OptoVue

• Revolutionary technology advancement for wafer and die-level photonics probing
• Real-time in-situ calibrations
• Singulated die testing
• True die-level edge coupling
• In-situ power measurements
• Advanced calibration technologies
• Enables autonomous measurements

Horizontal Die-Level Edge Coupling

• Highest accuracy in test results
• Lowest coupling loss
• Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
• Reduced risk of damaging fibers with collision avoidance technology
• Ease of use for less experienced users
• Enables close simulation of real-world conditions with device performance closest to the final application

See "Specifications & Details" tab for more key features

• Designed for use with specific Probe Systems
• Tables to suit all facility requirements and applications
• Stable probing, even in submicron range
• Granite platen ensures rigidity and temperature stability
• Can be combined with the Shield Enclosures

SlimVue Microscope

• Combined eye-pieces and CCD camera mount
• 3x zoom and quick lens exchange
• Quick lens exchange
• 1 um optical resolution
• Minimized scope footprint
• Fast change from navigation optics to high-resolution optics
• Resolving ‹ 50 μm pads
• Simple integration with any mmW modules

Application Specific Sigma Kits

• Engraved guides on mmW platen
• Supports broadband, load pull, coax RF and banded waveguide configuration
• Optical feedback on platen position (gauge)
• Adaptable to any mmW/sub-THz applications
• Seamless integration with any mmW modules and tuners
• Fast mounting and setup change

THz measurement capability

• Rock-solid mechanical design
• Submicron stage accuracy
• Optical feedback on platen and probe position (gauge)
• Motorized positioner
• <+-1 um separation repeatability
• Micrometer-accurate and repeatable probe placement and overtravel
• Highly-precise and stable THz measurements

Flexibility

• Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
• Re-configurable and upgradable as requirements grow
• Minimizes setup times with no loss in performance or accuracy
• Seamless integration of various measurement instruments

Stability

• Solid station frame
• Built-in vibration-isolation solution for superior vibration attenuation
• Rigid microscope bridge
• Compact and rigid mechanical design
• Highly accurate measurement results
• Incorporates best-known methods

Ease of Use

• Ergonomic and straightforward design for comfortable and easy operation
• Low-profile design
• Simple microscope operation
• Quick and ergonomic change of DUT through pull-out stage
• Minimize training efforts
• Fast time to data
• Convenient operation

PureLine 3 Technology

• Provides an effectively noise free environment around the device under test (DUT)
• First automated probe station to achieve -190dB spectral noise*
• Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
• Eliminates over 97% of the environmental noise experienced in previous probe systems
• Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP

Plug In and Go

• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Eliminates all ground-loop induced TestCell noise
• Low field emissions
• Provides fully managed and filtered AC power to the entire system, prober and instruments

See "Specifications & Details" tab for more key features

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with TESLA 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

• Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
• Guarantees fully-guarded measurements to fA and fF levels
• Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
• Allows probing of different pad materials and sizes
• Fast replacement of worn probes without the need for tools

More than a calibration tool

• Calibration
• Validation
• Measurement
• Analysis

No one supports more VNA’s

• Support of more than 24 of the most common VNA’s

Tool for the novice

• Guided wizards and multimedia tutorials integrated
• Intelligence in setups

See "Specifications & Details" tab for more key features