FormFactor - Cascade Unity Probe - Multicontact probe for RFIC engineering test
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Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
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Online design configuration tool helps you to specify your probe in minutes
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All designs are fully quadrant compatible
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Full solution includes probes, calibration substrates, stations, accessories and software
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Scalable architecture for future needs
The multi-contact Unity Probe provides highly flexible configurability, unprecedented durability and ease-of use for RFIC engineering test. Unlike “bent-to-order” needle-probe solutions, Unity probes are quickly “built-to-order” with a precision tip cluster featuring multiple independently compliant fingers to isolate chip components from probing stresses — maximizing probe life and durability. Each contact can be configured to one or several contact types and frequencies, and the Unity Probe delivers on the legendary quality you’ve come to expect from our comprehensive suite of probing solutions.
Use our online tool to capture your design requirements and receive a quote.
Use our online tool to capture your design requirements and receive a quote.
More Product Information
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Ideal for multiport RF/Microwave and high-speed digital signal testing
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Mix DC and RF/Microwave signals on one probe
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Long lifetime – typically over one million (1,000,000) touchdowns
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Excellent performance in temperatures ranging from 10 K to 200°C
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Probe on any pad material with no damage
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Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown
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Even distribution of high current with innovative multi-fingertip design
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Compatible with TESLA 200/300 mm power device characterization system
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Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown
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Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance
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Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)
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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
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Different substrate carriers for wafers up to 150 mm or single dies
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Up to six positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Ergonomic and straightforward design
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Intuitive, manual operation
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Independent control of linear chuck stage and positioners
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Contact/separation stroke for probe platen
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Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
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Enables up to 5x faster time to accurate data
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Advanced 4-axis semi-automatic stage for accurate positioning and repeatable probe-to-pad contact
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RF/microwave device characterization, 1/f, WLR, FA and design debug
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Wide range of extremly performant, reliable thermal chuck systems from ATT
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Easy on-screen navigation, wafer mapping, and operation of accessories and thermal systems with Velox
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User-centered design minimizes training costs and enhances efficiency
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Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
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Guarantees fully-guarded measurements to fA and fF levels
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Individual connectors provide force-sense connection for quasi-Kelvin and CV measurements
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Allows probing of different pad materials and sizes
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Fast replacement of worn probes without the need for tools
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Customizable sample space to fit the user’s application
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Long holding time: 100 hours for six (6) STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line; +/- 0.5 mK at base temperature
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Low noise
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
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Probe station
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Keysight Streamline Vector Network Analyzer (option up to 53 GHz)
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Choice of probes
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Known measurement accuracy traced back to independent standards
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Uses best measurement practices for optimized measurements
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Best in class RF and Microwave performance
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Small benchtop footprint
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Long holding time: 80 hours with 10 STP liter He-3 gas
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Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line
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Sample can be loaded or removed when the cryostat is cold
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Low noise, low vibration
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Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000