• Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
• High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
• Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
• Low vibration: Stable contact with the device under test and enables low noise measurements

• Die-to-die stepping time of under 100 ms
• Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
• Even extreme variations in height, such as the case with warped wafers, can be compensated
• Interfaces to all major analysis instrumentation, optics software and testers
• Access to top side and bottom side of device under test (DUT)
• Highly accurate light measurement
• Test automation out-of-cassette for 24/7 operation

• Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
• Even distribution of high current with innovative multi-fingertip design
• Compatible with TESLA 200/300 mm power device characterization system
• Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
• Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
• Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

• Proven technology: designed in conjunction with several top STM groups in the world 
• Quiet, low vibration operation 
• Low running costs and reduced maintenance 
• Easy operation and fast cool-down; load sample when the system is cold for TL models 
• Calibrated RuO and CMN thermometry read by model 372S resistance bridge are installed on the mixing chamber plate

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• Long holding time: 80 hours with 10 STP liter He-3 gas
• Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line
• Sample can be loaded or removed when the cryostat is cold
• Low noise, low vibration
• Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)

• Replace costly and inflexible test fixtures with easy-to-use probe tips
• Long lifetime – typically over 1,000,000 contacts
• GS/SG footprint up to 4 GHz and GSG up to 20 GHz
• High-power RF test: up to 30 Watts
• Test at temperatures from -60°C to 200°C

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Joystick controller
• Manual probe positioners with rotary feed-throughs
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer
• User-centered design minimizes training costs and enhances efficiency