalk characteristics
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Wide operating temperature -65 ° C to + 200 ° C
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Wide range of pitches available, from 50 to 1250 µm
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Individually supported contacts
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Reduced contact (RC) probe tips for small pads
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BeCu tip provides rugged, repeatable contact on gold pads
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Intuitive, manual drives
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Front loading capability through load door
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for chuck
See more Key Options in Specifictions & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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