FormFactor - Cascade TESLA200 - 200 mm semi-/ fully-automated on-wafer power device characterization system
-
On-wafer power device characterization up to 10,000 V DC / 600 A
-
Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
-
Prevent thin wafers from curling and breaking
-
Safety interlock system with clear enclosure for operator safety during device measurements
-
Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
-
Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
-
Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
See more Key Features on Specifications & Details tab
Designed specifically for IGBT/power MOSFET (GaN, SiC, Si) device measurements at the wafer level, the new TESLA200 on-wafer power semiconductor probing system is engineered to provide accurate data up to 3 kV (triaxial) / 10 kV (coaxial) and 200 A (standard) / 600 A (high current). With next generation test capabilities, anti-arcing solutions, wafer automation, and support for both engineering probes and T.I.P.S. “LuPo” High Voltage / High Power Probe Cards, the TESLA200 now enables complete thermal testing (-55°C to 300 °C) with fully-automatic thinned/warped/TAIKO wafer loading. One system covers all on-wafer high power test needs, from R&D to niche production.
The new TESLA200, available in semi-automatic and fully-automatic models, is scalable and field upgradeable, allowing it to meet any budget requirements. The system is ideal for collecting high accuracy measurement data on single or volume wafers as fast as possible, and can be utilized in R&D, device characterization/modelling or niche production applications.
Patented AttoGuard® and MicroChamber® technologies built in TESLA200 significantly improve low-leakage and low-capacitance measurements. In combination with FormFactor’s patented TESLA FemtoGuard™ thermal chuck technology, the TESLA200 provides an ultra-low noise, fully guarded and shielded test environment. The high-power TESLA FemtoGuard chuck also incorporates MicroVac™ technology enabling low-contact resistance, thin-wafer handling and maximum power dissipation.
To ensure the utmost safety during high-voltage measurements, the TESLA200 on-wafer power semiconductor probing system employs a TUV-certified safety interlock system integrated with an ergonomic clear enclosure. With an advanced 200 mm fast stage, automatic wafer loader and thin wafer handling capability, TESLA200 provides everything needed for scientists, R&D / test engineers, or production operators to get their job done fast.
Applications
- High Power
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
- On-wafer power device characterization up to 10,000 V DC
- Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
Gold-plated TESLA High-power MicroVac™ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
Safety for Operator
- Safety interlock system with clear enclosure for operator safety during device measurements
- Roll-out stage for full wafer access and easy wafer loading/unloading
Seamless Integration
- Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
- Seamless integration between Velox and analyzers/measurement software
Thermal Measurements
- Wide range of extremly performant, reliable thermal chuck systems from ATT
- Flexibility from hot only to full thermal range of -60°C to +300°C
- Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
- Up to 15% faster transition times than other systems in the market
- Patented MicroVac™ and FemtoGuard™ Technologies, providing ultra-low noise measurements and controlled leakage, low residual capacitance for repeatability and advanced measurement accuracy and speed
- Field-upgradeable: grows with your needs
Velox Probe Station Control Software
- User-centered design minimizes training costs and enhances efficiency
- Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware
- Comprehensive alignment functions – from simple wafer alignment and mapping to advanced probe-to-pad alignment over multiple temperatures for autonomous semiconductor test
- Simplified operation for inexperienced users: Reduced training costs with Workflow Guide and condensed graphical user interface
- Loader integration – Easy creation of workflows and receipts and no need for any additional software
- VeloxPro option: SEMI E95-compliant test executive software that enables simplified and safe automation of the entire wafer test cycle
Document
Document
Document
Document
Document
Document
More Product Information
-
Different substrate carriers for wafers up to 200 mm or single dies
-
Probe cards and/or up to eight positioners
-
Independently cooled cold shield
-
Probe positioners placed inside vacuum chamber
-
Intuitive, manual drives
-
Front loading capability through load door
-
Independent control of linear chuck stage and positioners
-
Contact/separation stroke for chuck
See more Key Options in Specifictions & Details tab
-
Customizable sample space to fit the user’s application
-
Long holding time: 100 hours for six (6) STP liter He-3 gas
-
Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line; +/- 0.5 mK at base temperature
-
Low noise
-
Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
-
Provides an effectively noise free environment around the device under test (DUT)
-
World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
-
Up to 4x faster flicker noise thermal testing on 30 μm pads
-
Provides dark and dry environment for measuring light sensitive transistors, and devices at negative temperatures (<= -60°C) with frost free operation
-
Provides fully managed and filtered AC power to the entire system – prober and instruments
-
Filters harmful noise generated by external thermal control systems
-
Reduced “antenna effect” injection of unwanted RF noise into the measurement path
-
Provide up to 100dB attenuation (50Hz to 80Mhz) with 100mA max DC current handling
-
Ultra-low, fA-level current and fF-level capacitance measurements from -65 °C to + 300 °C
-
Enables full access to the chuck and the auxiliary sites
-
Intuitive, and precise movement of chuck in X, Y, and Z-direction
-
User-centered design minimizes training costs and enhances efficiency
-
Test automation out-of-cassette for higher test cell efficiency for over-night/over-weekend operation
See more Key Features on Specifications & Details tab
-
Long holding time: 80 hours with 10 STP liter He-3 gas
-
Stable He-3 pot temperature: Separate sippers for 1K pot and the charcoal sorb cooling line
-
Sample can be loaded or removed when the cryostat is cold
-
Low noise, low vibration
-
Multiple operation modes: He-3 cryostat can be operated without pumping the 1K pot (referred to as 4K operation mode)
-
Substrate material: High-resistivity silicon
-
Substrate thickness: 275 µm
-
Dielectric constant: 11.8
-
Nominal Z0: 50 Ω
-
Low running costs, less vibration, less noise, reduced maintenance
-
Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
-
CMN calibrated thermometry on MC plate
-
Operation via touch panel controller: Remote operation via ethernet interface
-
Enables wafer probing up to 100 A pulsed and 10A DC
-
Innovative multi-fingertip design provides even distribution of current
-
Supports up to 500 V
-
Replaceable Tungsten probe tips
-
Temperature range of -60°C to 300°C
-
Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
-
Prevents against thermal runaway
-
Measure devices on wafer at higher currents than ever before
-
Small scrub minimizes damage to aluminum pad
-
Small footprint – tip fits on a 1 mm pad
Ultra Low Temperature
-
Pulse tube cryocooler for cryogen free 4K temperatures
-
He-3 sorption cooler for high power intercept and launch stage for ADR
-
Single stage ADR provides solid state cooling down to 25mK
-
Sample stage mounting at both 300mK and 30mK
Configurability
-
Multiple stage feedthroughs for thermally intercepting the signals
-
Two large electrical bread boards for more configurable space
-
Rapid cool options for faster cooldowns
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
Download Line Card
Document
