FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
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Highly stable granite base
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Independent, coarse movement of X and Y axes, combined with easy fine adjustments
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Re-configurable for DC, RF, mmW, FA, WLR and more
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Full thermal range of -60°C to +300°C
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Low-profile, straightforward design
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Spacious top chambers for up to 12 positioners
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Reduces electrical noise by providing a fully electromagnetically shielded, ultra-low-noise, light-tight environment
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Enables accurate low-noise measurements of atto amperes, femtofarads and microvolts at temperatures down to -60°C
See more Key Features on Specifications & Details tab
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Easy to Use
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No need to break the circuit or insert a shunt
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Small form factors for use on crowded boards
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Variety of Applications
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Bandwidths up to 100 MHz
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Peak currents up to 700 A
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Sensitivities down to 1mA/div
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High Precision Measurements
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Low frequency accuracy of 1%
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Integrated autozero capability
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Fully Integrated with Teledyne LeCroy Oscilloscope
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No additonal hardware is required
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Power is supplied from oscilloscope ProBus connection
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Automatic display of waveforms in Amps and calculated power traces scaled correctly in Watts
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Degauss and Autozero directly from oscilloscope user interface
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DCS025 Deskew Calibration Source
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Provides ability to precisely deskew most voltage probes along with 30, 150 and 500A current probes
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- Power bypass inductance: 8 nH
- Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
- Supports collinear and non-standard needle configurations
- Up to 16 DC for standard; maximum of 24 DC for custom
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
- Image circle: 62.5 mm - 82 mm
- High resolution down to 5µm pixel size
- Optimized for specific magnifications
- 6 magnifications available: 0.1x - 2.0x
- Version with beamsplitter available
- Best azimuth marking
- V48-Mount for easy installation
- Lithographic thin-film construction
- Excellent crosstalk characteristics
- Non-oxidizing nickel alloy tips
- Innovative force delivery mechanism
- 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
- GSG, SG, GS, GSGSG, GSSG, SGS configurations
- 50 to 250 µm pitches (other pitches available on request)
- High current version (2 A) available
Advantages
- Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
- Superior measurement accuracy and repeatability
- Small scrub minimizes damage to aluminum pad
- Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
- Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)
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Fully isolated experiment space for true 4K temperatures during probing
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Cryogenic positioners to provide large travel ranges without warming up the device
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Flexible thermal jumpers to ensure high thermal conductance and low mechanical transmission
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A soft vacuum bellows provides a compliant mounting interface for the cryocooler
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Quick release vacuum feedthroughs for easy configurability
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A large rectangular port for high signal capacity
See more Key Features in Specifications & Details tab
High voltage differential probes provide high CMRR over a broad frequency range to simplify the measurement challenges found in noisy, high common-mode power electronics environments. The probe’s design is easy-to-use and enables safe, precise high voltage floating measurements.
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High spatial resolution
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IEEE 1588 PTP
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Power over Ethernet
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Defect pixel masking
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Monochrome (GT5400) and color (GT5400C) models
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Screw mount RJ45 Ethernet connector for secure operation in industrial environments
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Supports cable lengths up to 100 meters (CAT-6 recommended)
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Trigger over Ethernet Action Commands allow for a single cable solution to reduce system costs
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Comprehensive I/O functionality for simplified system integration
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Planarity adjusted (PA) EF Lens Mount (option -18) for electronic control of aperture and autofocus
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Easy camera mounting via standard M3 threads at all sides and 1/4-20 tripod mounting hole
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Defect pixel masking feature with the Defect Mask Loader tool that allows you to manage a user defined defective pixel list to match your application and optimize the life cycle of the camera.
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Easy software integration with Allied Vision's Vimba Suite and compatibility to the most popular third party image-processing libraries.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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