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FormFactor - Cascade Multiline TRL Cal Substrates - Multiline TRL substrates for T-Wave probes
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
Millimeter- and submillimeter-wave calibration substrates, optimized for T-Wave™ probes. The multiline TRL calibration substrates offer CPW standards including reflect (short), thru and two lines and are recommended to use with WinCal™ calibration software. Some off-set short and off-set open structures are included for additional measurements.
Models
|
Part Number |
Description |
Pitch (μm) |
|---|---|---|
|
Multi-line TRL Substrate, WR1.0, WR2.2, WR3.4, WR4.3, WR5.1 |
25 |
|
|
Multi-line TRL Substrate, WR2.2, WR3.4, WR4.3, WR5.1 |
50 |
|
|
Multi-line TRL Substrate, WR3.4, WR4.3, WR5.1 |
75 and 100 |
More Product Information
All tools in one belt
- Calibration
- Validation
- Measurement
- Analysis
Advanced functionality
- Multi-Port Hybrid Cals
- Enhanced Verification and Reports
- Post Processing and Sequencing
Get started
- Guided wizards and multimedia tutorials integrated
- Intelligence in setups
Flexible setups
- Standalone for manual probe stations
- Fully integrated in Velox Probe station control software
- Workspaces to build custom configurations that include selected combinations of system setup files, calibration setup files, and reports
- Support of more than 24 of the most common VNA’s
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
- Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
- Reduced unwanted couplings and transmission modes
- Able to shrink pad geometries to 25 x 35 µm (best case)
- Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
- WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.
SlimVue Microscope
- Combined eye-pieces and CCD camera mount
- 3x zoom and quick lens exchange
- Quick lens exchange
- 1 um optical resolution
- Minimized scope footprint
- Fast change from navigation optics to high-resolution optics
- Resolving ‹ 50 μm pads
- Simple integration with any mmW modules
Application Specific Sigma Kits
- Engraved guides on mmW platen
- Supports broadband, load pull, coax RF and banded waveguide configuration
- Optical feedback on platen position (gauge)
- Adaptable to any mmW/sub-THz applications
- Seamless integration with any mmW modules and tuners
- Fast mounting and setup change
THz measurement capability
- Rock-solid mechanical design
- Submicron stage accuracy
- Optical feedback on platen and probe position (gauge)
- Motorized positioner
- <+-1 um separation repeatability
- Micrometer-accurate and repeatable probe placement and overtravel
- Highly-precise and stable THz measurements
PureLine 3 Technology
- Provides an effectively noise free environment around the device under test (DUT)
- First automated probe station to achieve -190dB spectral noise*
- Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
- Eliminates over 97% of the environmental noise experienced in previous probe systems
- Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP
Plug In and Go
- World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
- Eliminates all ground-loop induced TestCell noise
- Low field emissions
- Provides fully managed and filtered AC power to the entire system, prober and instruments
See "Specifications & Details" tab for more key features
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
-
Best price per contact – typically over one million (1,000,000) touchdowns
-
RF/Microwave signal is shielded and completely air isolated in the probe body
-
Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
-
Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
-
Probe on any pad material with minimal damage
OptoVue
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
Horizontal Die-Level Edge Coupling
- Highest accuracy in test results
- Lowest coupling loss
- Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
- Reduced risk of damaging fibers with collision avoidance technology
- Ease of use for less experienced users
- Enables close simulation of real-world conditions with device performance closest to the final application
See "Specifications & Details" tab for more key features
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
