Floating Action Buttons Easy and fast setup of camera views Go to Light and Image Settings of the selected camera view with only one mouse click Workflow Wizard Guided workflows for wafer setups, alignment tools and Autonomous Assistants Workflow wizard shows task-relevant settings and options only Wizard settings can be corrected anytime – no need to restart the wizard Wizard helps with intelligent solutions in case of error See "Specifications & Details" tab for more key features

Designed for use with specific Probe Systems Tables to suit all facility requirements and applications Stable probing, even in submicron range Granite platen ensures rigidity and temperature stability Can be combined with the Shield Enclosures

More than a calibration tool Calibration Validation Measurement Analysis No one supports more VNA’s Support of more than 24 of the most common VNA’s Tool for the novice Guided wizards and multimedia tutorials integrated Intelligence in setups See "Specifications & Details" tab for more key features

Full-radius, nickel-plated tungsten needles Power bypass inductance: 16 nH Supports collinear and non-standard needle configurations Support up to a maximum of 12 ceramic blades DC needles / contacts Ideal for probing the entire circuit for functional test DC probes can provide power or slow logic to circuit under test

Cryogenic Temperatures Fully isolated experiment space for true 4K temperatures during probing Cryogenic positioners to provide large travel ranges without warming up the device Integrated helium pot for high temperature stability of the device under test Fully dry cryogen-free cooler eliminates the need for expensive helium circulation systems Rapid cool liquid nitrogen option for faster cool down times See "Specifications & Details" tab for more key features

Environmental Control Wafer temp verified <4.5 K (with 44 RF probes in contact)  Magnetic field suppression to <200 nT​ Highly uniform wafer temperature Precise thermal stability and control Solid construction with granite base enables precision motion and vibration control See "Specifications & Details" tab for more key features

Tests and validates performance directly on silicon without post-dicing packaging Dramatically reduces time to data and shortens development cycles Enables high scalability for high volume manufacturing Offers flexibility in chip design with full grid probing