Flexibility Ideal for a wide range of applications such as RF, mm-Wave and sub-THz characterization, FA, DWC, MEMS, optoelectronic tests and WL Re-configurable and upgradable as requirements grow Minimizes setup times with no loss in performance or accuracy Seamless integration of various measurement instruments Stability Solid station frame Built-in vibration-isolation solution for superior vibration attenuation Rigid microscope bridge Compact and rigid mechanical design Highly accurate measurement results Incorporates best-known methods Ease of Use

Ideal for multiport RF/Microwave and high-speed digital signal testing Mix DC and RF/Microwave signals on one probe Long lifetime – typically over one million (1,000,000) touchdowns Excellent performance in temperatures ranging from 10 K to 200°C Probe on any pad material with no damage

Substrate material: High-resistivity silicon Substrate thickness: 275 µm Dielectric constant: 11.8 Nominal Z0: 50 Ω

Die-to-die stepping time of under 100 ms Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology Even extreme variations in height, such as the case with warped wafers, can be compensated

Flexibility Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Use with liquid nitrogen or helium, depending on the target temperature. Or use of cryo-cooler for dry-cooling option. Accessories available, such as black bodies and optical motion analysis tools Optional upgrade for 300 mm wafer Designed for industrial environments Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO) Ideal for small structures See "Specifications & Details" tab for more key features

Flexibility Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Optional thermal chuck (-60°C to 300°C) and pressure regulation Accessories available, such as black bodies and optical motion analysis tools Optional upgrade for 300 mm wafer Designed for industrial environments Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO) Ideal for small structures See "Specifications & Details" tab for more key features

Flexibility Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Optional thermal chuck (-60°C to 300°C) and pressure regulation Accessories available, such as black bodies and optical motion analysis tools Optional upgrade for 300 mm wafer Designed for industrial environments Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO) Ideal for small structures See "Specifications & Details" tab for more key features

Flexibility Different substrate carriers for wafers up to 100 mm or single dies Up to six positioners Use with liquid nitrogen or helium, depending on the target temperature Probing with an open chamber lid possible under atmospheric condition Specially designed for laboratory environments Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO) See "Specifications & Details" tab for more key features

Flexibility Different substrate carriers for wafers up to 150 mm or single dies Up to six positioners Optional thermal chuck (-60°C to 300°C) and pressure regulation Probing with an open chamber lid possible under atmospheric condition Specially designed for laboratory environments Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO) See "Specifications & Details" tab for more key features

Superior Mechanics Highly stable granite base Independent, coarse movement of X and Y axes, combined with easy fine adjustments Excellent measurement accuracy and repeatability Fast navigation and high-precision probe positioning See "Specifications & Details" tab for more key features

Superior Mechanics Highly stable granite base Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges 1 µm repeatable separation stroke Excellent measurement accuracy and repeatability Fast navigation and high-precision probe positioning See "Specifications & Details" tab for more key features

Flexibility Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Use with liquid nitrogen or helium, depending on the target temperature Accessories available, such as black bodies and optical motion analysis tools Designed for industrial environments Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO) See "Specifications & Details" tab for more key features