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FormFactor - HPD PQ500 - Cryogenic Probe Socket Solution
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
The HPD PQ500, a first-of-its-kind, cryostat-agnostic, high-density RF and DC socket interface, enables researchers and developers to test chips without wire bonding and packaging. The cryogenic probe socket solution can be used at mK temperatures, adaptable to an existing cryostat, accommodating small pitches, and capable of having an extremely high channel capacity.
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Customized Solutions for a Variety of Challenging Applications
We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.
- Substrate material: High-resistivity silicon
- Substrate thickness: 275 µm
- Dielectric constant: 11.8
- Nominal Z0: 50 Ω
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
SlimVue Microscope
- Combined eye-pieces and CCD camera mount
- 3x zoom and quick lens exchange
- Quick lens exchange
- 1 um optical resolution
- Minimized scope footprint
- Fast change from navigation optics to high-resolution optics
- Resolving ‹ 50 μm pads
- Simple integration with any mmW modules
Application Specific Sigma Kits
- Engraved guides on mmW platen
- Supports broadband, load pull, coax RF and banded waveguide configuration
- Optical feedback on platen position (gauge)
- Adaptable to any mmW/sub-THz applications
- Seamless integration with any mmW modules and tuners
- Fast mounting and setup change
THz measurement capability
- Rock-solid mechanical design
- Submicron stage accuracy
- Optical feedback on platen and probe position (gauge)
- Motorized positioner
- <+-1 um separation repeatability
- Micrometer-accurate and repeatable probe placement and overtravel
- Highly-precise and stable THz measurements
- Coaxial and triaxial measurements up to 10,000 V
- High-quality construction with low-noise electrical performance
- Replaceable probe tips in a variety of tip sizes
- Temperature range of of -60°C to 300°C
- Triaxial measurement ensures a much better understanding of device leakage in the off state
- Highly reliable, stable and repeatable measurements
- Integrally designed as part of a complete measurement solution
Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
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Unique Air Coplanar tip design with choice of beryllium copper (BeCu) or tungsten tip material
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DC to 110 GHz models available in single and dual line versions
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Low insertion and return loss with ultra-low-loss ( -L ) versions
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Excellent crosstalk characteristics
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Wide operating temperature -65 ° C to + 200 ° C
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Wide range of pitches available, from 50 to 1250 µm
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Individually supported contacts
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Reduced contact (RC) probe tips for small pads
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BeCu tip provides rugged, repeatable contact on gold pads
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
See "Specifications & Details" tab for more key features
FormFactor, Inc.
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FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
