FormFactor - Cascade DC-Q Probe - Multi-contact DC probe with flat tip needles
-
Power bypass inductance: 8 nH
-
Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
-
Supports collinear and non-standard needle configurations
-
Up to 16 DC for standard; maximum of 24 DC for custom
-
Ideal for probing the entire circuit for functional test
-
DC probes can provide power or slow logic to circuit under test
The DCQ probes use controlled impedance, ceramic blade needles for low noise and high performance. This needle style allows the placement of high-quality bypass capacitors with very little series inductance due to their close proximity to the probe tip. All of the needles are connected to a common ground plane but individual needles can be easily (ground) isolated for additional low noise performance. A maximum of 16 needles are available for standard configurations and a maximum of 24 needles for custom configurations.
More Product Information
The PPE6KV-A and HVP120 can handle up to 6000 Vpeak transient overvoltages and are designed for probing up to 2000 Vrms and 1000 Vrms respectively. Fast rise times, excellent frequency response, and a variety of standard accessories make these probes safe and ideal for high voltage measurement applications
-
Low insertion loss
-
Low contact resistance
-
Lithographically defined probe tip
-
Nickel contacts
-
Power bypass inductance: 8 nH
-
Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
-
Supports collinear and non-standard needle configurations
-
Up to 16 DC for standard; maximum of 24 DC for custom
-
Ideal for probing the entire circuit for functional test
-
DC probes can provide power or slow logic to circuit under test
-
Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
-
Temperatures range from -60°C to +300°C
-
Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
-
Low Thermal Resistance Technology
-
MultiSense with multiple temperature sensors
-
Isolated from ground
-
Includes a jack for grounding and biasing
-
Advanced wafer vacuum system for warped/partial thin wafers
-
Provides uniform vacuum across the entire wafer surface
-
Advanced shielding technology
-
High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
-
RF bandwidth to 500 MHz
-
Long probe life: > 250,000 contacts
-
Beryllium-copper tips for gold pads or tungsten for aluminum pads
-
Oscillation-free testing of wide-bandwidth analog circuits
-
Use with ACP series probes to provide functional at-speed testing for known-good-die
-
Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
-
Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
-
Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
-
DC to 110 GHz models available in single and dual line versions
-
Low insertion and return loss with ultra-low-loss ( -L ) versions
-
Excellent crosstalk characteristics
-
Wide operating temperature -65 ° C to + 200 ° C
-
Wide range of pitches available, from 50 to 1250 µm
-
Individually supported contacts
-
Reduced contact (RC) probe tips for small pads
-
BeCu tip provides rugged, repeatable contact on gold pads
- Provides a passive PCIe® backplane for test applications
- Self-contained, portable and self-powered
- Supplies power for +3.3V, +3.3Vaux and +12V rails
- Generates PCIe reference clock
- Accepts external clock inputs
- Generates valid PERST# bus reset that can be activated by manual push button
- Includes two mid-bus probe footprints for traffic monitoring
- Supports two PCIe x16 sockets which accept cards of any link width (x1, x4, x8, x16)
- Provides indication of valid connection of PRSNT1# and PRSNT2# lines for each card
- Supports data rates of 2.5 GT/s and 5.0 GT/s
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000