The CSR family of calibration substrates delivers the highest accuracy available due to the high quality of each substrate. The calibration standards are manufactured using rugged, hard gold, which ensures a long lifetime.

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Safe and convenient integration kits to support T.I.P.S. “LuPo” High Voltage / High Power Probe Cards
• Prevent thin wafers from curling and breaking
• Safety interlock system with clear enclosure for operator safety during device measurements
• Convenient connection kits for easy and safe system integration with power device analyzers from Keysight Technologies and major suppliers
• Up to 25% lower air consumption (CDA) than other systems in the market (300l/min) with no compromise in transition times
• Windows 10 compatibility enables highest performance and safe operation with state-of-the-art hardware

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Joystick controller
• Manual probe positioners with rotary feed-throughs
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer
• User-centered design minimizes training costs and enhances efficiency

• Enables wafer probing up to 100 A pulsed and 10A DC
• Innovative multi-fingertip design provides even distribution of current
• Supports up to 500 V
• Replaceable Tungsten probe tips
• Temperature range of -60°C to 300°C
• Minimal contact resistance at the pad-tip junction to reduce heating during measurements, with fewer probe marks
• Prevents against thermal runaway
• Measure devices on wafer at higher currents than ever before
• Small scrub minimizes damage to aluminum pad
• Small footprint – tip fits on a 1 mm pad

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Probe positioners placed inside vacuum chamber
• Short and stable probe arms
• Intuitive, manual drives
• Front loading capability through load door
• Software control of chuck for fast step-and-repeat testing of the entire wafer
• Fast step-and-repeat testing of the whole wafer

• Infinity Probe: best for Al (Si)
• ACP Probe: best for AU (III-Vs)
• |Z| Probe: robust solution (long lifetime)
• RF chuck ±3 μm surface planarity
• Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
• Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
• Automated calibration monitoring

• Combined eye-pieces and CCD camera mount
• 3x zoom and quick lens exchange
• Engraved guides on mmW platen
• Supports broadband, load pull, coax RF and banded waveguide configuration
• Rock-solid mechanical design
• Submicron stage accuracy

• Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
• Online design configuration tool helps you to specify your probe in minutes
• All designs are fully quadrant compatible
• Full solution includes probes, calibration substrates, stations, accessories and software
• Scalable architecture for future needs