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FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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- Highest resolution – 12 bits all the time
- More capability – integrates multiple instruments into one
- Comprehensive probe support – supports over 30 probes in 9 categories
- MAUI with OneTouch user interface for intuitive and efficient operation
- Our EuroBrite™ lineup outdoes the competition in so many ways. With more features at a competitive price point, there’s no better value in machine vision lighting:
- Complete built-in control for continuous and strobe modes.
- Adaptive Power™, a feature of the EuroBrite™ lighting controller, utilizes an onboard thermistor to maximize light output in continuous mode.
- Adaptive Overdrive,™ another feature of the EuroBrite™ lighting controller, provides a maximal output pulse in strobe mode regardless of the exposure period.
- IP67 sealed enclosure suitable for washdown environments.
- Rugged construction that has been tested to withstand over 1000lb.
- Industrial grade LEDs providing high-intensity illumination of 33klux (working distance of 100mm).
- Highly precise and stable laser projection
- Optimized for projection on 3D objects
- Excellent beam performance by the fiber-coupled laser source
- Large aperture (up to 80° x 80°) enables large working areas
- Data transmission via ethernet adapter
- Easy integration into multi projection systems
- Intuitive graphical user interface ZLPSuite
- Advanced programming interface (API) for C++, C#, Python
- Client-/Server architecture
- PLC-Gateway (Siemens S7)
The ZLP2 is a powerful laser projector equipped with a fiber-coupled Z-FIBER laser source to deliver outstanding beam quality. With an accuracy of 0.25 mm per meter of working distance, it is ideal for precise projections in traditional applications such as woodworking and stone processing, as well as demanding composite material tasks. Operation is simple via the intuitive ZLP-Suite software with graphical user interface or through the integrated programming interface (API). In addition, native control via TCP/IP-enabled PLC systems is supported, allowing seamless integration into automated workflows. The ZLP2 thus provides a flexible, expandable, and reliable solution for industrial applications where precision and efficiency are critical.
3000W power load based on set of 64 fixed, high-power resistors.
- Maximum load 3 kW and 250 Vrms
- Real resistance function
- Temperature coefficient < 10 ppm/°C
Southwest Microwave’s high performance End Launch Connectors are designed to provide low VSWR, mode-free wide responses up to 125 GHz for single and multilayer microstrip or grounded coplanar printed circuit boards. Available in SMA (27 GHz), 2.92 mm (40 GHz), 2.40 mm (50 GHz), 1.85 mm (67 GHz) and 1.0 mm (125 GHz).
Male and female options along with narrow body and bulkhead feed-through. Unique clamping mechanism accommodates board thickness up to .300” (7.62 mm). Robust, reusable and repairable. Multiple launch configurations provide the best possible match to circuit layout. Works on microstrip and grounded coplanar waveguide (GCPW) designs. Signal-layer microstrip and GCPW test boards available. Soldering is optional.
Design and Test Assistance:
- Printed circuit board connector launch designs and connector part number recommendations for stack-ups
- 3D models for mechanical layout
- Connector Encrypted HFSS models (version 18.0 or newer) for EM simulations
- High-level noise modules mounted on a circuit board
- Modified BW, output power, and flatness specifications
The NC2000 Series amplified noise modules are an excellent choice for high-level noise modules mounted on a circuit board. The NC2000 Series modules are housed in 24, or14-pin dual-inline packages. The NC4000 series modules are housed in a 40-pin module that cover similar noise bands to the NC2000, but have higher crest factor, and 60 dB of TTL controlled attenuation. Modified BW, output power, and flatness specifications are available for these modules. Please consult Noisecom for availability, and appropriate package style.
Linea SWIR features a cutting-edge InGaAs sensor in a compact package that is suitable for a wide variety of applications. With exceptional responsivity and low noise, this camera allows customers to see their products like never before. Linea SWIR is available as a 1k resolution camera with highly responsive 12.5 µm pixels, or a 512 resolution camera with larger 25 µm pixels.
- For cameras up to 75 x 75mm cross section
- Special lid for IFM/Lucid TOF cameras available
- With flange all Orca lids and extensions usable
- High IP rating and high chemical resistance
- Vibration‐proof mounting
- Compact size, small deadweight
- Flexible camera positioning
- Excellent heat dissipation
- Dome window option
- T‐Slot & dovetail profile usable for installation
- Integration of Meganova ring lights possible
The LL330 Series provides a sealed high intensity line light solution for demanding industrial environments. Engineered to withstand harsh conditions, these line lights are completely protected from dust and debris, ensuring reliable performance where other lights fail. In addition, passive thermal management eliminates the need for active cooling fans, contributing to low-maintenance, long-term operation.
The LL330 is available with an embedded control option, designed for continuous operation and housed within the configured light head. With options for converging or collimating optics, this series is suited for a variety of application needs. The LL330 is ideal for sheetrock, lumber, ceramics, stone, and other industries utilizing line scan imaging where airborne particulate, dust, and debris are concerns.
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
