FormFactor - Cascade Multiline TRL Cal Substrates - Multiline TRL substrates for T-Wave probes
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
Millimeter- and submillimeter-wave calibration substrates, optimized for T-Wave™ probes. The multiline TRL calibration substrates offer CPW standards including reflect (short), thru and two lines and are recommended to use with WinCal™ calibration software. Some off-set short and off-set open structures are included for additional measurements.
Models
|
Part Number |
Description |
Pitch (μm) |
|---|---|---|
|
Multi-line TRL Substrate, WR1.0, WR2.2, WR3.4, WR4.3, WR5.1 |
25 |
|
|
Multi-line TRL Substrate, WR2.2, WR3.4, WR4.3, WR5.1 |
50 |
|
|
Multi-line TRL Substrate, WR3.4, WR4.3, WR5.1 |
75 and 100 |
More Product Information
FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
- Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
- Even distribution of high current with innovative multi-fingertip design
- Compatible with TESLA 200/300 mm power device characterization system
- Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
- Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
- Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
- Coaxial and triaxial measurements up to 10,000 V
- High-quality construction with low-noise electrical performance
- Replaceable probe tips in a variety of tip sizes
- Temperature range of of -60°C to 300°C
- Triaxial measurement ensures a much better understanding of device leakage in the off state
- Highly reliable, stable and repeatable measurements
- Integrally designed as part of a complete measurement solution
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
- Choice of Series resistance or Termination (signal line to ground)
- Use of High Performance RF Resistors
- Choice of Resistor values available
- Choice of body styles, Infinity, ACP or FPC
- Can help to stabilize oscillations in high-gain devices
- Impedance match to low dynamic resistance laser diodes
- Custom configured for your application
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
PureLine 3 Technology
- Provides an effectively noise free environment around the device under test (DUT)
- First automated probe station to achieve -190dB spectral noise*
- Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
- Eliminates over 97% of the environmental noise experienced in previous probe systems
- Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP
Plug In and Go
- World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
- Eliminates all ground-loop induced TestCell noise
- Low field emissions
- Provides fully managed and filtered AC power to the entire system, prober and instruments
See "Specifications & Details" tab for more key features
- Designed for use with specific Probe Systems
- Tables to suit all facility requirements and applications
- Stable probing, even in submicron range
- Granite platen ensures rigidity and temperature stability
- Can be combined with the Shield Enclosures
OptoVue
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
Horizontal Die-Level Edge Coupling
- Highest accuracy in test results
- Lowest coupling loss
- Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
- Reduced risk of damaging fibers with collision avoidance technology
- Ease of use for less experienced users
- Enables close simulation of real-world conditions with device performance closest to the final application
See "Specifications & Details" tab for more key features
FormFactor, Inc.
Website
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
