Teledyne LeCroy - Probe Adapters
Probe adapters provide simple and easy interface of third-party probes as well as change between the different Teledyne LeCroy Oscilloscope input and cable types (ProBus, ProLink, K/2.92 mm, BNC and SMA). Depending on the adapters, changing between the Teledyne LeCroy Oscilloscope's input type may have an effect on the overall performance of the channel.
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Products |
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TekProbe to ProBus Probe Adapter |
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ProLink to 2.92mm Adapter with Probe Power and Communication Pass Through |
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ProLink to 2.92mm ProAxial Adapter with Probe Power and Communication Pass Through |
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2.92mm to ProBus Adapter with Probe Power and Communication Pass Through |
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2.92mm to ProLink Adapter with Probe Power and Communication Pass Through |
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More Product Information
Flexibility
- Different substrate carriers for wafers up to 200 mm or single dies
- Probe cards and/or up to eight positioners
- Optional thermal chuck (-60°C to 300°C) and pressure regulation
- Accessories available, such as black bodies and optical motion analysis tools
- Optional upgrade for 300 mm wafer
- Designed for industrial environments
- Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO)
- Ideal for small structures
See "Specifications & Details" tab for more key features
Three Probe Technologies
- Infinity Probe: best for Al (Si)
- ACP Probe: best for AU (III-Vs)
- |Z| Probe: robust solution (long lifetime)
- Precision contact on a wide variety of materials from 26 GHz to 67 GHz
- Accurate results with excellent crosstalk
- Matching cables and substrates included
Precise Contact Solution
- RF chuck ±3 μm surface planarity
- Unique 500 μm platen contact/ separation stroke with ≤± 1 μm accuracy for repeatable contact
- Precision probe alignment
- Consistent contact force and overtravel
- Stable contact performance
WinCal Calibration Software
- Exclusive 1-, 2-, 3-, and 4-port on-wafer calibration algorithms
- Automated calibration monitoring
- Unique measurement & analysis methods
- Accurate S-parameter measurements
- Automatic calibration setup for higher efficiency
- Fast and easy data interpretation and reporting
Measurement Accuracy
- Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies
- Minimize AC and spectral noise with effective shielding capability
- Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal
- Shortest signal path test integration for accurate, thermally stable, and low-error data collection
See "Specifications & Details" tab for more key features
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High power – 66 W at 2.4 GHz and 43 W at 5 GHz
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Extremely low insertion loss of ≤ 0.4 dB (typical) up to 40 GHz
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Excellent contact control and low contact resistance
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High performance on any pad material (Al or Au)
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Longest lifetime – typically one million (1,000,000) touchdowns
- Highest resolution – 12 bits all the time
- More capability – integrates multiple instruments into one
- Comprehensive probe support – supports over 30 probes in 9 categories
- MAUI with OneTouch user interface for intuitive and efficient operation
Differential active probes are like two probes in one. Instead of measuring a test point in relation to a ground point (like single-ended active probes), differential probes measure the difference in voltage of a test point in relation to another test point
- Long cable lengths at maximum image acquisition rates
- Data forwarding rate for distributed image processing
- Fully supported by Sapera Vision Software SDKs
- Allows TekProbe interface level II probes to work with any ProBus-equipped Teledyne LeCroy oscilloscope
- Automatic probe detection
- Provides all necessary power and offset control to the attached probe
- Supports probes up to 4 GHz
- Easy firmware updates
- Wide variety of probes supported including: Preamplifiers, Current Probes, Single-Ended Active Probes and Differential Active Probes
Environmental Control
- Wafer temp verified <4.5 K (with 44 RF probes in contact)
- Magnetic field suppression to <200 nT
- Highly uniform wafer temperature
- Precise thermal stability and control
- Solid construction with granite base enables precision motion and vibration control
See "Specifications & Details" tab for more key features