High voltage differential probes provide high CMRR over a broad frequency range (up to 400 MHz) to simplify the measurement challenges found in noisy, high common-mode power electronics environments. The probe’s design is easy-to-use and enables safe, precise high voltage floating measurements.

• Image acquisition from Camera Link Base camera 
• Supports Camera Link® operations up to 85MHz 
• Supports 32/64-bit Windows platforms 
• Quarter-length PCI Express x1 Board 
• Power Over Camera Link® (PoCL) Compliant 
• Offers external acquisition control signals on single PCIe x1 slotROHS compliant

Next Generation Wafer Probing

• Continues the Infinity family’s Industry leading electrical performance
• High temperature capability (175° C +) for automotive device characterization and other applications
• Better tip visibility for enhanced placement accuracy and repeatability
• Improved tip life/durability with solid rhodium contacts
• New tip architecture enables support for narrower pitches (e.g. 25um)
• Advanced mechanical design combined with small contacts enables probing on smaller pads/pitches and improves durability and robustness

IRIS optical ground stations are built to cater to a wide range of applications (LEO/GEO/Probes), including Earth observation, high throughput bi-directional telecommunications, feeder link, or deep space missions. The IRIS systems leverage the Cortex Lasercom, a globally recognized optical modem that supports various standards such as SDA, CCSDS, and HPE.

Probe adapters provide simple and easy interface of third-party probes as well as change between the different Teledyne LeCroy Oscilloscope input and cable types (ProBus, ProLink, K/2.92 mm, BNC and SMA). Depending on the adapters, changing between the Teledyne LeCroy Oscilloscope's input type may have an effect on the overall performance of the channel.

Floating Action Buttons

• Easy and fast setup of camera views
• Go to Light and Image Settings of the selected camera view with only one mouse click

Workflow Wizard

• Guided workflows for wafer setups, alignment tools and Autonomous Assistants
• Workflow wizard shows task-relevant settings and options only
• Wizard settings can be corrected anytime – no need to restart the wizard
• Wizard helps with intelligent solutions in case of error

See "Specifications & Details" tab for more key features

T-Wave Waveguide Banded Probes

• Low insertion loss
• Low contact resistance
• 140 GHz – 1.1 THz versions
• Probe pitch as narrow as 25 μm
• Lithographically-defined probe tip
• Nickel contacts

See "Specifications & Details" tab for more key features

• Global shutter and rolling shutter CMOS sensors available 
• USB3 Vision 
• High sensitivity with both front and back illuminated sensors (BSI) 
• Side mounted USB connectors for ease of use in OEM solutions 
• High sensitivity with pixel sizes from 2 µm to 3.45 µm 
• Windows operating system and Linux SDKs (for embedded vision systems) 
• 3-Year Warranty