FormFactor - Cascade TESLA300 - 300 mm semi-/ fully-automated on-wafer power device characterization system
Gold-plated TESLA High-power MicroVac™ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.
The TESLA300 provides lab automation capabilities and enables high-power electrical measurements for device characterization, high-volume engineering and extremely challenging applications. It is also ideally suited in customized solutions, niche production applications, and emerging markets.
Patented AttoGuard technology built in TESLA300 significantly improves low-leakage and low-capacitance measurements. In combination with FormFactor’s patented TESLA FemtoGuard™ thermal chuck technology, the TESLA300 provides a fully guarded and shielded test environment. The high-power TESLA FemtoGuard chuck also incorporates MicroVac™ technology enabling low-contact resistance, thin wafer handling and maximum power dissipation.
Applications
- High Power
TUV-certified probing environment
- Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
- Front, side and rear opening doors for ergonomic test setup and operation
- Side panel with cable pass-through for easy equipment configuration
- Full enclosure design (no light curtain) prevents accidentally tripping the safety interlock and stopping test
Top-lift wafer loading
- Eliminates lift-pins from chuck for best-in-class power device measurements
- Provides lowest contact resistance from wafer to chuck
- Supports fully automated testing up to 10kV by eliminating arcing point
- Superior performance for vertical device measurements (no lift pin holes under device)
Rollout stage with quick access to auxiliary sites
- Full wafer access via locking roll-out stage
- Two patented auxiliary chucks
- Auxiliary chucks: High voltage 10 kV compatible multi-purpose mounts for substrates (cleaning, contact)
- Automated probe cleaning capabilities
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
Connection panels
- Coaxial, triaxial, and pin jack feed-troughs available
- Limit cable strain and motion for measurement stability
- Instrument stays connected to back of panel
- Probe connection made at front of panel
- Simple to re-arrange cabling when needed
Seamless Integration
- Convenient instrument connection kits
- Seamless integration between Velox and analyzers/measurement software
- Easy and safe system integration with Keysight and Keithley power device analyzers
3D Manual Controls
- Virtual Platen Lift and XY knobs at front
- Intuitive, and precise movement of chuck in X, Y, and Z-direction
- Platen Lift enables extremely rapid and intuitive way in performing many alignment tasks like setting up the contact height
Material Handling Unit (MHU301)
- For fast handling of 200/300 mm wafers
- Load/unload wafer to hot/cold chuck (-60° C to +300° C)
- Integrated pre-aligner for flat/notch detection
- Barcode/2D Matrix code/OCR wafer code recognition from both sides (option)
- Quick Access Port option for higher throughput and additional wafer storage
- SEMI-compliant load port for up to 25 wafers
- For FOUP and FOSB 300 mm wafer cassettes
Thermal Measurements
- Wide range of extremly performant, reliable thermal chuck systems from ATT
- Flexibility from hot only to full thermal range of -60°C to +300°C
- Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
- Up to 15% faster transition times than other systems in the market
- Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
- Field-upgradeable: grows with your needs
Remote operation from home or anywhere in the world
- Safely and easily place probes down in contact with the test pads (full capability with motorized positioners)
- Safely move the wafer to different test sites
- View and manage live microscope viewing of the probes and the wafer
- View Wafer Map test plans
- Initiate remote test programs to gather and analyze test data
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
- Comprehensive alignment functions – from simple wafer alignment and mapping to advanced probe-to-pad alignment over multiple temperatures for autonomous semiconductor test
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
- Modern User Interface with Touch Screen: Convenient probe station operation with just a touch of a finger
- Access to Most Common Probe Station Functionalities: Fast and efficient probe station operation
- Intuitive and Customizable to Operator’s Needs: Simplified operation, even for inexperienced users
- Integrated Solution: Replaces mechanical joystick and eVue remote control
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More Product Information
Floating Action Buttons
- Easy and fast setup of camera views
- Go to Light and Image Settings of the selected camera view with only one mouse click
Workflow Wizard
- Guided workflows for wafer setups, alignment tools and Autonomous Assistants
- Workflow wizard shows task-relevant settings and options only
- Wizard settings can be corrected anytime – no need to restart the wizard
- Wizard helps with intelligent solutions in case of error
See "Specifications & Details" tab for more key features
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
Flexibility
- Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
- Re-configurable and upgradable as requirements grow
- Minimizes setup times with no loss in performance or accuracy
- Seamless integration of various measurement instruments
Stability
- Solid station frame
- Built-in vibration-isolation solution for superior vibration attenuation
- Rigid microscope bridge
- Compact and rigid mechanical design
- Highly accurate measurement results
- Incorporates best-known methods
Ease of Use
- Ergonomic and straightforward design for comfortable and easy operation
- Low-profile design
- Simple microscope operation
- Quick and ergonomic change of DUT through pull-out stage
- Minimize training efforts
- Fast time to data
- Convenient operation
Flexibility
- DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
- Full thermal range of -60°C to +300°C
- Compatible with TopHat or IceShield
- Usage of manual and motorized positioners, probe cards within EMI-shielded environment
- Upgrade path to meet your future needs
- Stable and repeatable measurements over a wide thermal range
High accuracy and repeatability
- Reliable and repeatable contact
- Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
- Advanced EMI-shielding with PureLine and AttoGuard technologies available
- Superior low-leakage and low-noise measurements
- Safe and accurate hands-off testing
- Minimizes settling times for efficient measurements over full thermal range
See "Specifications & Details" tab for more key features
PureLine 3 Technology
- Provides an effectively noise free environment around the device under test (DUT)
- First automated probe station to achieve -190dB spectral noise*
- Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
- Eliminates over 97% of the environmental noise experienced in previous probe systems
- Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP
Plug In and Go
- World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
- Eliminates all ground-loop induced TestCell noise
- Low field emissions
- Provides fully managed and filtered AC power to the entire system, prober and instruments
See "Specifications & Details" tab for more key features
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
OptoVue
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
Horizontal Die-Level Edge Coupling
- Highest accuracy in test results
- Lowest coupling loss
- Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
- Reduced risk of damaging fibers with collision avoidance technology
- Ease of use for less experienced users
- Enables close simulation of real-world conditions with device performance closest to the final application
See "Specifications & Details" tab for more key features
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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