FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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- All-in-one microstage - no separate controller
- Direct high-level command interface (I2C or SPI)
- USB adapter enables direct connection to PC
- Small: < 32x32x11 mm including controller
- Absolute encoding: high repeatability, no homing
- Low power: 6 VDC, ~5 W (only when moving)
- For integration into battery powered devices
- Long stroke: 15 mm
- High force: 1 N (~100g load vertical, ~200g horizontal)
- High stiffness with crossed roller bearing design
- Single-mode fiber with FC/PC connector
- Unique line uniformity and μ-optics for thin lines ( <15 μm [1/e²] )
- Red, green and blue wavelengths
- Optical output power up to 35 mW
- < 15 μm bei FWHM
- M2 < 1.05
- Analog and simultaneous TTL modulation up to 200 kHz
- Fail-safe for critical applications (e. g. medical)
- OEM-version without housing and TEC (PCB-version)
- Guaranteed performance to 43.5 GHz with Extended K™ ports
- High output power allows measurement of high attenuation devices
- Advanced time domain option provides tools for signal integrity analysis
- Wide dynamic range enables measurement of very low reflection artifacts
- Excellent corrected directivity minimizes measurement uncertainty
- SmartCal™ auto calibration unit reduces calibration and setup time
- Time domain with time gating option grants easier and faster fault identification
- Modern LAN interface for remote control is faster than GPIB
- A common GUI and SCPI interface within the ShockLine family
- Bias tee option simplifies test setups where the DUT needs DC biasing
- Universal Fixture Extraction (UFX) software option provides advanced de-embedding tools for test fixture extraction
- E-Band VNA
- Extended frequency range covering E-band and major parts of V band
- Fully assembled test system eliminates setup errors and increases reliability
- Tethered modules connect directly to the DUT increasing measurement stability
- Available in 250 MHz and 350 MHz models.
- 2, 4 and 8 channel modes.
- 16-bit vertical resolution.
- Max Sampling rate of 1.2 GS/s.
- Max sinewave frequency of 250 MHz and 350 MHz respectively.
The disruptive and innovative architecture enables to generate/add 8, 16 or 32 channel digital patterns (respectively on 2,4 or 8 analog channels platform) and to operate all models in true arbitrary mode or Direct Digital Synthesis (DDS) mode. Thanks to their high performance, versatile functionality and outstanding usability, the HD T3AWG3K series is the ideal AWG generator for today's and tomorrow's test challenges.
- High-density, compact (1U) precision data acquisition instruments
- LXI™ LAN connectivity
- Fully integrated signal conditioning maximizes performance and accuracy
- Easily integrate thermocouples, voltages, RTDs, thermistors, frequency, strain and pressure on an per-channel basis
- Distributed, synchronized measurements over the wire
- Scalable architecture easily expands from tens to thousands of channels
- DC version available for test cells requiring closer proximity to test article
- End-to-end self-calibration ensures optimum runtime performance
- Web-based access for monitoring and control
- Exlab turnkey software for simplified setup, control and data display
E100 Chimera can impair Ethernet traffic at 5 speeds up to 100Gbps to emulate real-world network behavior
- E100 Chimera supports a broad range of impairments (latency/jitter, packet & port impairments, flexible distributions, BW shaping etc)
- True wire-speed impairment @ 100Gbps (plus 50 / 40 / 25 & 10Gbps) NRZ and PAM4
- Ease of use – E100 Chimera is a stand-alone impairment tool that integrates seamlessly with Xena’s traffic generator, letting you speed up your work flow by using the same SW to both generate and impair Ethernet traffic.
- Highest port density in the industry – plus you can reserve individual port-pairs without blocking access to the others
- Setting up custom impairment distributions is a breeze
- Powerful, easy-to-use automation & scripting options
FormFactor - Cascade Ultra High-Power (UHP) - Enabling single-contact high-current/high-voltage test
- Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
- Even distribution of high current with innovative multi-fingertip design
- Compatible with TESLA 200/300 mm power device characterization system
- Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
- Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
- Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
- 150 MHz, 2 analog channels
- 8 synchronized digital channels (T3AWG2152-D only)
- 16-bit vertical resolution
- 128 MPts @Ch waveform memory
- Max sampling rate of 600 MS/s
An affordable yet high performance solution for all AFG and AWG functions, specializing in key applications such as Automotive Ethernet Transmitter Distortion Test and Double Pulse Testing. The 8 synchronized digital channels (T3AWG2152-D only) are ideal for digital design debugging and validation.
Optimized Measurement Setup
- Multi-purpose SIGMA instrument integration kit
- Shorter cabling and universal chuck connection
- Triax probe with protected guard
- Optimized signal path
- Safe probe tip exchange
- Seamless integration of various analyzers
High Power Chuck
- Triax design for low-leakage measurements up to 3 kV
- Special chuck surface coating
- High-isolation ready
- High-current measurement up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
Safe Operation
- Arcing protection
- Shield Enclosure with interlock
- Advanced grounding concept
- Maximum protection from high-voltage shock for users and devices
- Common ground protection for all instruments
- EMI/light-tight shielded environment
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
