Matrox - MOR/2VD/J2K/A Morphis Standard Analog Color/Monochrome PCI FrameGrabber with Two Video Decoders, Integrated JPEG2000 Accelerator and Image Authentication
Mfg: Matrox
Model: MOR/2VD/J2K/A
Condition: Open Box
Description: Morphis Standard Analog Color/Monochrome PCI FrameGrabber with Two Video Decoders, Integrated JPEG2000 Accelerator and Image Authentication
Price: $400.00
Item is in stock and ready to ship.
Quantity in Stock: 1
More Product Information

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Die-to-die stepping time of under 100 ms
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Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology
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Even extreme variations in height, such as the case with warped wafers, can be compensated
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Interfaces to all major analysis instrumentation, optics software and testers
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Access to top side and bottom side of device under test (DUT)
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Highly accurate light measurement
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Test automation out-of-cassette for 24/7 operation

The SafeLaunch-FTR is based on more than 20 years of skills and experience. Such Flight Termination Receivers equip air to air, ground to air and air to ground missiles as well as UAV, target drones and Launch Vehicles. They are qualified under MIL-STD-810F and MIL-STD-461E standards, and comply to RCC-319. The compact and optimized package is consistent in size and weight with the most severe requirements of missile platforms. The electronical design, based on the latest generation of Software Defined Radio (SDR) components, brings to SafeLaunch-FTR high reliabilty and evolutivity.

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Built for extreme environments, our IP69K certified lights are specifically engineered to withstand everything from prolonged liquid immersion to high-pressure steam cleaning.
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Crevice-free design with smooth-bodied surfaces to diminish the chance of material buildup while improving its ease of cleaning.
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Proprietary nickel finish for vastly improved corrosion protection and engineered with thermal management in mind – housing is 11X more thermally conductive than stainless steel.

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Load-lock chamber: Cycle devices 10X faster in a cryogenic environment
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High-density electrical interface at cryogenic temperatures: More pins on the device enables more test structures to be probed with a single cooldown
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Base temperature of < 2K or < 4K with high cooling power: Test devices at the temperatures that matter most for pre- screening and evaluating device performance
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Low vibration: Stable contact with the device under test and enables low noise measurements

Sensors acquisition and recording for troubleshooting is a cumbersome process in a fully furnished or operational aircraft, especially when time and low footprint are key drivers.
This is no more the case with Safran new solution µMA:
- its cylindrical form factor allows easy installation by just requiring a standard clamp used to mount tubes
- its battery power supply and its wireless connectivity removes the need of installing any harness in the aircraft.
All these capabilities are available while providing high measuring performance and harsh environment ruggedized in line with Safran standard solutions.

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Different substrate carriers for wafers up to 200 mm or single dies
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Probe cards and/or up to eight positioners
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Probe positioners placed inside vacuum chamber
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Short and stable probe arms
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Intuitive, manual drives
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Front loading capability through load door
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Software control of chuck for fast step-and-repeat testing of the entire wafer
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Fast step-and-repeat testing of the whole wafer

The RMM Manager utility software offers convenient, user-friendly pre-mission or post-mission access to SC1450-series Removable Memory Modules (RMM) for use with VS-Series video & data recorder/server, in PC/Windows® environment.

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Easy and fast setup of camera views
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Go to Light and Image Settings of the selected camera view with only one mouse click
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Guided workflows for wafer setups, alignment tools and Autonomous Assistants
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Workflow wizard shows task-relevant settings and options only
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Visualizes the progress of setup, alignment and measurement tasks
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Status information always at hand
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Informs the user about events, for example “Successful Alignment”
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Interacts with the user and helps with intelligent solutions
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For very complex wafer structures
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Enables automatic test of multiple devices in each die location before stepping to the next die

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- In Box Items are still boxed up and brand new condition
- Out of Box Items are in used condition
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