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FormFactor - HPD PQ500 - Cryogenic Probe Socket Solution
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
The HPD PQ500, a first-of-its-kind, cryostat-agnostic, high-density RF and DC socket interface, enables researchers and developers to test chips without wire bonding and packaging. The cryogenic probe socket solution can be used at mK temperatures, adaptable to an existing cryostat, accommodating small pitches, and capable of having an extremely high channel capacity.
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More Product Information
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Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
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DC to 110 GHz models available in single and dual line versions
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Low insertion and return loss with ultra-low-loss ( -L ) versions
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Excellent crosstalk characteristics
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Wide operating temperature -65 ° C to + 200 ° C
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Wide range of pitches available, from 50 to 1250 µm
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Individually supported contacts
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Reduced contact (RC) probe tips for small pads
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BeCu tip provides rugged, repeatable contact on gold pads
- Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
- Application flexibility, ideal for use in high frequency applications
- Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
- Suitable for integration with vibration isolating tables
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
PureLine 3 Technology
- Provides an effectively noise free environment around the device under test (DUT)
- First automated probe station to achieve -190dB spectral noise*
- Up to 32x lower noise (1kHz), for improved device characterization and modelling at the 7/5/2 nm technology nodes targeted for 5G and beyond applications
- Eliminates over 97% of the environmental noise experienced in previous probe systems
- Extensive collection of FormFactor patents, electrical design knowledge, and measurement system IP
Plug In and Go
- World’s first probe station with integrated TestCell Power Management (a TestCell is a connected set of equipment, including test software, instruments, probe station, thermal system, and related measurement accessories such as cables and on-wafer probes)
- Eliminates all ground-loop induced TestCell noise
- Low field emissions
- Provides fully managed and filtered AC power to the entire system, prober and instruments
See "Specifications & Details" tab for more key features
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Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
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Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
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Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
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Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
- Full-radius, nickel-plated tungsten needles
- Power bypass inductance: 16 nH
- Supports collinear and non-standard needle configurations
- Support up to a maximum of 12 ceramic blades DC needles / contacts
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
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Combination of DC and RF in a single probe module: One dual probe or a maximum of three RF; a maximum of 9 DC standard (other quantities upon request).
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Utilizes ACP tip design, GSG, GS or SG
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RF tips available from DC to 110 GHz
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Choice of BeCu or tungsten tips
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DC power needles come standard with 100 pF microwave capacitor
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Power bypass inductance: 8 nH
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Maximum DC voltage: 50 V without power bypassing (25 V with standard power bypassing, and component dependent with custom power bypassing)
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Ideal for probing the entire circuit for functional test
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Dual ACP configuration supports differential signaling applications
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DC probes can provide power or slow logic to circuit under test
Flexibility
- Different substrate carriers for wafers up to 100 mm or single dies
- Up to six positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
