High flexibility

• Re-configurable for DC, RF, mmW, FA, WLR and more
• Thermal range: -60˚C to 300˚C available
• Upgrade path to meet your future needs
• Stable and repeatable measurements over a wide thermal range

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• Lithographic thin-film construction
• Excellent crosstalk characteristics
• Non-oxidizing nickel alloy tips
• Innovative force delivery mechanism
• 40GHz, 50GHz, 67GHz, 110GHz and 145GHz connectors available
• GSG, SG, GS, GSGSG, GSSG, SGS configurations
• 50 to 250 µm pitches (other pitches available on request)
• High current version (2 A) available

Advantages

• Superior field confinement reduces unwanted couplings to nearby devices and transmission modes
• Superior measurement accuracy and repeatability
• Small scrub minimizes damage to aluminum pad
• Typical contact resistance < 0. 05 Ω on Al, <0.02Ω on Au
• Save valuable wafer space and reduce pad parasitics by being able to shrink pad geometries to 25 x 35 µ m (best case)

Floating Action Buttons

• Easy and fast setup of camera views
• Go to Light and Image Settings of the selected camera view with only one mouse click

Workflow Wizard

• Guided workflows for wafer setups, alignment tools and Autonomous Assistants
• Workflow wizard shows task-relevant settings and options only
• Wizard settings can be corrected anytime – no need to restart the wizard
• Wizard helps with intelligent solutions in case of error

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Measurement Accuracy

• Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
• Minimize AC and spectral noise with effective shielding capability
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection

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High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

• Ruggedized 
• Flight Qualified 
• Available with vibration-isolated OCXO or CSAC Oscillator options 
• Gigabit Ethernet 
• GNSS, SAASM, or M-Code supported 
• Designed for GPS denied environments

Flexibility

• Different substrate carriers for wafers up to 100 mm or single dies
• Up to six positioners
• Use with liquid nitrogen or helium, depending on the target temperature
• Probing with an open chamber lid possible under atmospheric condition
• Specially designed for laboratory environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)

See "Specifications & Details" tab for more key features

• Full-radius, nickel-plated tungsten needles
• Power bypass inductance: 16 nH
• Supports collinear and non-standard needle configurations
• Support up to a maximum of 12 ceramic blades DC needles / contacts
• Ideal for probing the entire circuit for functional test
• DC probes can provide power or slow logic to circuit under test

• Designed for use with specific Probe Systems
• Tables to suit all facility requirements and applications
• Stable probing, even in submicron range
• Granite platen ensures rigidity and temperature stability
• Can be combined with the Shield Enclosures