Teledyne LeCroy - Probe Adapters
Probe adapters provide simple and easy interface of third-party probes as well as change between the different Teledyne LeCroy Oscilloscope input and cable types (ProBus, ProLink, K/2.92 mm, BNC and SMA). Depending on the adapters, changing between the Teledyne LeCroy Oscilloscope's input type may have an effect on the overall performance of the channel.
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Products |
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TekProbe to ProBus Probe Adapter |
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ProLink to 2.92mm Adapter with Probe Power and Communication Pass Through |
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ProLink to 2.92mm ProAxial Adapter with Probe Power and Communication Pass Through |
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2.92mm to ProBus Adapter with Probe Power and Communication Pass Through |
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2.92mm to ProLink Adapter with Probe Power and Communication Pass Through |
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More Product Information
- Available in 250 MHz and 350 MHz models.
- 2, 4 and 8 channel modes.
- 16-bit vertical resolution.
- Max Sampling rate of 1.2 GS/s.
- Max sinewave frequency of 250 MHz and 350 MHz respectively.
The disruptive and innovative architecture enables to generate/add 8, 16 or 32 channel digital patterns (respectively on 2,4 or 8 analog channels platform) and to operate all models in true arbitrary mode or Direct Digital Synthesis (DDS) mode. Thanks to their high performance, versatile functionality and outstanding usability, the HD T3AWG3K series is the ideal AWG generator for today's and tomorrow's test challenges.
- S-parameters DC to 40 GHz, single-ended and mixed-mode
- Impedance Profile with <1 mm resolution, differential and common mode
- Built-in automatic calibration, no manual setup required
- TDR-powered impedance profiling enables precise de-embedding
- Advanced de-embedding including Time Gating and 2Xthru
- Emulate eye diagrams with equalization and advanced jitter analysis
- Complete NRZ and PAM analysis suite for high-speed serial data
- All-in-one solution for testing, compliance, and diagnostics.
Optimized Measurement Setup
- Multi-purpose SIGMA instrument integration kit
- Shorter cabling and universal chuck connection
- Triax probe with protected guard
- Optimized signal path
- Safe probe tip exchange
- Seamless integration of various analyzers
High Power Chuck
- Triax design for low-leakage measurements up to 3 kV
- Special chuck surface coating
- High-isolation ready
- High-current measurement up to 100 A with lowest contact resistance
- Optional upgrade for 10 kV (coax) operating voltage
- Thin wafer handling capability
Safe Operation
- Arcing protection
- Shield Enclosure with interlock
- Advanced grounding concept
- Maximum protection from high-voltage shock for users and devices
- Common ground protection for all instruments
- EMI/light-tight shielded environment
The ZS Series probes provide high impedance and an extensive set of probe tips and ground accessories to handle a wide range of probing scenarios. The high 1 MΩ input resistance and low 0.9 pF input capacitance means this probe is ideal for all frequencies. The ZS Series probes provide full system bandwidth with all Teledyne LeCroy oscilloscopes with bandwidths of 4 GHz and lower.
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option.
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
- 100 MHz, 200 MHz, 350 MHz, 500 MHz and 1 GHz bandwidths
- Up to 4 GS/s sample rate
- Long Memory – up to 20 Mpts
- 10.1” capacitive touch screen display
- 16 Digital Channel MSO option
- MAUI - Most Advanced User Interface
- Designed for Touch
- Built for Simplicity
- Made to Solve
- Advanced Anomaly Detection
- Fast Waveform Update
- History Mode - Waveform Playback
- WaveScan - Search and Find
- Multi-Instrument Capabilities
- Protocol Analysis - Serial Trigger and Decode
- Waveform Generation - Built-in Function Generator
- Digital Voltmeter and Frequency Counter
- Future Proof
- Upgradeable Bandwidth
- Field Upgradable Software and Hardware Options
OptoVue
- Revolutionary technology advancement for wafer and die-level photonics probing
- Real-time in-situ calibrations
- Singulated die testing
- True die-level edge coupling
- In-situ power measurements
- Advanced calibration technologies
- Enables autonomous measurements
Horizontal Die-Level Edge Coupling
- Highest accuracy in test results
- Lowest coupling loss
- Repeatable measurement results due to exclusive automated fiber-to-facet alignment technology
- Reduced risk of damaging fibers with collision avoidance technology
- Ease of use for less experienced users
- Enables close simulation of real-world conditions with device performance closest to the final application
See "Specifications & Details" tab for more key features
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT​
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features
- Static power analysis - like a dedicated power analyzer
- Dynamic power analysis – capture more information
- Complete test coverage – control system, power section, motor
- Comprehensive mechanical interface
- Harmonics calculation option
- Vector display option (THREEPHASEVECTOR)
- Waveform Transformations option (THREEPHASEdq0)
- 16 Channels with OscilloSYNC™