Flexibility

• DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
• Full thermal range of -60°C to +300°C
• Usage of manual and motorized positioners, probe cards within EMI-shielded environment
• Upgrade path to meet your future needs
• Stable and repeatable measurements over a wide thermal range

High accuracy and repeatability

• Reliable and repeatable contact
• Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
• Advanced EMI-shielding with PureLine and AttoGuard technologies available
• Superior low-leakage and low-noise measurements
• Safe and accurate hands-off testing
• Minimizes settling times for efficient measurements over full thermal range

Easy manual wafer loading

• Chuck mounted on rollout stage that can be opened manually
• Enables full access to the chuck and the auxiliary sites
• For fast and safe manual loading and unloading of wafers

3D Manual Controls

• Virtual Platen Lift and XY knobs at front
• Intuitive, and precise movement of chuck in X, Y, and Z-direction
• Platen Lift enables extremely rapid and intuitive way in performing many alignment tasks like setting up the contact height

Contact Intelligence Technology

• High thermal stability components
• On-axis probe-to-pad alignment
• Automated temperature ramp
• Soak time management
• Enables CM300xi to sense, learn and react to multiple temperatures and small pad layouts
• Provides the most accurate probe to pad alignment

Thermal Measurements

• Wide range of extremly performant, reliable thermal chuck systems from ATT
• Flexibility from hot only to full thermal range of -60°C to +300°C
• Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
• Up to 15% faster transition times than other systems in the market
• Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
• Field-upgradeable: grows with your needs

Automated test

• Thermally induced drift can be automatically re-aligned for 30 μm pads in a temperature range from -40°C to 150°C (the effective temperature range depends on pad size, probe card holder and probe card)
• Enables unattended tests on small pads down to 30 μm over time and at multiple temperatures
• Faster time to data

Modular design

• 3 performance level configurations (fully-shielded / shielded / open)
• Many options to suit your budget / test needs

Choose now or upgrade later in the field:

• PTPA option with chuck and platen camera
• 3 automation levels: Semi-automated, Fully-automated, Dual systems
• Non-thermal, hot-only and full-thermal range from -60°C to 300°C

Test Productivity and Material Handling Unit

• Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
• Handles up to 25/50 wafers (200 or 300 mm)
• SEMI-standard cassette hot-swap capability
• Safe wafer handling without operator attendance
• MHU301: Very compact fully-automated solution with low footprint
• MHU300: Upgradable in the field to dual-prober system
• Fast delivery of a wide variety of precise model parameters
• Accelerated process and device development

Velox Probe Station Control Software

• User-centered design minimizes training costs and enhances efficiency
• Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
• Comprehensive alignment functions – from simple wafer alignment and mapping to advanced probe-to-pad alignment over multiple temperatures for autonomous semiconductor test
• Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
• Loader integration – Easy creation of workflows and receipts and no need for any additional software
• VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle