• The RL121 is characterized as a Small High Dispersion Bright Field ring light. 
• Non-lensed LEDs disperse light at broad angles, providing “soft” lighting for applications that require short working distances. 
• The low-profile design is only .56” (14.2mm) thick, allowing it to be used in space constrained applications. 
• Optional adapter rings are available for camera lens mounting. 
• A wide variety of wavelengths are available from UV to IR. An optional polarizer and/or diffuser may be used to further condition the light output. 
• The RL121 delivers 27kLux at a working distance of 50mm.

• The DF242 is characterized as a Large Low Angle Dark Field ring light. 
• Precisely aimed LEDs provide a very low angle of incidence, radial illumination pattern. 
• A scratch on a sheet of glass is a good example of a defect that can be detected easily with a low-angle dark field illuminator. 
• With a light intensity of 24kLux at a working distance of 1” (25mm), the DF242 is perfect for imaging problems with medium sized fields of view. 
• A 35mm field of view is standard with optional fields of view of 45 and 70mm. 
• Available in a range of wavelengths from UV to IR. 

*Engineered to provide comparable optical characteristics to our previous RL1660.

• The LL167 Series provides a focused line of illumination in a passively cooled design. 
• Only available in White (for color illumination in a similar package refer to our LL137 Series). 
• Provides a high intensity level of 472kLux (working distance of 75mm). 
• Available in pre-engineered sizes from 6” (152mm) to 96” (2438mm) in 6″ increments. 
• A 3″ (75mm) length option is also available. 
• Available intensity control provides illuminance adjustability for every 6″ increment via a 0 – 10v input

AI, cloud computing, and hyperscalers are accelerating the demand for ultra-high-speed, low-latency connectivity, taking us past Gigabit Ethernet and into the era of Terabit Ethernet.

Teledyne LeCroy’s Terabit Ethernet solutions are engineered to help you take full advantage of this new technology cycle. The Xena Ethernet Test Platform gives developers of semiconductor, NEMs, and hyperscalers the solutions they need to validate next-gen silicon, network devices, and interconnects with confidence.

From Layer 1 signal integrity and Layer 2 traffic generation and analysis, we have the solutions you need to simulate, stress, and certify real-world performance. Support for 224Gbps electrical lanes, advanced FEC, and PCS diagnostics ensure readiness for tomorrow’s networks. Compact, desktop-friendly hardware combined with intuitive software and powerful automation ensure seamless lab-to-production workflows.

Whether you’re path-finding 1.6T or optimizing 800G deployments, Xena can fast-track your innovation cycle. Test smarter, deploy faster and reap the rewards.

• 100 MHz, 200 MHz, 350 MHz, 500 MHz and 1 GHz bandwidths 
• Up to 4 GS/s sample rate 
• Long Memory – up to 20 Mpts 
• 10.1” capacitive touch screen display 
• 16 Digital Channel MSO option 
• MAUI - Most Advanced User Interface 
  • Designed for Touch 
  • Built for Simplicity 
  • Made to Solve 
• Advanced Anomaly Detection 
  • Fast Waveform Update 
  • History Mode - Waveform Playback 
  • WaveScan - Search and Find 
• Multi-Instrument Capabilities 
  • Protocol Analysis - Serial Trigger and Decode 
  • Waveform Generation - Built-in Function Generator 
  • Digital Voltmeter and Frequency Counter 
• Future Proof 
  • Upgradeable Bandwidth 
  • Field Upgradable Software and Hardware Options

• The compact design of the DL2230 is easy to integrate into machine vision applications that require a space saving lighting design. 
• The housing of this Extra Small Dome Light has an outer dimension of 2.83” (71.9mm) and an inner, working diameter of 1.95” (49.5mm).

Next Generation Wafer Probing

• Continues the Infinity family’s Industry leading electrical performance
• High temperature capability (175° C +) for automotive device characterization and other applications
• Better tip visibility for enhanced placement accuracy and repeatability
• Improved tip life/durability with solid rhodium contacts
• New tip architecture enables support for narrower pitches (e.g. 25um)
• Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness

Reed Relay Modules integrate multiple high-performance reed relays into compact, ready-to-use packages for efficient signal switching in space-constrained designs. Available in 8-channel configurations, these modules simplify circuit design by combining switching functionality with integrated driver electronics and advanced packaging.

The RM05-8A-SP Series features an 8-pole relay configuration housed in a dual-in-line through-hole package, equipped with MAX4823 integrated drivers and kickback protection—eliminating the need for external activation circuitry and reducing PCB footprint.

• 100 MHz, 200 MHz, 350 MHz, 500 MHz and 1 GHz bandwidths 
• Up to 4 GS/s sample rate 
• Long Memory – up to 20 Mpts 
• 10.1” capacitive touch screen display 
• 16 Digital Channel MSO option 
• MAUI - Most Advanced User Interface 
  • Designed for Touch 
  • Built for Simplicity 
  • Made to Solve 
• Advanced Anomaly Detection 
  • Fast Waveform Update 
  • History Mode - Waveform Playback 
  • WaveScan - Search and Find 
• Multi-Instrument Capabilities 
  • Protocol Analysis - Serial Trigger and Decode 
  • Waveform Generation - Built-in Function Generator 
  • Digital Voltmeter and Frequency Counter 
• Future Proof 
  • Upgradeable Bandwidth 
  • Field Upgradable Software and Hardware Options