Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.
Teledyne DALSA exists for the long term. Our goal is to build upon our 30 year heritage of developing the world's leading high performance digital imaging and semiconductor solutions and to accelerate our level of innovation. We focus on R&D development but also draw on the capabilities available to us as part of a larger organization. We seek to deliver products and technology that are truly innovative so that we can help our customers succeed.
Contact Details
Teledyne DALSA Headquarters
605 McMurray Road, Waterloo, Ontario, Canada N2V 2E9
Phone: 519-886-6000
Fax: 519-886-8023
Imaging/Machine Vision
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Products
Linea SWIR features a cutting-edge InGaAs sensor in a compact package that is suitable for a wide variety of applications. With exceptional responsivity and low noise, this camera allows customers to see their products like never before. Linea SWIR is available as a 1k resolution camera with highly responsive 12.5 µm pixels, or a 512 resolution camera with larger 25 µm pixels.
The brand new Linea2 family takes your system to the new level with impressive performance and value, offering 5x the bandwidth of our Linea family with a 5GigE interface. The Linea2 line scan cameras are powered by our very own Teledyne quadlinear sensor, extending detection capability using RGB + NIR multispectral imaging technology.
- Latest Global and Rolling Shutters sensors from Sony® - from 2 to 12 MP
- USB3 Vision interface
- Compact fully-enclosed design with features needed by modern vision systems
- Provide advanced vision performance while using less power, less space, and fitting increasingly tight industry budgets
- Global shutter and rolling shutter CMOS sensors available
- USB3 Vision
- High sensitivity with both front and back illuminated sensors (BSI)
- Side mounted USB connectors for ease of use in OEM solutions
- High sensitivity with pixel sizes from 2 µm to 3.45 µm
- Windows operating system and Linux SDKs (for embedded vision systems)
- 3-Year Warranty
- High speed 120 kHz, high resolution 28 μm or 900 dpi
- No missing or interpolated pixels
- Exposure control
- Mono/HDR mode
- Precalibrated pixel size for metrology applications
- Camera Link HS fibre interface
- Image acquisition from Camera Link Base camera
- Supports Camera Link® operations up to 85MHz
- Supports 32/64-bit Windows platforms
- Quarter-length PCI Express x1 Board
- Power Over Camera Link® (PoCL) Compliant
- Offers external acquisition control signals on single PCIe x1 slotROHS compliant
- Supports PCI Express Rev 2.0 x4 or higher, backwards compatible with PCIe Rev 1.10 slots
- Up to 512MB of high-speed image memory
- Single slot solution with reconfigurable camera control and general purpose input/outputs
- Long cable lengths at maximum image acquisition rates
- Data forwarding rate for distributed image processing
- Fully supported by Sapera Vision Software SDKs