FormFactor - Cascade WPH Probe - Multi-contact DC probe with full-radius needles
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Full-radius, nickel-plated tungsten needles
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Power bypass inductance: 16 nH
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Supports collinear and non-standard needle configurations
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Support up to a maximum of 12 ceramic blades DC needles / contacts
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
The WPH probes feature up to 12 ceramic-bladed, nickel-plated, tungsten needles with a 2 x 12 square pin cable interface. The circuit board has been laid out such that both series and shunt components can be added to the signal path of each needle.
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More Product Information
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Different substrate carriers for wafers up to 100 mm or single dies
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Up to six positioners
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Independently cooled cold shield
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Probe positioners placed inside vacuum chamber
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Ergonomic and straightforward design
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Simple microscope operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
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High-quality construction with low-noise electrical performance
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Kelvin version for convenient 4-point measurements
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Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
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SSMC 50 connectors
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Ultra-low, fA and fF measurements from -65 º C to 150 º C
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Power bypass inductance: 8 nH
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Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
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Supports collinear and non-standard needle configurations
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Up to 16 DC for standard; maximum of 24 DC for custom
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Ideal for probing the entire circuit for functional test
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DC probes can provide power or slow logic to circuit under test
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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Joystick controller
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Manual probe positioners with rotary feed-throughs
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer
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User-centered design minimizes training costs and enhances efficiency
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
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Customizable sample space to fit the user’s application
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Long holding time: 100 hours for six (6) STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line; +/- 0.5 mK at base temperature
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Low noise
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage
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Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
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Online design configuration tool helps you to specify your probe in minutes
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All designs are fully quadrant compatible
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Full solution includes probes, calibration substrates, stations, accessories and software
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Scalable architecture for future needs
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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