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FormFactor - Cascade Multiline TRL Cal Substrates - Multiline TRL substrates for T-Wave probes
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
Millimeter- and submillimeter-wave calibration substrates, optimized for T-Wave™ probes. The multiline TRL calibration substrates offer CPW standards including reflect (short), thru and two lines and are recommended to use with WinCal™ calibration software. Some off-set short and off-set open structures are included for additional measurements.
Models
|
Part Number |
Description |
Pitch (μm) |
|---|---|---|
|
Multi-line TRL Substrate, WR1.0, WR2.2, WR3.4, WR4.3, WR5.1 |
25 |
|
|
Multi-line TRL Substrate, WR2.2, WR3.4, WR4.3, WR5.1 |
50 |
|
|
Multi-line TRL Substrate, WR3.4, WR4.3, WR5.1 |
75 and 100 |
More Product Information
- Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
- Guarantees fully-guarded measurements to fA and fF levels
- Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
- Allows probing of different pad materials and sizes
- Fast replacement of worn probes without the need for tools
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
-
Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
-
High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
- Maximized Field-of-View with Ultra-Sharp Image Quality
- Slim Design
- Patent-Pending Crash Protection
- Intelligent Lens Mount
- Application Flexibility
- Seamless Integration with Velox Probe Station Control Software
- Autonomous Measurement Assistants
- Remote Operation
See "Specifications & Details" tab for more information
- High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
- RF bandwidth to 500 MHz
- Long probe life: > 250,000 contacts
- Beryllium-copper tips for gold pads or tungsten for aluminum pads
- Oscillation-free testing of wide-bandwidth analog circuits
- Use with ACP series probes to provide functional at-speed testing for known-good-die
- Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
- Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
Flexibility
- Different substrate carriers for wafers up to 100 mm or single dies
- Up to six positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
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Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
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DC to 110 GHz models available in single and dual line versions
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Low insertion and return loss with ultra-low-loss ( -L ) versions
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Excellent crosstalk characteristics
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Wide operating temperature -65 ° C to + 200 ° C
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Wide range of pitches available, from 50 to 1250 µm
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Individually supported contacts
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Reduced contact (RC) probe tips for small pads
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BeCu tip provides rugged, repeatable contact on gold pads
High flexibility
- Re-configurable for DC, RF, mmW, FA, WLR and more
- Thermal range: -60˚C to 300˚C available
- Upgrade path to meet your future needs
- Stable and repeatable measurements over a wide thermal range
See "Specifications & Details" tab for more key features
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
