FormFactor - Cascade Multiline TRL Cal Substrates - Multiline TRL substrates for T-Wave probes
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
Millimeter- and submillimeter-wave calibration substrates, optimized for T-Wave™ probes. The multiline TRL calibration substrates offer CPW standards including reflect (short), thru and two lines and are recommended to use with WinCal™ calibration software. Some off-set short and off-set open structures are included for additional measurements.
Models
|
Part Number |
Description |
Pitch (μm) |
|---|---|---|
|
Multi-line TRL Substrate, WR1.0, WR2.2, WR3.4, WR4.3, WR5.1 |
25 |
|
|
Multi-line TRL Substrate, WR2.2, WR3.4, WR4.3, WR5.1 |
50 |
|
|
Multi-line TRL Substrate, WR3.4, WR4.3, WR5.1 |
75 and 100 |
More Product Information
Flexibility
- DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
- Full thermal range of -60°C to +300°C
- Compatible with TopHat or IceShield
- Usage of manual and motorized positioners, probe cards within EMI-shielded environment
- Upgrade path to meet your future needs
- Stable and repeatable measurements over a wide thermal range
High accuracy and repeatability
- Reliable and repeatable contact
- Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
- Advanced EMI-shielding with PureLine and AttoGuard technologies available
- Superior low-leakage and low-noise measurements
- Safe and accurate hands-off testing
- Minimizes settling times for efficient measurements over full thermal range
See "Specifications & Details" tab for more key features
Next Generation Wafer Probing
- Continues the Infinity family’s Industry leading electrical performance
- High temperature capability (175° C +) for automotive device characterization and other applications
- Better tip visibility for enhanced placement accuracy and repeatability
- Improved tip life/durability with solid rhodium contacts
- New tip architecture enables support for narrower pitches (e.g. 25um)
- Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
Cryogenic Temperatures
- Fully isolated experiment space for true 4K temperatures during probing
- Cryogenic positioners to provide large travel ranges without warming up the device
- Integrated helium pot for high temperature stability of the device under test
- Fully dry cryogen-free cooler eliminates the need for expensive helium circulation systems
- Rapid cool liquid nitrogen option for faster cool down times
See "Specifications & Details" tab for more key features
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
See more Key Features on Specifications & Details tab
- Choice of Series resistance or Termination (signal line to ground)
- Use of High Performance RF Resistors
- Choice of Resistor values available
- Choice of body styles, Infinity, ACP or FPC
- Can help to stabilize oscillations in high-gain devices
- Impedance match to low dynamic resistance laser diodes
- Custom configured for your application
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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Accessories available, such as black bodies and optical motion analysis tools
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
- Power bypass inductance: 8 nH
- Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
- Supports collinear and non-standard needle configurations
- Up to 16 DC for standard; maximum of 24 DC for custom
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
- High-quality construction with low-noise electrical performance
- Kelvin version for convenient 4-point measurements
- Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
- SSMC 50 connectors
- Ultra-low, fA and fF measurements from -65 º C to 150 º C
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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