FormFactor - Cascade MPS150 Modular Probe Station
Flexibility
- Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
- Re-configurable and upgradable as requirements grow
- Minimizes setup times with no loss in performance or accuracy
- Seamless integration of various measurement instruments
Stability
- Solid station frame
- Built-in vibration-isolation solution for superior vibration attenuation
- Rigid microscope bridge
- Compact and rigid mechanical design
- Highly accurate measurement results
- Incorporates best-known methods
Ease of Use
- Ergonomic and straightforward design for comfortable and easy operation
- Low-profile design
- Simple microscope operation
- Quick and ergonomic change of DUT through pull-out stage
- Minimize training efforts
- Fast time to data
- Convenient operation
Customize your 150 mm probe station based on flexible modules at an incredible price!
FormFactor introduces a new modular concept for its best-in-class 150 mm probe stations. This will make it even easier to configure your individual probe solution for current and future needs at an incredible price. Simply choose a base station and add as many application-specific starter kits as you need.
Available Options
Microscope
- Stereo Zoom Microscope
- High Resolution Microscope
Application Starter Kit (incl. Probes)
- IV/CV
- RF Basic
- mmW Basic
- Keysight N5291 (Advanced mmW)
- VDI Mini Extenders (Advanced mmW)
- Focus Microwaves Delta Tuners (Advanced Load-pull)
- Advanced THz
- Failure Analyis
- High Power
Positioner Kit
- Basic
- Advanced mmW / THz / Load-pull
Chuck
- Coax
- Triax
- RF
- Thermal
- High Power
Base Station
- Basic
- Advanced mmW / THz / Load-pull
Example: Complete 150 mm Entry-level IV/CV Manual Probe Station
Additional Configuration Examples
Coax – DC parametric test down to pA levels
- Movable platen with 40 mm height adjustment, 200 μm contact / separation stroke and ± 1 μm repeatability
- Chuck stage with adjustable friction & stage lock, unique Z chuck adjustment and 90 mm pull-out
- Magnetic positioners with 1 μm feature resolution and 3 linear axes with precision ball bearing
Triax – Low-noise measurements down to fA levels
- Stereo microscope: 15x–100x magnification with large field-of-view and camera-ready c-mount
- Four triax probe arms and high-quality triax cables
- Light/EMI shielding (optional)
- Upgrade option for fF-level measurements
- TRIAX chuck with ±8 fine theta chuck rotation, three auxiliary areas, chuck surface with ±5 μm planarity for consistent contact force and overtravel
- East/West to North/South measurements with single setup
RF test up to 67 GHz
- Multiple probe technologies available: Infinity Probe, ACP Probe, |Z| Probe, FCP Probes
- Matching cables and substrates included
- RF chuck ±3 μm surface planarity
- Unique 200 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
- WinCal Calibration Software
mmW - 70 GHz through sub-THz and load-pull
- SlimVue microscope with quick lens exchange, 1 μm optical resolution, resolving ‹50 μm pads
- Engraved guides on mmW platen for application-specific SIGMA Kits
- Supports broadband, load pull, coax RF and banded waveguide configuration
- Optical feedback on platen position (gauge)
- Vibration Isolation Platform
mmW probing up to THz and load-pull
- SlimVue microscope with quick lens exchange, 1 μm opitcal resolution, resolving ‹50 μm pads
- Engraved guides on mmW platen for application-specific SIGMA Kits
- Supports broadband, load pull, coax RF and banded waveguide configuration
- Optical feedback on platen position (gauge)
- Rock-solid mechanical design and vibration isolation platform
- Submicron stage accuracy
- Motorized positioners
- <+-1 μm separation repeatability
- Micrometer-accuracy and repeatable probe placement and over travel
Failure analysis and design debug
- Stable microscope bridge design and XY microscope with up to 4000x magnification*
- Laser cutter and camera ready
- Contact submicron features
- Simultaneous use of probe card and single needles*
- Chuck ready for single DUT
- Quickest transition from wafer-to-chip-to-package
- Vacuum positioners with 1 μm feature resolution
- DPP450 positioner with nanometer resolution and accuracy*
* Optional - Additional costs apply. Contact sales representative for information.
On-wafer power device characterization
- Multi-purpose SIGMA instrument integration kit
- Triax probe with protected guard
- Seamless integration of various analyzers
- Triax chuck with surface coating for low-leakage measurements up to 3 kV, high-isolation ready
- High-current measurements up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
- Arcing protection and advanced grounding concept
- Shield Enclosure with interlock for EMI/light-tight environment
- Maximum protection from high-voltage shock for users and devices
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More Product Information
More than a calibration tool
- Calibration
- Validation
- Measurement
- Analysis
No one supports more VNA’s
- Support of more than 24 of the most common VNA’s
Tool for the novice
- Guided wizards and multimedia tutorials integrated
- Intelligence in setups
See "Specifications & Details" tab for more key features
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
Superior Mechanics
- Highly stable granite base
- Independent, coarse movement of X and Y axes, combined with easy fine adjustments
- Excellent measurement accuracy and repeatability
- Fast navigation and high-precision probe positioning
See "Specifications & Details" tab for more key features
Measurement Accuracy
- Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
- Minimize AC and spectral noise with effective shielding capability
- Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
- Shortest signal path test integration for accurate, thermally stable, and low-error data collection
See "Specifications & Details" tab for more key features
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
See more Key Features on Specifications & Details tab
Optimized Measurement Setup
- Multi-purpose SIGMA instrument integration kit
- Shorter cabling and universal chuck connection
- Triax probe with protected guard
- Optimized signal path
- Safe probe tip exchange
- Seamless integration of various analyzers
High Power Chuck
- Triax design for low-leakage measurements up to 3 kV
- Special chuck surface coating
- High-isolation ready
- High-current measurement up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
Safe Operation
- Arcing protection
- Shield Enclosure with interlock
- Advanced grounding concept
- Maximum protection from high-voltage shock for users and devices
- Common ground protection for all instruments
- EMI/light-tight shielded environment
FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
- Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
- Even distribution of high current with innovative multi-fingertip design
- Compatible with TESLA 200/300 mm power device characterization system
- Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
- Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
- Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
FormFactor, Inc.
Website
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
