FormFactor - HPD PQ500 - Cryogenic Probe Socket Solution
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
The HPD PQ500, a first-of-its-kind, cryostat-agnostic, high-density RF and DC socket interface, enables researchers and developers to test chips without wire bonding and packaging. The cryogenic probe socket solution can be used at mK temperatures, adaptable to an existing cryostat, accommodating small pitches, and capable of having an extremely high channel capacity.
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Flexibility
- Application flexibility: Coax, Triax, RF/mmW, High Power, Double Sided
- Temperatures range from -60°C to +300°C
- Surfaces are nickel or gold-plated
- Hybrid chuck design – operation with and without cooling unit
- Field-upgradeable: On-site cold upgrades for all main prober platforms
Highest Efficiency for Reduced Cost of Test
- Up to 25% lower air consumption (CDA) than other systems on the market with no compromise in transition times
- Up to 15% faster transition times than other systems on the market
Flexibility
- Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL
- Re-configurable and upgradable as requirements grow
- Minimizes setup times with no loss in performance or accuracy
- Seamless integration of various measurement instruments
Stability
- Solid station frame
- Built-in vibration-isolation solution for superior vibration attenuation
- Rigid microscope bridge
- Compact and rigid mechanical design
- Highly accurate measurement results
- Incorporates best-known methods
Ease of Use
- Ergonomic and straightforward design for comfortable and easy operation
- Low-profile design
- Simple microscope operation
- Quick and ergonomic change of DUT through pull-out stage
- Minimize training efforts
- Fast time to data
- Convenient operation
T-Wave Waveguide Banded Probes
- Low insertion loss
- Low contact resistance
- 140 GHz – 1.1 THz versions
- Probe pitch as narrow as 25 μm
- Lithographically-defined probe tip
- Nickel contacts
See "Specifications & Details" tab for more key features
Customized Solutions for a Variety of Challenging Applications
We are your partner for challenging applications. Our comprehensive technical and application know-how over all probe system platforms and our expertise for customized products is based on an extensive experience over many years. We offer a special demo support in-house or at the customer, as well as after sales support for complicated setups.
- Probe loss is 3 dB typical between 140 and 200 GHz, S11/S22 15 dB typical
- Reduced unwanted couplings and transmission modes
- Able to shrink pad geometries to 25 x 35 µm (best case)
- Typical contact resistance < 0.05 Ω on Al, < 0.02 Ω on Au
- WR15, WR12, WR10, WR8, WR6, WR4, WR3, and WR2 bands available.
Flexibility
- DC, AC and RF/microwave device characterization, 1/f, WLR, FA and design debug
- Full thermal range of -60°C to +300°C
- Compatible with TopHat or IceShield
- Usage of manual and motorized positioners, probe cards within EMI-shielded environment
- Upgrade path to meet your future needs
- Stable and repeatable measurements over a wide thermal range
High accuracy and repeatability
- Reliable and repeatable contact
- Moisture-free, light-tight and EMI-shielded test environment with MicroChamber® technology
- Advanced EMI-shielding with PureLine and AttoGuard technologies available
- Superior low-leakage and low-noise measurements
- Safe and accurate hands-off testing
- Minimizes settling times for efficient measurements over full thermal range
See "Specifications & Details" tab for more key features
High-voltage/current Probes
- On-wafer power device characterization up to 10,000 V DC / 600 A
- Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
- Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement
- Full-radius, nickel-plated tungsten needles
- Power bypass inductance: 16 nH
- Supports collinear and non-standard needle configurations
- Support up to a maximum of 12 ceramic blades DC needles / contacts
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
- Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
- Application flexibility, ideal for use in high frequency applications
- Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
- Suitable for integration with vibration isolating tables
FormFactor, Inc.
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
Contact Details
FormFactor, Inc. Corporate Headquarters
7005 Southfront Road, Livermore, CA 94551, USA
Phone: 925-290-4000
Test & Measurement
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