FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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- Low output capacitance
- High bandwidth up to 30kHz
- High resolution I-V curve simulates static and dynamic conditions
- Designed for high speed Maximum Power Point Tracking (MPPT)
- Can be integrated into a multi-channel system for higher power testing
- Low voltage, high bandwidth version for DC Power Optimizers
- EN50530 support
- With an intensity of over 150 klx at 300 mm WD in continuous operation, the SL316 UltraSeal Spot Light delivers industry-leading intensity with consistent uniformity.
- Available with narrow, medium, and wide lensing options as well as a non-lensed configuration for high dispersion.
- Configurable in eleven wavelength options.
- Compatible with all Ai inline and discreet control systems. The SL316 can be operated in continuous, gated continuous, pulsed, and adaptive pulsed modes with dimming options for brightness control.
- Ideal for GaN and SiC devices
- Highest system accuracy
- Fastest rise time
- High CMRR - 160 dB
AI, cloud computing, and hyperscalers are accelerating the demand for ultra-high-speed, low-latency connectivity, taking us past Gigabit Ethernet and into the era of Terabit Ethernet.
Teledyne LeCroy’s Terabit Ethernet solutions are engineered to help you take full advantage of this new technology cycle. The Xena Ethernet Test Platform gives developers of semiconductor, NEMs, and hyperscalers the solutions they need to validate next-gen silicon, network devices, and interconnects with confidence.
From Layer 1 signal integrity and Layer 2 traffic generation and analysis, we have the solutions you need to simulate, stress, and certify real-world performance. Support for 224Gbps electrical lanes, advanced FEC, and PCS diagnostics ensure readiness for tomorrow’s networks. Compact, desktop-friendly hardware combined with intuitive software and powerful automation ensure seamless lab-to-production workflows.
Whether you’re path-finding 1.6T or optimizing 800G deployments, Xena can fast-track your innovation cycle. Test smarter, deploy faster and reap the rewards.
Empower your semiconductor device characterization with MPIV. Ideal for high power current and voltage measurements, it offers precise pulsing capabilities with adjustable parameters and customizable solutions for your specific needs.
- The RL121 is characterized as a Small High Dispersion Bright Field ring light.
- Non-lensed LEDs disperse light at broad angles, providing “soft” lighting for applications that require short working distances.
- The low-profile design is only .56” (14.2mm) thick, allowing it to be used in space constrained applications.
- Optional adapter rings are available for camera lens mounting.
- A wide variety of wavelengths are available from UV to IR. An optional polarizer and/or diffuser may be used to further condition the light output.
- The RL121 delivers 27kLux at a working distance of 50mm.
- Highest resolution – 12 bits all the time
- More channels, flexibility – 8 analog and 16 digital channels
- Longest Memory – 5 Gpt records with simple navigation – no compromise
- View 16 channels on one display with OscilloSYNC™
- Powerful, deep toolbox enables and simplifies complex analysis
- MAUI with OneTouch user interface for intuitive and efficient operation
- Zone Trigger – Simple Triggering for Complex Signals
Three Probe Technologies
- Infinity Probe: best for Al (Si)
- ACP Probe: best for AU (III-Vs)
- |Z| Probe: robust solution (long lifetime)
- Precision contact on a wide variety of materials from 26 GHz to 67 GHz
- Accurate results with excellent crosstalk
- Matching cables and substrates included
Precise Contact Solution
- RF chuck ±3 μm surface planarity
- Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
- Precision probe alignment
- Consistent contact force and overtravel
- Stable contact performance
WinCal Calibration Software
- Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
- Automated calibration monitoring
- Unique measurement & analysis methods
- Accurate S-parameter measurements
- Automatic calibration setup for higher efficiency
- Fast and easy data interpretation and reporting
RF/Coax switching modules up to 26 GHz for high frequency and communication switching needs
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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