• Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
• Application flexibility, ideal for use in high frequency applications
• Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
• Suitable for integration with vibration isolating tables

High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

• High-quality construction with low-noise electrical performance
• Kelvin version for convenient 4-point measurements
• Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
• SSMC 50 connectors
• Ultra-low, fA and fF measurements from -65 º C to 150 º C

• Maximized Field-of-View with Ultra-Sharp Image Quality
• Slim Design
• Patent-Pending Crash Protection
• Intelligent Lens Mount
• Application Flexibility
• Seamless Integration with Velox Probe Station Control Software
• Autonomous Measurement Assistants
• Remote Operation

See "Specifications & Details" tab for more information

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

PureLine 3 Technology

• Provides an effectively noise free environment around the device under test (DUT)
• First automated probe station to achieve -190dB spectral noise*
• Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
• Eliminates over 97% of the environmental noise experienced in previous probe systems
• Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP

Plug In and Go

• World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
• Eliminates all ground-loop induced TestCell noise
• Low field emissions
• Provides fully managed and filtered AC power to the entire system, prober and instruments

See "Specifications & Details" tab for more key features

• Revolutionary technology advancement for wafer and die-level photonics probing
• Real-time in-situ calibrations
• Singulated die testing
• True die-level edge coupling
• In-situ power measurements
• Advanced calibration technologies
• Enables autonomous measurements

See "Specifications & Details" tab for more key features