Ideal for multiport RF/Microwave and high-speed digital signal testing Mix DC and RF/Microwave signals on one probe Long lifetime – typically over one million (1,000,000) touchdowns Excellent performance in temperatures ranging from 10 K to 200°C

Substrate material: High-resistivity silicon Substrate thickness: 275 µm Dielectric constant: 11.8 Nominal Z0: 50 Ω

Die-to-die stepping time of under 100 ms Up to 20 dies/sec (70,000 dies/hour) with MultiDie Testing technology Even extreme variations in height, such as the case with warped wafers, can be compensated

Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Ice- and condensation-free probing down to 77 K (liquid nitrogen) or below 20 K (liquid helium)

Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Probe positioners placed inside vacuum chamber Short and stable probe arms

Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Probe positioners placed inside vacuum chamber Short and stable probe arms

Different substrate carriers for wafers up to 100 mm or single dies Up to six positioners Independently cooled cold shield Probe positioners placed inside vacuum chamber

Different substrate carriers for wafers up to 150 mm or single dies Up to six positioners Probe positioners placed inside vacuum chamber Short and stable probe arms

Highly stable granite base Independent, coarse movement of X and Y axes, combined with easy fine adjustments Re-configurable for DC, RF, mmW, FA, WLR and more Full thermal range of -60°C to +300°C

Highly stable granite base Independent, coarse movement of X and Y axes, combined with easy fine adjustments down to submicron ranges Re-configurable for DC, RF, mmW, FA, WLR and more

Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Independently cooled cold shield Probe positioners placed inside vacuum chamber

Different substrate carriers for wafers up to 200 mm or single dies Probe cards and/or up to eight positioners Probe positioners placed inside vacuum chamber Short and stable probe arms