-
Our High Intensity Linear Backlights offer 510 kLux output, perfect for back-lit, line-scanning applications.
-
Available in pre-engineered sizes from 6” (152mm) to 96” (2438mm) in 6″ increments.
-
A 3″ (75mm) length option is also available. Available intensity control provides illuminance adjustability for every 6″ increment via a 0 – 10v input
FormFactor - Cascade High Current Probe - Test power devices on wafer with high-performance and low-contact resistance on smaller pads
-
Enables wafer probing up to 100 A pulsed and 10A DC
-
Innovative multi-fingertip design provides even distribution of current
-
Supports up to 500 V
-
Replaceable Tungsten probe tips
-
Temperature range of -60°C to 300°C
-
Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
-
Prevents against thermal runaway
-
Measure devices on wafer at higher currents than ever before
-
Small scrub minimizes damage to aluminum pad
-
Small footprint – tip fits on a 1 mm pad
Designed specifically for testing power devices on wafer, the HCP probe reduces probe and device destruction at high currents by minimizing contact resistance at the wafer-to-probe interface to prevent device heating at the tip. The innovative multi-finger design distributes the current over multiple contact points at the tip and is joined by a single heatsink which pulls heat from the probe tip.
Document
Document
More Product Information
-
High accuracy throughout all ranges
-
8 Vpk floating outputs
-
Real and simulated transconductance amplifiers
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight Photonics Application
- The LL167 Series provides a focused line of illumination in a passively cooled design.
- Only available in White (for color illumination in a similar package refer to our LL137 Series).
- Provides a high intensity level of 472kLux (working distance of 75mm).
- Available in pre-engineered sizes from 6” (152mm) to 96” (2438mm) in 6″ increments.
- A 3″ (75mm) length option is also available.
- Available intensity control provides illuminance adjustability for every 6″ increment via a 0 – 10v input
-
High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
-
RF bandwidth to 500 MHz
-
Long probe life: > 250,000 contacts
-
Beryllium-copper tips for gold pads or tungsten for aluminum pads
-
Oscillation-free testing of wide-bandwidth analog circuits
-
Use with ACP series probes to provide functional at-speed testing for known-good-die
-
Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
-
Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
-
Easy and fast setup of camera views
-
Go to Light and Image Settings of the selected camera view with only one mouse click
-
Guided workflows for wafer setups, alignment tools and Autonomous Assistants
-
Workflow wizard shows task-relevant settings and options only
-
Visualizes the progress of setup, alignment and measurement tasks
-
Status information always at hand
-
Informs the user about events, for example “Successful Alignment”
-
Interacts with the user and helps with intelligent solutions
-
For very complex wafer structures
-
Enables automatic test of multiple devices in each die location before stepping to the next die
See more Key Features on Specifications & Details tab
-
High-quality construction with low-noise electrical performance
-
Kelvin version for convenient 4-point measurements
-
Replaceable coaxial probe tips, with choice of tip radii, and full electrical guard to the probe tip
-
SSMC 50 connectors
-
Ultra-low, fA and fF measurements from -65 º C to 150 º C
Reproduces transient voltage surge phenomena generated in a vehicle and evaluates the immune resistibility of DUT against the surge. The output waveforms are five as high-repeating pulse, giant pulse, field decay pulse, trapezoidal waveform + high-repeating pulse and high repeating pulse + giant pulse.
-
Wafer temp verified <4.5 K (with 44 RF probes in contact)
-
Magnetic field suppression to <200 nT
-
Easy exchange of customizable probe cards
-
Configurable for 150 mm, 200 mm and 300 mm wafers
-
Options for fully automated wafer load or manual
-
Complete software suite for manual, semi-auto, or fully automated probing
-
25 wafer cassette capacity for fully automated testing
-
~15 minute cooldown time per wafer
See more Key Features in Specifications & Details tab
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
Download Line Card
