FormFactor - Cascade DCP-HTR Series Probe - High-performance DC parametric probe
- Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
- Guarantees fully-guarded measurements to fA and fF levels
- Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
- Allows probing of different pad materials and sizes
- Fast replacement of worn probes without the need for tools
The DCP-HTR probe delivers fA-level measurement capability from -65 °C to 300 °C for advanced characterization and reliability testing. Its unique design offers superior guarding and shielding over-temperature, overcoming the high-temperature performance limitations of standard coaxial needles. When used on a probe station with a MicroChamber, the DCP-HTR allows full utilization of semiconductor parametric test instruments. The optional probe tips with small diameter are ideal for probing pads as small as 30 x 30 μm.
More Product Information
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
Three Probe Technologies
- Infinity Probe: best for Al (Si)
- ACP Probe: best for AU (III-Vs)
- |Z| Probe: robust solution (long lifetime)
- Precision contact on a wide variety of materials from 26 GHz to 67 GHz
- Accurate results with excellent crosstalk
- Matching cables and substrates included
Precise Contact Solution
- RF chuck ±3 μm surface planarity
- Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
- Precision probe alignment
- Consistent contact force and overtravel
- Stable contact performance
WinCal Calibration Software
- Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
- Automated calibration monitoring
- Unique measurement & analysis methods
- Accurate S-parameter measurements
- Automatic calibration setup for higher efficiency
- Fast and easy data interpretation and reporting
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
- Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
- Even distribution of high current with innovative multi-fingertip design
- Compatible with TESLA 200/300 mm power device characterization system
- Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
- Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
- Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
Next Generation Wafer Probing
- Continues the Infinity family’s Industry leading electrical performance
- High temperature capability (175° C +) for automotive device characterization and other applications
- Better tip visibility for enhanced placement accuracy and repeatability
- Improved tip life/durability with solid rhodium contacts
- New tip architecture enables support for narrower pitches (e.g. 25um)
- Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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