FormFactor - Cascade Chucks - Non-thermal and thermal chucks
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
Chucks and Thermal Systems
All FormFactor wafer probe stations are fully integrated with an exclusively developed non-thermal chuck or a highly-reliable thermal chuck system from ATT. Depending on your application, temperature range and performance requirements we offer a large variety of thermal systems from -60°C to 300°C, ranging from the most powerful and fastest high-performance systems in the market to extremely economic systems providing the best cost-performance ratio you can get.
All our systems are nickel or gold-plated and guarantee superior electrical performance. Our patented MicroVac™ and FemtoGuard™ technologies provide advanced measurement accuracy and ultra-low wafer contact resistance, even for warped/thin wafers.
The modular concept for convenient and cost effective system upgrades provides highest safety of investment and easy customization.
Full Thermal Range Systems (-60°C to 300°C)
- Most powerful and fastest high-performance systems for highly demanding requirements Shortest transition times in the market Optional ECO Mode for lower air consumption (CDA) than other systems in the market (365l/min)
Economic Thermal System (-40C° to 300°C)
- 25% lower air consumption (CDA) than other systems in the market (300l/min) Power Mode: 15% faster transition times than other systems in the market Best cost-performance ratio of systems with a wide thermal range
Hot-Only Systems (+20°C/+30°C to 300°C)
- Modular and field-upgradeable to cold (-40°C or -60°C): grows with your needs Controlled Ambient Technology (+20°C): Precise temperature control, even below ambient temperatures, with no need of an additional chiller
Besides our technology-leading coaxial and triaxial chuck systems, our portfolio is complemented with the following specialized chucks:
- RF/microwave chucks, equipped with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
- High-power chucks with Taiko wafer handling capability, an anti-arcing solution and an auto-discharging system for high throughput and measurement accuracy, while providing a regulatory-certified safe testing environment
- Double Side Chucks: Patented double side design can be configured to hold a variety of different substrate designs and sizes. Mainly used within emission microscopy systems, it can also be used to hold special substrates including MEMS dies held in square metal carriers.
*Chuck performance is specified in probe station Data Sheets.
Low Thermal Resistance
- Low Thermal Resistance Technology
- MultiSense with multiple temperature sensors
- Best temperature accuracy and uniformity
Superior Electrical Performance
- Isolated from ground
- Includes a jack for grounding and biasing
- Highly planar chuck surface for consistant contact force and overtravel
Patented MicroVac™ Technology
- Advanced wafer vacuum system for warped/partial thin wafers
- Provides uniform vacuum across the entire wafer surface
- 495 micro-holes with 200 µm diameter patterned throughout the chuck
- Five user selectable vacuum zones: even partial wafers that do not cover all the chuck vacuum holes are held down with uniform vacuum
- Increased measurement accuracy with uniform device heat dissipation and ultra-low wafer contact resistance
Patented FemtoGuard™ Technology
- Advanced shielding technology
- Enables ultra-low noise, fully guarded measurements and controlled leakage
- Low residual capacitance for repeatability and advanced measurement accuracy and speed
IntelligentDry Air Control
- Active CDA purge control to reduce the dry air consumption
Auxiliary Chucks
- Dedicated RF chucks come with up to three auxiliary chucks for holding calibration substrates and/or cleansing pads
- Different materials available: Steel, Absorber, Ceramic
More Product Information
- Accommodates a combination of up to four Cascade Microtech probes
- Configurable for mixed-signal RF/mmW testing
- Quick and easy repairs to be performed in the field, by simply replacing individual probes
- Adaptable to new device layouts by exchanging individual probes
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Ease of use – Less experienced operators can perform DC measurements by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
- Coaxial and triaxial measurements up to 10,000 V
- High-quality construction with low-noise electrical performance
- Replaceable probe tips in a variety of tip sizes
- Temperature range of of -60°C to 300°C
- Triaxial measurement ensures a much better understanding of device leakage in the off state
- Highly reliable, stable and repeatable measurements
- Integrally designed as part of a complete measurement solution
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
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Functional temperature range of -263 to +150°C
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Stainless steel tip material for thermal decoupling
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Coaxial cable with TCE matched inner and outer conductors
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Consistent tip geometry even at cryogenic temperatures
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
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Replace costly and inflexible test fixtures with easy-to-use probe tips
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Long lifetime – typically over 1,000,000 contacts
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GS/SG footprint up to 4 GHz and GSG up to 20 GHz
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High-power RF test: up to 30 Watts
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Test at temperatures from -60°C to 200°C
FormFactor, Inc.
Website
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
