FormFactor - Cascade TESLA300 - 300 mm semi-/ fully-automated on-wafer power device characterization system
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
See more Key Features on Specifications & Details tab
The TESLA300 Advanced On-Wafer Power Semiconductor Probe System is an integrated high-power test solution that enables collection of accurate high-voltage and high-current measurement data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current), with complete operator safety.
The TESLA300 provides lab automation capabilities and enables high-power electrical measurements for device characterization, high-volume engineering and extremely challenging applications. It is also ideally suited in customized solutions, niche production applications, and emerging markets.
Patented AttoGuard technology built in TESLA300 significantly improves low-leakage and low-capacitance measurements. In combination with FormFactor’s patented TESLA FemtoGuard™ thermal chuck technology, the TESLA300 provides a fully guarded and shielded test environment. The high-power TESLA FemtoGuard chuck also incorporates MicroVac™ technology enabling low-contact resistance, thin wafer handling and maximum power dissipation.
Applications
- High Power
Gold-plated TESLA High-power MicroVac™ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
TUV-certified probing environment
- Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
- Front, side and rear opening doors for ergonomic test setup and operation
- Side panel with cable pass-through for easy equipment configuration
- Full enclosure design (no light curtain) prevents accidentally tripping the safety interlock and stopping test
Top-lift wafer loading
- Eliminates lift-pins from chuck for best-in-class power device measurements
- Provides lowest contact resistance from wafer to chuck
- Supports fully automated testing up to 10kV by eliminating arcing point
- Superior performance for vertical device measurements (no lift pin holes under device)
Rollout stage with quick access to auxiliary sites
- Full wafer access via locking roll-out stage
- Two patented auxiliary chucks
- Auxiliary chucks: High voltage 10 kV compatible multi-purpose mounts for substrates (cleaning, contact)
- Automated probe cleaning capabilities
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
Connection panels
- Coaxial, triaxial, and pin jack feed-troughs available
- Limit cable strain and motion for measurement stability
- Instrument stays connected to back of panel
- Probe connection made at front of panel
- Simple to re-arrange cabling when needed
Seamless Integration
- Convenient instrument connection kits
- Seamless integration between Velox and analyzers/measurement software
- Easy and safe system integration with Keysight and Keithley power device analyzers
3D Manual Controls
- Virtual Platen Lift and XY knobs at front
- Intuitive, and precise movement of chuck in X, Y, and Z-direction
- Platen Lift enables extremely rapid and intuitive way in performing many alignment tasks like setting up the contact height
Material Handling Unit (MHU301)
- For fast handling of 200/300 mm wafers
- Load/unload wafer to hot/cold chuck (-60° C to +300° C)
- Integrated pre-aligner for flat/notch detection
- Barcode/2D Matrix code/OCR wafer code recognition from both sides (option)
- Quick Access Port option for higher throughput and additional wafer storage
- SEMI-compliant load port for up to 25 wafers
- For FOUP and FOSB 300 mm wafer cassettes
Thermal Measurements
- Wide range of extremly performant, reliable thermal chuck systems from ATT
- Flexibility from hot only to full thermal range of -60°C to +300°C
- Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
- Up to 15% faster transition times than other systems in the market
- Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
- Field-upgradeable: grows with your needs
Remote operation from home or anywhere in the world
- Safely and easily place probes down in contact with the test pads (full capability with motorized positioners)
- Safely move the wafer to different test sites
- View and manage live microscope viewing of the probes and the wafer
- View Wafer Map test plans
- Initiate remote test programs to gather and analyze test data
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
- Comprehensive alignment functions – from simple wafer alignment and mapping to advanced probe-to-pad alignment over multiple temperatures for autonomous semiconductor test
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
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More Product Information
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
See more Key Features on Specifications & Details tab
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Comprehensive I/O connections: Standard setup of up to 24 RF lines (up to 20 GHz) and 48 DC lines, with extensions to higher I/O connections possible.
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Non-magnetic construction: Capable of characterizing qubits below 50 mK without magnetic interference when required.
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Sample size: Proven with chips up to 10×10 mm in size.
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Pressure-based contact: Connect test and measurement I/O to DUT pads using pressure only. No permanent connection required.
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Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
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Reduced unwanted couplings and transmission modes
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Able to shrink pad geometries to 25 x 35 µm (best case)
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Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
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WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight A-LFNA for On-wafer R&D Advanced Low-Frequency Noise Measurements
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
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Coaxial and triaxial measurements up to 10,000 V
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High-quality construction with low-noise electrical performance
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Replaceable probe tips in a variety of tip sizes
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Temperature range of -60°C to 300°C
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Triaxial measurement ensures a much better understanding of device leakage in the off state
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Highly reliable, stable and repeatable measurements
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Integrally designed as part of a complete measurement solution
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Long holding time: 80 hours with 10 STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line
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Sample can be loaded or removed when the cryostat is cold
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Low noise, low vibration
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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