Flexibility

• Different substrate carriers for wafers up to 200 mm or single dies
• Probe cards and/or up to eight positioners
• Optional thermal chuck (-60°C to 300°C) and pressure regulation
• Accessories available, such as black bodies and optical motion analysis tools
• Optional upgrade for 300 mm wafer
• Designed for industrial environments
• Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
• Ideal for small structures

See "Specifications & Details" tab for more key features

DC, RF and Optical Probe Positioning for Highest Accuracy Measurements

FormFactor offers a wide variety of manual and motorized probe positioners for any application from DC to terahertz measurements and beyond.

• Light-tight version and EMI-shielded version for low noise and light-sensitive measurements
• Application flexibility, ideal for use in high frequency applications
• Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system
• Suitable for integration with vibration isolating tables

High flexibility

• Re-configurable for DC, RF, mmW, FA, WLR and more
• Thermal range: -60˚C to 300˚C available
• Upgrade path to meet your future needs
• Stable and repeatable measurements over a wide thermal range

See "Specifications & Details" tab for more key features

Measurement Accuracy

• Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
• Minimize AC and spectral noise with effective shielding capability
• Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
• Shortest signal path test integration for accurate, thermally stable, and low-error data collection

See "Specifications & Details" tab for more key features

High-voltage/current Probes

• On-wafer power device characterization up to 10,000 V DC / 600 A
• Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse
• Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

Gold-plated TESLA High-power MicroVac™ Chucks

• Prevent thin wafers from curling and breaking
• Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck
• Accurate Rds(on) measurement at high current
• Accurate UIS measurements at high temperature

• Designed for use with specific Probe Systems
• Tables to suit all facility requirements and applications
• Stable probing, even in submicron range
• Granite platen ensures rigidity and temperature stability
• Can be combined with the Shield Enclosures