Three Probe Technologies

• Infinity Probe: best for Al (Si)
• ACP Probe: best for AU (III-Vs)
• |Z| Probe: robust solution (long lifetime)
• Precision contact on a wide variety of materials from 26 GHz to 67 GHz
• Accurate results with excellent crosstalk
• Matching cables and substrates included

Precise Contact Solution

• RF chuck ±3 μm surface planarity
• Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
• Precision probe alignment
• Consistent contact force and overtravel
• Stable contact performance

WinCal Calibration Software

• Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
• Automated calibration monitoring
• Unique measurement & analysis methods
• Accurate S-parameter measurements
• Automatic calibration setup for higher efficiency
• Fast and easy data interpretation and reporting

Cryogenic Temperatures

• Fully isolated experiment space for true 4K temperatures during probing
• Cryogenic positioners to provide large travel ranges without warming up the device
• Integrated helium pot for high temperature stability of the device under test
• Fully dry cryogen-free cooler eliminates the need for expensive helium circulation systems
• Rapid cool liquid nitrogen option for faster cool down times

See "Specifications & Details" tab for more key features

The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.

Customized Solutions for a Variety of Challenging Applications

We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.

Flexibility

• Different substrate carriers for wafers up to 100 mm or single dies
• Up to six positioners
• Use with liquid nitrogen or helium, depending on the target temperature
• Probing with an open chamber lid possible under atmospheric condition
• Specially designed for laboratory environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

Superior Mechanics

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments
• Excellent measurement accuracy and repeatability
• Fast navigation and high-precision probe positioning

See "Specifications & Details" tab for more key features

Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight PDA for On-wafer R&D Power Semiconductor Device Characterization Measurements

• Lithographic thin-film construction
• Excellent crosstalk characteristics
• Non-oxidizing nickel alloy tips
• Innovative force delivery mechanism
• 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
• GSG, SG, GS, GSGSG, GSSG, SGS configurations
• 50 to 250 µm pitches (other pitches available on request)
• High current version (2 A) available

Advantages

• Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
• Superior measurement accuracy and repeatability
• Small scrub minimizes damage to aluminum pad
• Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
• Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)