• Coaxial and triaxial measurements up to 10,000 V
• High-quality construction with low-noise electrical performance
• Replaceable probe tips in a variety of tip sizes
• Temperature range of -60°C to 300°C
• Triaxial measurement ensures a much better understanding of device leakage in the off state
• Highly reliable, stable and repeatable measurements
• Integrally designed as part of a complete measurement solution

• Ideal for multiport RF/Microwave and high-speed digital signal testing
• Mix DC and RF/Microwave signals on one probe
• Long lifetime – typically over one million (1,000,000) touchdowns
• Excellent performance in temperatures ranging from 10 K to 200°C
• Probe on any pad material with no damage

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Intuitive, manual drives
• Front loading capability through load door
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Joystick controller
• Manual probe positioners with rotary feed-throughs
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer
• User-centered design minimizes training costs and enhances efficiency

• Highly stable granite base
• Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges
• Re-configurable for DC, RF, mmW, FA, WLR and more
• Multiple accessories: Thermal chucks, motorized microscopes and positioners, dark box, and more
• Low-profile, straightforward design
• Easy and ergonomic operation
• Front or backside instrumentation, e.g.: Integrating Sphere, Fiber setup, Pressure Module
• Front or backside probing capability

• Revolutionary technology advancement for wafer and die-level photonics probing
• Real-time in-situ calibrations
• Highest accuracy in test results
• Lowest coupling loss
• New innovative combination of hardware and software features to align and optimize fibers/arrays in a wafer-level trench
• Minimized coupling losses with minimal trench dimensions
• Industry standard for vertical coupling to wafer-level grating couplers
• Dark, shielded and frost-free
• -40°C to +125°C
• Pioneering set of automated functions that perform critical calibrations of the optical positioning system to the probe station
• Exclusive FormFactor-developed automated test methodology
• FormFactor-developed graphical user interface to manually control the optical positioning system
• Configurable between single fibers, fiber arrays and edge coupling holders

• Supports up to 12 VNA ports than can be mapped to four logical ports for calibration
• Extensive guidance, wizards and management features automate calibration setup, measurement, result data conversion and report creation
• LRRM-SOLT, multi-line TRL and second-tier calibration methods enable precision and simple multi-port calibrations
• Automatic load inductance compensation function ensures the most repeatable calibrations
• Easy to use Probe to ISS/CSR matching tool
• Additional remoting methods
• Interface with Velox™ over LAN

The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.