FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
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Enables wafer probing up to 100 A pulsed and 10A DC
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Innovative multi-fingertip design provides even distribution of current
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Supports up to 500 V
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Replaceable Tungsten probe tips
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Temperature range of -60°C to 300°C
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Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
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Prevents against thermal runaway
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Measure devices on wafer at higher currents than ever before
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Small scrub minimizes damage to aluminum pad
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Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
More Product Information
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2 kV CAT safety rated
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Only 1500 Vdc safety rated probe per IEC/EN 61010-031:2015
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Exceptional common-mode rejection ratio (CMRR) across a broad frequency range
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1% gain accuracy
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High offset capability at both high and low attenuation
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AC or DC coupling
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ProBus active probe interface with automatic scaling
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Auto-zero capabilities
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Wide oscilloscope compatibility
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Customizable sample space to fit the user’s application
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Long holding time: 100 hours for six (6) STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line; +/- 0.5 mK at base temperature
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Low noise
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
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Extended Battery Pack with Extreme High Temperature Batteries
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
- Support for the highest speeds available in CoaXPress 2.0
- Connect to and capture from up to four cameras or combine connections for even higher data rates
- Simplify cabling with PoCXP support between cameras and vision computer
- Offload host computer of custom image processing using a field-programmable gate array (FPGA) device
- Distribute image processing workload across multiple computers through data forwarding capability
- Synchronize with sensors, encoders, and controllers with ample auxiliary I/Os for each CoaXPress connection
- Use license fingerprint for Aurora Imaging Library and avoid the need for a separate hardware key
- Monitor and troubleshoot acquisition performance in detail using Aurora Gecho event-logging tool
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800VA, 560W, 120VAC 60Hz Input and 120VAC 60Hz Output, Frequency Changer, Non-Isolated, Power Factor Corrected, 2U Rack Unit, 3.5" High x 17" Wide x 17" Deep, Rugged, Double Conversion, to Provide Power Conditioning and Hot Swap Battery Hold-up for Industrial Applications
- Octave Frequencies: 1-2 GHz and 2-4 GHz
- Narrowband Frequencies: 1.2-1.4 GHz & 2.7-3.1 GHz
- Power Levels: 1 kW to 150 kW
- Harmonic Distortion of -18dBc @ 1dB compression point
- Pulse Widths to 100 μsec. & Duty Cycles to 10%
- High Mean Time To Failure (MTTF)
- Mismatch Tolerance – Will operate without damage or oscillation with any magnitude and phase of source and load impedance.
- Numerous Applications Possible – Automotive, MIL STD 464, DO-160 and Military
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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000