FormFactor - Cascade QuadCard™ - Cost-effective, versatile probe card solution
- Accommodates a combination of up to four Cascade Microtech probes
- Configurable for mixed-signal RF/mmW testing
- Quick and easy repairs to be performed in the field, by simply replacing individual probes
- Adaptable to new device layouts by exchanging individual probes
The QuadCard probe card is the industry’s first configurable, multi-quadrant probe adapter that employs innovative fine probe aligners to mount up to four FormFactor probes on a single probe card. It is designed to accommodate a combination of our probes such as Infinity Probes®, ACP probes, |Z| Probes® and Multi-|Z| Probes, which are aligned individually by the fine probe aligners.
More Product Information
- Full-radius, nickel-plated tungsten needles
- Power bypass inductance: 16 nH
- Supports collinear and non-standard needle configurations
- Support up to a maximum of 12 ceramic blades DC needles / contacts
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.
Three Probe Technologies
- Infinity Probe: best for Al (Si)
- ACP Probe: best for AU (III-Vs)
- |Z| Probe: robust solution (long lifetime)
- Precision contact on a wide variety of materials from 26 GHz to 67 GHz
- Accurate results with excellent crosstalk
- Matching cables and substrates included
Precise Contact Solution
- RF chuck ±3 μm surface planarity
- Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
- Precision probe alignment
- Consistent contact force and overtravel
- Stable contact performance
WinCal Calibration Software
- Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
- Automated calibration monitoring
- Unique measurement & analysis methods
- Accurate S-parameter measurements
- Automatic calibration setup for higher efficiency
- Fast and easy data interpretation and reporting
High flexibility
- Re-configurable for DC, RF, mmW, FA, WLR and more
- Thermal range: -60˚C to 300˚C available
- Upgrade path to meet your future needs
- Stable and repeatable measurements over a wide thermal range
See "Specifications & Details" tab for more key features
Optimized Measurement Setup
- Multi-purpose SIGMA instrument integration kit
- Shorter cabling and universal chuck connection
- Triax probe with protected guard
- Optimized signal path
- Safe probe tip exchange
- Seamless integration of various analyzers
High Power Chuck
- Triax design for low-leakage measurements up to 3 kV
- Special chuck surface coating
- High-isolation ready
- High-current measurement up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
Safe Operation
- Arcing protection
- Shield Enclosure with interlock
- Advanced grounding concept
- Maximum protection from high-voltage shock for users and devices
- Common ground protection for all instruments
- EMI/light-tight shielded environment
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
See more Key Features on Specifications & Details tab
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight Photonics Application
PureLine 3 Technology
- Provides an effectively noise free environment around the device under test (DUT)
- First automated probe station to achieve -190dB spectral noise*
- Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
- Eliminates over 97% of the environmental noise experienced in previous probe systems
- Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP
Plug In and Go
- World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
- Eliminates all ground-loop induced TestCell noise
- Low field emissions
- Provides fully managed and filtered AC power to the entire system, prober and instruments
See "Specifications & Details" tab for more key features
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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