FormFactor - Cascade Resistive Matching and Termination - Custom configured for your application
- Choice of Series resistance or Termination (signal line to ground)
- Use of High Performance RF Resistors
- Choice of Resistor values available
- Choice of body styles, Infinity, ACP or FPC
- Can help to stabilize oscillations in high-gain devices
- Impedance match to low dynamic resistance laser diodes
- Custom configured for your application
Resistive Impedance Matching Probes and Termination probes are available for the following probe families: Infinity; ACP; FPC, in multiple configurations. We use high performance / high quality RF resistors for these Matching or Termination probes and the resistors are placed as close as possible to the tip/DUT, to minimize the path length between the DUT and the resistor. The available Resistance values are limited and are listed in the request form. These types of Impedance Matching and Termination probes are used in various application such as with laser diodes, Transmission Line Pulse, ensure better termination of 50 ohm test equipment when mated to high impedance devices, etc.
More Product Information
- Enables wafer probing up to 100 A pulsed and 10A DC
- Innovative multi-fingertip design provides even distribution of current
- Supports up to 500 V
- Replaceable Tungsten probe tips
- Temperature range of -60°C to 300°C
- Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
- Prevents against thermal runaway
- Measure devices on wafer at higher currents than ever before
- Small scrub minimizes damage to aluminum pad
- Small footprint – tip fits on a 1 mm pad
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Functional temperature range of -263 to +150°C
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Stainless steel tip material for thermal decoupling
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Coaxial cable with TCE matched inner and outer conductors
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Consistent tip geometry even at cryogenic temperatures
Comprehensive, Turn-key Integrated Measurement System (IMS) with Keysight SPA for On-wafer DC Parametric Measurements
- Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
- Online design configuration tool helps you to specify your probe in minutes
- All designs are fully quadrant compatible
- Full solution includes probes, calibration substrates, stations, accessories and software
- Scalable architecture for future needs
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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation
Superior Mechanics
- Highly stable granite base
- Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
- 1 µm repeatable separation stroke
- Excellent measurement accuracy and repeatability
- Fast navigation and high-precision probe positioning
See "Specifications & Details" tab for more key features
- Choice of Series resistance or Termination (signal line to ground)
- Use of High Performance RF Resistors
- Choice of Resistor values available
- Choice of body styles, Infinity, ACP or FPC
- Can help to stabilize oscillations in high-gain devices
- Impedance match to low dynamic resistance laser diodes
- Custom configured for your application
Gold-plated TESLA High-power MicroVac™ Chucks
- Prevent thin wafers from curling and breaking
- Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
- Accurate Rds(on) measurement at high current
- Accurate UIS measurements at high temperature
- High performance power bypassing provides low-impedance and resonant-free connections to 20 GHz
- RF bandwidth to 500 MHz
- Long probe life: > 250,000 contacts
- Beryllium-copper tips for gold pads or tungsten for aluminum pads
- Oscillation-free testing of wide-bandwidth analog circuits
- Use with ACP series probes to provide functional at-speed testing for known-good-die
- Mix multiple contact types: Ground, Power (Standard or Eye-Pass), Logic/Signal
- Low and repeatable contact resistance on aluminum pads ( < 0.25 Ω on Al, < 0.01 Ω on Au)
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement