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FormFactor - Cascade FPC Probe - Rugged, deep reach RF probing for modules and circuit boards
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
The FPC probe is a high frequency 50 ohm coaxial probe that offers a signal line with either one or two low-inductance fixed-pitch ground contacts. The probe tip structure is lithographically defined for unsurpassed impedance control, preserving the highest integrity possible when launching and receiving signals from SMT boards, hybrids and multi-chip modules(MCM).
Advantages
- Maintains 50-ohm environment which allows accurate high-frequency measurement of microelectronic modules
- Compliant tips allow probing of non-planar structures
- BeCu tips provide longer probing life and reduce probe damage
- Access contacts close to components, module walls, or other obstructions
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All tools in one belt
- Calibration
- Validation
- Measurement
- Analysis
Advanced functionality
- Multi-Port Hybrid Cals
- Enhanced Verification and Reports
- Post Processing and Sequencing
Get started
- Guided wizards and multimedia tutorials integrated
- Intelligence in setups
Flexible setups
- Standalone for manual probe stations
- Fully integrated in Velox Probe station control software
- Workspaces to build custom configurations that include selected combinations of system setup files, calibration setup files, and reports
- Support of more than 24 of the most common VNA’s
Three Probe Technologies
- Infinity Probe: best for Al (Si)
- ACP Probe: best for AU (III-Vs)
- |Z| Probe: robust solution (long lifetime)
- Precision contact on a wide variety of materials from 26 GHz to 67 GHz
- Accurate results with excellent crosstalk
- Matching cables and substrates included
Precise Contact Solution
- RF chuck ±3 μm surface planarity
- Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
- Precision probe alignment
- Consistent contact force and overtravel
- Stable contact performance
WinCal Calibration Software
- Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
- Automated calibration monitoring
- Unique measurement & analysis methods
- Accurate S-parameter measurements
- Automatic calibration setup for higher efficiency
- Fast and easy data interpretation and reporting
Gold-plated TESLA High-power MicroVacâ„¢ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
See "Specifications & Details" tab for more key features
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
Customized Solutions for a Variety of Challenging Applications
We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PNA for On-wafer R&D Measurements from RF to millimeter wave to Terahertz
- Mechanical Platen Lift: Enhances safety during complex RF set-ups, increasing operator confidence and minimizing the risk of errors.
- Ease of Use and Advanced Automation: Fully compatible with FormFactor’s Autonomous RF and DC measurement assistants, as well as Velox Dash™ companion app control.
- Reconfigurable Platen Inserts: Quickly switch between TopHat, PCH, and IceShield inserts within minutes to support a wide variety of test configurations.
- Spacious Platen Design: Provides flexibility for both RF and DC setups without space limitations, ensuring easy integration of different configurations.
- Compact Design: Small footprint with field-upgradable components for smooth integration into existing test cells.
- Low-Volume MicroChamber and FemtoGuard Thermal Triaxial Chuck: Included by default
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Functional temperature range of -263 to +150°C
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Stainless steel tip material for thermal decoupling
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Coaxial cable with TCE matched inner and outer conductors
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Consistent tip geometry even at cryogenic temperatures
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
