Overview
Specifications & Details
Datasheets & Downloads
Videos

Flexibility

DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
Full thermal range of -60°C to +300°C
Compatible with TopHat or IceShield
Usage of manual and motorized positioners, probe cards within EMI-shielded environment
Upgrade path to meet your future needs
Stable and repeatable measurements over a wide thermal range

High accuracy and repeatability

Reliable and repeatable contact
Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
Advanced EMI-shielding with PureLine and AttoGuard technologies available
Superior low-leakage and low-noise measurements
Safe and accurate hands-off testing
Minimizes settling times for efficient measurements over full thermal range

See "Specifications & Details" tab for more key features

Manufactured By: FormFactor, Inc.

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Best-in-class measurement performance at a high level of automation in the lab*

The CM300xi probe station meets the measurement challenges brought on by extremely complex environments, such as unattended testing on small pads over time and at multiple temperatures. Best-in-class measurement performance is achieved for a wide range of applications in an EMI-shielded, light-tight and moisture-free test environment. Thermal management enhancements and lab automation capabilities result in improved yields and faster time to data. For cold temperature testing, FormFactor’s open IceShield™ environment is also available for the CM300xi.

The CM300xi supports Contact Intelligence™ – a unique technology which enables autonomous semiconductor test. A powerful combination of innovative system design and state-of-the-art image processing provides an operator-independent solution to achieve highly-reliable measurement data at any time and temperature.

With the material handling unit, the CM300xi probe station combines fully-automated wafer test with highest accuracy and flexibility. The system can handle up to fifty 200 or 300 mm wafers provided in SEMI-standard wafer cassettes.

The optional ReAlign™ feature offers the capability to perform “off-axis” probe to pad alignment independent from the main eVue microscope. ReAlign is the ideal tool for probe cards that do not allow viewing pads and probe tips from above. This is the case e.g. for vertical and Pyramid probe cards. The ReAlign hardware includes 2 additional cameras: the downward looking “Platen Camera” is directly integrated into the platen of the CM300xi and is used for observation of the pads; the upward looking “ChuckView Camera” is used for characterization of the probe tips. The Realign wizard allows easy and fast setup with predefined algorithms for different probe cards like Pyramid, Apollo, Cantilever, etc. ReAlign can automatically manage temperature transitions without the need for operator intervention.

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Applications

Failure Analysis
IV/CV
Reliability
RF/mmW/THz

Easy manual wafer loading

Chuck mounted on rollout stage that can be opened manually
Enables full access to the chuck and the auxiliary sites
For fast and safe manual loading and unloading of wafers

3D Manual Controls

Virtual Platen Lift and XY knobs at front
Intuitive, and precise movement of chuck in X, Y, and Z-direction
Platen Lift enables extremely rapid and intuitive way in performing many alignment tasks like setting up the contact height

Contact Intelligence Technology

High thermal stability components
On-axis probe-to-pad alignment
Automated temperature ramp
Soak time management
Enables CM300xi to sense, learn and react to multiple temperatures and small pad layouts
Provides the most accurate probe to pad alignment

Thermal Measurements

Wide range of extremly performant, reliable thermal chuck systems from ATT
Flexibility from hot only to full thermal range of -60°C to +300°C
Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
Up to 15% faster transition times than other systems in the market
Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
Field-upgradeable: grows with your needs

Automated test

Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
Enables unattended tests on small pads down to 30 μm over time and at multiple temperatures
Faster time to data

Modular design

3 performance level configurations (fully-shielded / shielded / open)
Many options to suit your budget / test needs

Choose now or upgrade later in the field:

PTPA option with chuck and platen camera
3 automation levels: Semi-automated, Fully-automated, Dual systems
Non-thermal, hot-only and full-thermal range from -60°C to 300°C

Test Productivity and Material Handling Unit

Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
Handles up to 25/50 wafers (200 or 300 mm)
SEMI-standard cassette hot-swap capability
Safe wafer handling without operator attendance
MHU301: Very compact fully-automated solution with low footprint
MHU300: Upgradable in the field to dual-prober system
Fast delivery of a wide variety of precise model parameters
Accelerated process and device development

Velox Probe Station Control Software

User-centered design minimizes training costs and enhances efficiency
Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
Comprehensive alignment functions – from simple wafer alignment and mapping to advanced probe-to-pad alignment over multiple temperatures for autonomous semiconductor test
Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
Loader integration – Easy creation of workflows and receipts and no need for any additional software
VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle

Velox Dash™

Modern User Interface with Touch Screen: Convenient probe station operation with just a touch of a finger
Access to Most Common Probe Station Functionalities: Fast and efficient probe station operation
Intuitive and Customizable to Operator’s Needs: Simplified operation, even for inexperienced users
Integrated Solution: Replaces mechanical joystick and eVue remote control