• Device is according to the standard IEC 60811 -501, -507 (Heat elongation test, tensile test)
• Handy, electric device for material tests in laboratories
• Developed to slice samples according to IEC 60811 with a thickness between 0.8 and 2.0 mm (0.04” – 0.08”)
• Especially for hard materials

• Support for the highest speeds available in CoaXPress 2.0 
• Connect to and capture from up to four cameras or combine connections for even higher data rates 
• Simplify cabling with PoCXP support between cameras and vision computer 
• Offload host computer of custom image processing using a field-programmable gate array (FPGA) device 
• Distribute image processing workload across multiple computers through data forwarding capability 
• Synchronize with sensors, encoders, and controllers with ample auxiliary I/Os for each CoaXPress connection 
• Use license fingerprint for Aurora Imaging Library and avoid the need for a separate hardware key 
• Monitor and troubleshoot acquisition performance in detail using Aurora Gecho event-logging tool

• Sample preparation according to IEC 60811-501, -507
• Available with either 100mm (3.93“), 75 mm (2.95“) or 50 mm (2.97“) dumb-bell tool
• For inspecting cable sheaths in laboratories
• As a preparation for further tests
• Applicable for all cable types
• Cutting surface also available individually

The TBST line of shielded tents is designed to suppress interference from ambient noise when carrying out EMC pre-compliance measurements with sizes of 200 cm x 100 cm x 100 cm, 124 cm x 64 cm x 60 cm or 86 cm x 48 cm x 48 cm. The 200 cm and 124 cm tent can accommodate any Tekbox pre-compliance test equipment such as LISNs or TEM-cells. The 86 cm tent will fit the TBTC0/1/2 and all our LISN.

Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

• Solve applications rather than develop underlying tools by leveraging a toolkit with a more than 25-year history of reliable performance
• Tackle applications with utmost confidence using field-proven tools for analyzing, classifying, locating, measuring, reading and verifying
• Base analysis on monochrome and color 2D images as well as 3D profiles, depth maps and point clouds
• Harness the full power of today's hardware through optimizations exploiting SIMD, multi-core CPU and multi-CPU technologies
• Support platforms ranging from smart cameras to HPCs via a single consistent and intuitive API
• Obtain live data in different ways with support for analog, Camera Link, CoaXPress, DisplayPort, GenTL, GigE Vision, HDMI, SDI, Linux and USB3 Vision Interfaces
• Maintain flexibility and choice by way of support for 64-bit Windows and Linux along with Intel and Arm processor architectures
• Leverage available programming know-how with support for C, C++, C+ and CPython languages
• Experiment, prototype and generate program code using Aurora Imaging Library CoPilot interactive environment

Standard Tools

• Allen keys in several length
• Ring wrenches
• Jaw spanners
• Screw drivers
• Assembly pliers

Special Tools

• Adjustor for angle fine anjustment
• Spreading pliers for cable gland inserts
• Monting tool for front- and back lids

Resistance decade box designed for RTD and other resistance-based sensors' simulation. 0.1°C accuracy and 5W load capacity.

• Real resistors switched by relays
• Custom temperature scales
• No residual resistance
• 5 W load capacity
• Six different languages

• Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz
• Online design configuration tool helps you to specify your probe in minutes
• All designs are fully quadrant compatible
• Full solution includes probes, calibration substrates, stations, accessories and software
• Scalable architecture for future needs