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Standex Detect - High Density Matrix Relays
High density matrix reed relays are designed for ultra-compact, high-channel-count applications where space efficiency and performance are critical. With footprints as small as 4.35 × 4.35 mm, these relays enable dense relay arrays, up to 1000 relays on a 12” board, ideal for IC wafer testing, functional PCB test systems, and data acquisition platforms. Featuring low power consumption, fast switching speeds, and optional shielding configurations, they offer reliable performance in demanding environments. Their modular design supports vertical and horizontal stacking, making them a versatile solution for high-density signal routing and matrix switching.
- C Series Reed Relay
- CRF Series Reed Relay
- CRR Series Reed Relay
- M Series Reed Relay
- MF Series Reed Relay
- MFS Series Reed Relay
- MH Series Reed Relay
- MHV Series Reed Relay
- MS Series Reed Relay
- MT Series Reed Relay
- RM05-8A-SP Series Reed Relay
- SHV Series Reed Relay
- SHV-2A Series Reed Relay
- SIL RF Series Reed Relay
- SIL Series Reed Relay
- U Series Reed Relay
- UMS Series Reed Relay
More Product Information
- High speed 60 kHz x3 (Color) or 120 kHz (Mono), and high resolution 28 μm or 900 dpi
- No missing or interpolated pixels
- Exposure control
- RGB colors (Color) or Mono/HDR mode
- Precalibrated pixel size for metrology applications
- Camera Link HS fibre interface
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
Full Featured, Turn-Key Data Acquisition Software
- Intuitive, icon-based setup and control
- Spreadsheet-style channel configuration
- Snapshot display with data export
- Independent sampling rates for each instrument
- Real-time online graphical data analysis
- Client / server architecture with multiple displays
- Synchronization of different data sources
- Detect/process events for close-loop control
- Post-acquisition analysis methods and data playback
- Easily create Virtual/Calculated channels based on physical channel data
- Up to 96 differential channels per full rack mainframe
- Constantly monitor input signals for fault conditions
- Flexible configurations for detecting edges, out-of-bounds conditions and measuring pulse widths
- Inputs can be masked, inverted, and combined to produce interrupts
- Can be used as a time stamp module and as a digital I/O
- Programmable debounce circuitry prevents erroneous readings
- 10 V and 100 V input ranges
- On-board memory stores events with IEEE 1588 timestamps
- Synchronize reading of input states with other scanned analog channels
- High power density in 1U / 2U / 4U / 14U chassis up to 18kVA
- Intuitive touch panel control
- Innovative iX2™ current doubling technology
- Multi-language display for global operation
- Auto paralleling for higher power
- Single phase 1U models and 1 or 3 phase selectable 2U / 4U / 14U models
- Complete avionic test suites (optional)
- ATE version available in 1U, 2U and 4U models
- Standard LXI LAN, USB and RS232, optional GPIB
- Legacy CSW5550 Emulation on the AST6003A1 Model
- Multi-Missions and Applications: Earth Observation (EO), high throughput bi-directional telecommunication, feeder link or Deep Space
- 100% Safran In-House Solution: Compatible with SDA, CCSDS and HPE standards
- Communication Data Rates: 10 to 100 times higher thanks to Cortex Lasercom
- Up to 96 differential channels per full rack mainframe
- Constantly monitor input signals for fault conditions
- Flexible configurations for detecting edges, out-of-bounds conditions and measuring pulse widths
- Inputs can be masked, inverted, and combined to produce interrupts
- Can be used as a time stamp module and as a digital I/O
- Programmable debounce circuitry prevents erroneous readings
- 10 V and 100 V input ranges
- On-board memory stores events with IEEE 1588 timestamps
- Synchronize reading of input states with other scanned analog channels
- DC-40 GHz bandwidth
- 10 ps rise time
- Low insertion and return loss
- 2 mils of tip-to-tip compliance
- High probing angle and clearance
AI, cloud computing, and hyperscalers are accelerating the demand for ultra-high-speed, low-latency connectivity, taking us past Gigabit Ethernet and into the era of Terabit Ethernet.
Teledyne LeCroy’s Terabit Ethernet solutions are engineered to help you take full advantage of this new technology cycle. The Xena Ethernet Test Platform gives developers of semiconductor, NEMs, and hyperscalers the solutions they need to validate next-gen silicon, network devices, and interconnects with confidence.
From Layer 1 signal integrity and Layer 2 traffic generation and analysis, we have the solutions you need to simulate, stress, and certify real-world performance. Support for 224Gbps electrical lanes, advanced FEC, and PCS diagnostics ensure readiness for tomorrow’s networks. Compact, desktop-friendly hardware combined with intuitive software and powerful automation ensure seamless lab-to-production workflows.
Whether you’re path-finding 1.6T or optimizing 800G deployments, Xena can fast-track your innovation cycle. Test smarter, deploy faster and reap the rewards.
Standex Detect
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Standex Detect delivers precision-engineered Reed switches, sensors, relays and emerging technologies that empower innovation across industries. With a legacy rooted in reliability, we help customers solve complex challenges in automation, transportation, energy, and test and measurement; enabling smarter, safer, and more connected systems worldwide.
