FormFactor - HPD PQ500 - Cryogenic Probe Socket Solution
- Tests and validates performance directly on silicon without post-dicing packaging
- Dramatically reduces time to data and shortens development cycles
- Enables high scalability for high volume manufacturing
- Offers flexibility in chip design with full grid probing
The HPD PQ500, a first-of-its-kind, cryostat-agnostic, high-density RF and DC socket interface, enables researchers and developers to test chips without wire bonding and packaging. The cryogenic probe socket solution can be used at mK temperatures, adaptable to an existing cryostat, accommodating small pitches, and capable of having an extremely high channel capacity.
Document
Document
More Product Information
Flexibility
- Different substrate carriers for wafers up to 100 mm or single dies
- Up to six positioners
- Use with liquid nitrogen or helium, depending on the target temperature
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
The LWP series Lightwave Probe enables optical measurements for on-wafer and hybrid photonics devices. It features user replaceable fiber pigtails allowing the probe to be optimized for a variety of light delivery and light collection applications including the characterization of topside illuminated photodiodes, Vertical Cavity Surface Emitting Lasers (VCSELs), hybrid transmitters and receivers, and LEDs.
More than a calibration tool
- Calibration
- Validation
- Measurement
- Analysis
No one supports more VNA’s
- Support of more than 24 of the most common VNA’s
Tool for the novice
- Guided wizards and multimedia tutorials integrated
- Intelligence in setups
See "Specifications & Details" tab for more key features
- Customizable configuration up to 25 contacts: RF, Eye-Pass power, ground, logic
- Lithographically-defined tips allow automated over temperature measurement on pads as small as 30 µm x 50 µm
- Low and repeatable contact resistance on aluminum pads (< 0.05 Ω) ensures accurate results
- Durable probe structure ensures more than 250,000 contacts
- Able to measure from -40°C to +125°C without compromising performance or accuracy of specifications
- Power bypass inductance: 8 nH
- Standard DCQ probes have flat tip needles available in nickel-plated tungsten or BeCu with diameters of 0.75 mil, 1.0 mil and 1.5 mil.
- Supports collinear and non-standard needle configurations
- Up to 16 DC for standard; maximum of 24 DC for custom
- Ideal for probing the entire circuit for functional test
- DC probes can provide power or slow logic to circuit under test
Flexibility
- Different substrate carriers for wafers up to 150 mm or single dies
- Up to six positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Probing with an open chamber lid possible under atmospheric condition
- Specially designed for laboratory environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
See "Specifications & Details" tab for more key features
-
Ease of use – Less experienced operators can perform an RF calibration up to 500 GHz by simply pushing a button. This reduces the need of experienced users full time on each system.
-
Reduced Soak Time – The system will automatically re-align the probes to the pads if they drift from alignment. This reduces test time and increases throughput.
-
Unattended Use – Measurements can be left running over night or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
-
Calibration Monitor and Re-calibration – System will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.
Next Generation Wafer Probing
- Continues the Infinity family’s Industry leading electrical performance
- High temperature capability (175° C +) for automotive device characterization and other applications
- Better tip visibility for enhanced placement accuracy and repeatability
- Improved tip life/durability with solid rhodium contacts
- New tip architecture enables support for narrower pitches (e.g. 25um)
- Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness
-
Best price per contact – typically over one million (1,000,000) touchdowns
-
RF/Microwave signal is shielded and completely air isolated in the probe body
-
Excellent performance in vacuum environments and temperatures as low as 4 K, or as high as 300°C
-
Highest impedance control with perfectly-symmetrical, MEMS-machined coplanar contact structure
-
Probe on any pad material with minimal damage
FormFactor, Inc.
Website
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
We constantly strive to help our customers solve the advanced test and measurement challenges of the broader semiconductor industry. Our focus on customer partnership, innovation, agility and operational excellence allows us to earn sustainable business every day.
