Flexibility Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Optional thermal chuck (-60°C to 300°C) and pressure regulation Accessories available, such as black bodies and optical motion analysis tools Optional upgrade for 300 mm wafer Designed for industrial environments Covers wide range of measurements (I-V, C-V, RF, MEMS, OPTO) Ideal for small structures See "Specifications & Details" tab for more key features

DC, RF and Optical Probe Positioning for Highest Accuracy Measurements FormFactor offers a wide variety of manual and motorized probe positioners for any application from DC to terahertz measurements and beyond.

Accommodates a combination of up to four Cascade Microtech probes Configurable for mixed-signal RF/mmW testing Quick and easy repairs to be performed in the field, by simply replacing individual probes Adaptable to new device layouts by exchanging individual probes

Choice of Series resistance or Termination (signal line to ground) Use of High Performance RF Resistors Choice of Resistor values available Choice of body styles, Infinity, ACP or FPC Can help to stabilize oscillations in high-gain devices Impedance match to low dynamic resistance laser diodes Custom configured for your application

Light-tight version and EMI-shielded version for low noise and light-sensitive measurements Application flexibility, ideal for use in high frequency applications Sized to accommodate thermal chucks, laser cutter, and video equipment on the probe system Suitable for integration with vibration isolating tables

High flexibility Re-configurable for DC, RF, mmW, FA, WLR and more Thermal range: -60˚C to 300˚C available Upgrade path to meet your future needs Stable and repeatable measurements over a wide thermal range See "Specifications & Details" tab for more key features

Measurement Accuracy Best solution for high accuracy IV/CV, low-noise and 1/f measurements with PureLine, AutoGuard and next generation MicroChamber technologies Minimize AC and spectral noise with effective shielding capability Achieve unsurpassed RF/mmW measurement and calibration accuracy with integrated RF tools and WinCal Shortest signal path test integration for accurate, thermally stable, and low-error data collection See "Specifications & Details" tab for more key features

T-Wave Waveguide Banded Probes Low insertion loss Low contact resistance 140 GHz – 1.1 THz versions Probe pitch as narrow as 25 μm Lithographically-defined probe tip Nickel contacts See "Specifications & Details" tab for more key features

High-voltage/current Probes On-wafer power device characterization up to 10,000 V DC / 600 A Reduced probe and device destruction at high currents up to 20 A DC and 300 A pulse Increased isolation resistance and dielectric strength to provide full triaxial capability at high voltage (3,000 V) for low-leakage measurement

Gold-plated TESLA High-power MicroVac™ Chucks Prevent thin wafers from curling and breaking Advanced MicroVac chuck surface for minimum contact resistance between wafer and chuck Accurate Rds(on) measurement at high current Accurate UIS measurements at high temperature

Enables coaxial measurements up to 10,000 V and 300 A pulsed (600 A in a parallel configuration) with a single touchdown Even distribution of high current with innovative multi-fingertip design Compatible with TESLA 200/300 mm power device characterization system Reduced measurement time by testing both high-voltage and high-current conditions with a single touchdown Accurate characterization of a wide range of pad sizes and test currents, with minimum pad damage and contact resistance Safe, reliable and repeatable high-current/voltage measurements over a wide temperature range (from -55°C to +300°C)

Up to 12 contacts; any contact can be DC, Power, Logic to 500 MHz,or RF to 20 GHz Online design configuration tool helps you to specify your probe in minutes All designs are fully quadrant compatible Full solution includes probes, calibration substrates, stations, accessories and software Scalable architecture for future needs