The Low Frequency Tuner (LFT) is a unique product technology using M algorithms for low frequency wideband tuning. Three or more cascaded tuning sections use series transmission cables and parallel rotary capacitors. The length of the cables and number of tuning sections are optimized for maximum tuning range over a given bandwidth. HLFT tuners use 6 tuning sections allowing second harmonic frequency tuning.

The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.

• Substrate material: High-resistivity silicon
• Substrate thickness: 275 µm
• Dielectric constant: 11.8
• Nominal Z0: 50 Ω

• Choice of Series resistance or Termination (signal line to ground)
• Use of High Performance RF Resistors
• Choice of Resistor values available
• Choice of body styles, Infinity, ACP or FPC
• Can help to stabilize oscillations in high-gain devices
• Impedance match to low dynamic resistance laser diodes
• Custom configured for your application

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

Optimized Measurement Setup

• Multi-purpose SIGMA instrument integration kit
• Shorter cabling and universal chuck connection
• Triax probe with protected guard
• Optimized signal path
• Safe probe tip exchange
• Seamless integration of various analyzers

High Power Chuck

• Triax design for low-leakage measurements up to 3 kV
• Special chuck surface coating
• High-isolation ready
• High-current measurement up to 100 A with lowest contact resistance
• Optional upgrade for 10 kV (coax) operating voltage
• Thin wafer handling capability

Safe Operation

• Arcing protection
• Shield Enclosure with interlock
• Advanced grounding concept
• Maximum protection from high-voltage shock for users and devices
• Common ground protection for all instruments
• EMI/light-tight shielded environment

• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

• Power bypass inductance: 8 nH
• Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
• Supports collinear and non-standard needle configurations
• Up to 16 DC for standard; maximum of 24 DC for custom
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

• Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
• Reduced unwanted couplings and transmission modes
• Able to shrink pad geometries to 25 x 35 µm (best case)
• Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
• WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.