FormFactor - Cascade High Voltage Probe - Accurate and precise measurement of device parameters up to 10,000 V
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Coaxial and triaxial measurements up to 10,000 V
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High-quality construction with low-noise electrical performance
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Replaceable probe tips in a variety of tip sizes
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Temperature range of -60°C to 300°C
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Triaxial measurement ensures a much better understanding of device leakage in the off state
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Highly reliable, stable and repeatable measurements
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Integrally designed as part of a complete measurement solution
To ensure precision measurements of today’s high-voltage devices, FormFactor’s High-Voltage Probes (HVP) provide increased isolation resistance and dielectric strength by incorporating advanced internal isolation materials, as well as custom cabling and connectors.
When used with a , the HVP assures low-noise electrical performance and full triaxial capability at high voltage without any breakdowns.
More Product Information
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Revolutionary technology advancement for wafer and die-level photonics probing
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Highest accuracy in test results
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New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
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Minimized coupling losses with minimal trench dimensions
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Industry standard for vertical coupling to wafer-level grating couplers
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Positioning hardware is precisely calibrated to the probe station and ready to perform die-to-die optical optimizations in minutes
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Dark, shielded and frost-free
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-40°C to +125°C
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Leveraging considerable expertise through an innovative engineering team
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Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
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Exclusive FormFactor-developed automated test methodology
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Automates manual tasks by integrating probe station machine vision capability with optical positioning and test equipment
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FormFactor-developed graphical user interface to manually control the optical positioning system
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Configurable between single fibers, fiber arrays and edge coupling holders
See more Key Features on Specifications & Details tab
- This ultra high intensity line light series is built to handle the most extreme line scan lighting requirements.
- Provides an intensity level of 2,100 klx (working distance of 75 mm).
- Pre-engineered for expandability in 150 mm (6”) increments up to 2400 mm (94.5”).
- Available in multiple wavelengths.
- In the event of abnormally high ambient temperatures, the device automatically shuts down when the housing reaches 60°C and resumes operation at 56°C.
Note: Requires third party power supplies – refer to spec sheet.
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HD4096 technology provides 12-bit resolution up to 8 GHz and 20 GS/s
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Up to 5 Gpts of acquisition memory enables detailed viewing of long events
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15.6" 1900 x 1080 Full HD capacitive touchscreen
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New ProBus2 input supports up to 8 GHz bandwidth and direct compatibility with a wide variety of existing ProBus probes - 50Ω and 1MΩ coupling modes support all input types on a single connector
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MAUI with OneTouch user interface for intuitive and efficient operation
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Deep toolbox enables and simplifies complex analysis
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Intuitive navigation to quickly find important features in long waveforms
Thin plate broadband antenna has been developed for efficient immunity testing against hand-held transmitters and cellular phones. Many pieces of spot frequency antennas had to be used in turn thus fur. This new Thin-plate Broadband Antenna is a single antenna solution eliminating the need for antenna changes and dramatically reducing the test time. Furthermore, this antenna with its small-size and lightweight properties and a flexible handle is suitable for testing in narrow spaces.
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A wide frequency range eliminating the need for antenna changes
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30W maximum power input allows high filed strengths
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High efficiency due to a low VSWR and high gain
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Suitable for broadband digital modulation thanks to a good VSWR flatness
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Small, light-weight and flat antenna easy to use in narrow spaces
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Easy handling with a flexible arm
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A wide radiation pattern makes directivity of the fields no longer an issue
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Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
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Safety-rated interlock system for high-power testing (meets EN 60947-5-1, EN 60204-1)
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Supports fully automated testing up to 10kV by eliminating arcing point
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Full wafer access via locking roll-out stage
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On-wafer power device characterization up to 10,000 V DC / 600 A
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Coaxial, triaxial, and pin jack feed-troughs available
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Convenient instrument connection kits
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Load/unload wafer to hot/cold chuck (-60° C to +300° C)
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Up to 15% faster transition times than other systems in the market
See more Key Features on Specifications & Details tab
- All-in-one smart module: no separate electronics
- Runs directly from USB adapter
- USB, I2C or SPI interface
- Small size: less than 29 x 20 x 10 mm
- High resolution: 0.5 μm
- Absolute encoding: no homing
- Long stroke: 6 mm
- Low power use: 3.3 V DC input, < 0.75 W when moving
- High repeatability and low runout
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Best price per contact – typically over one million (1,000,000) touchdowns
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RF/Microwave signal is shielded and completely air isolated in the probe body
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Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
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Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
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Probe on any pad material with minimal damage
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Low running costs, less vibration, less noise, reduced maintenance
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Large convenient experimental access: Up to 12 line-of-sight ISO100 ports located on perimeter of plates
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CMN calibrated thermometry on MC plate
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Operation via touch panel controller: Remote operation via ethernet interface
- Modular design with multiple reference paths built in for high-availability.
- 6 expansion slots for customization and expansion.
- Industry-first GPS integrity checking with Timewall™
- Unique optical crosslink architecture for either Master-Slave hierarchical setups or Master-Master crosschecking and failover
- LCD display and keypad for basic status and configuration – secure web browser for detailed setup.
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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