Cryogenic Temperatures

• Fully isolated experiment space for true 4K temperatures during probing
• Cryogenic positioners to provide large travel ranges without warming up the device
• Integrated helium pot for high temperature stability of the device under test
• Fully dry cryogen-free cooler eliminates the need for expensive helium circulation systems
• Rapid cool liquid nitrogen option for faster cool down times

See "Specifications & Details" tab for more key features

The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.

• Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
• Application flexibility, ideal for use in high frequency applications
• Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
• Suitable for integration with vibration isolating tables

Three Probe Technologies

• Infinity Probe: best for Al (Si)
• ACP Probe: best for AU (III-Vs)
• |Z| Probe: robust solution (long lifetime)
• Precision contact on a wide variety of materials from 26 GHz to 67 GHz
• Accurate results with excellent crosstalk
• Matching cables and substrates included

Precise Contact Solution

• RF chuck ±3 μm surface planarity
• Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
• Precision probe alignment
• Consistent contact force and overtravel
• Stable contact performance

WinCal Calibration Software

• Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
• Automated calibration monitoring
• Unique measurement & analysis methods
• Accurate S-parameter measurements
• Automatic calibration setup for higher efficiency
• Fast and easy data interpretation and reporting

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with TESLA 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

Measurement Accuracy

• Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
• Minimize AC and spectral noise with effective shielding capability
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection

See "Specifications & Details" tab for more key features

• Accommodates a combination of up to four Cascade Microtech probes
• Configurable for mixed-signal RF/mmW testing
• Quick and easy repairs to be performed in the field, by simply replacing individual probes
• Adaptable to new device layouts by exchanging individual probes